SynopsisEthyl Vinyl Acetate Foam is a commonly used foam material. It has good blending properties with fillers, good coloring and molding processability. Ethyl Vinyl Acetate Foam is characterized by good flexibility, rubber-like elasticity, good flexibility at .....
SynopsisAerogel Insulation Blanket is a flexible, nanoporous aerogel blanket insulation that reduces energy loss whilst conserving interior space in residential and commercial building applications and is typically applied for complete coverage in walls, floors and ro.....
SynopsisThe global Electronic Grade Microsilica market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Electronic Grade Microsilica is estim.....
SynopsisAcrylic adhesives are adhesives manufactured using methacrylate and acrylate monomers as a major feedstock. Polymer mixtures are dissolved in methacrylate or acrylate monomer and the adhesive is produced as two different components. The acrylic adhesives.....
SynopsisThe global Iodine Contrast Agent API market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. The global pharmaceutical market is 1475 billion USD in 2022, grow.....
Synopsis The global Drilling Mud Bentonite market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. Drilling mud bentonite is a type of clay that is used as a.....
SynopsisGlobal Thermal Gap Fillers key players include Dow, Parker, Fujipoly, etc. Global top 3 manufacturers hold a share over 22%. China is the largest market, with a share about 37%, followed by Europe and North America, both have a share about 38 percent.
SynopsisWafer level package epoxy molding compound is a specialized epoxy resin used in the packaging of semiconductor devices directly at the wafer level. This process is commonly known as wafer-level packaging (WLP). The global Wafer Level Package Epoxy Moldin.....
SynopsisThe global Electronic Cloth and Electronic Yarns market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The Global Info Research report includes an overview of the.....
SynopsisHydrocortisone butyrate is a topical corticosteroid use to treat a variety of dermatological conditions. It acts as an antiinflammatory, antiproliferative and immunosuppresive agent. The global Hydrocortisone 17-Butyrate market was valued at US$ million .....
