SynopsisThe Gas Diffusion Layer Substrate (Gdl) Used In Fuel Cells Is Responsible For Supplying Hydrogen And Air Electrodes (Catalysts) In The Fuel, Electrons Generated By Chemical Reactions In The Electrodes, Moisture Retention Of The Electrolyte Membrane, And Discha.....
SynopsisTitanium fiber felt is made by a special laying process and a special ultra-high temperature vacuum sintering process. Compared with titanium powder sintered plate, Ti fiber felt has an excellent three-dimensional network, porous structure, high porosity, larg.....
SynopsisRoofing Primers are preparatory coatings applied to roofing surfaces before the application of adhesives or other roofing materials. These primers improve the adhesion of subsequent layers, seal porous surfaces, and create a stable foundation for roofing insta.....
SynopsisDeinking agents is to reduce the waste paper and printing ink of surface tension and produce saponification, wetting, penetration, emulsification, decentralized and bleaching Mosaic. The global Deinking Agents market was valued at US$ million in 2023 and.....
SynopsisThe global Automotive Body Repair Adhesives market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. Automotive is a key driver of this industry. According to d.....
SynopsisThe global Sulfur Spiking Agents market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Sulfur Spiking Agents is estimated to increa.....
SynopsisThe global Pentane 70 & 30 market was valued at US$ 15 million in 2023 and is anticipated to reach US$ 21 million by 2030, witnessing a CAGR of 4.7% during the forecast period 2024-2030. North American market for Pentane 70 & 30 is estimated to increase .....
SynopsisPA hot-melt adhesive mesh is one of the materials of hot-melt adhesive mesh. It is a solid glue. It will be sticky on both sides after being heated to a specific temperature by professional pressing equipment. The use is when the glue is attached to various ma.....
Loose fill packaging fill empty spaces in the box and prevent products from moving during transportation. Global Loose Fill Polystyrene Packaging market is projected to reach US$ 367.2 million in 2029, increasing from US$ 303.3 million in 2022, with the CAGR of 2.3% du.....
SynopsisSemiconductor precursors are the core manufacturing materials for semiconductor thin film deposition processes, with high barriers and high growth. They are used in semiconductor manufacturing processes to carry target elements, gaseous or volatile liquid, che.....
