SynopsisThe global Perfluorinated Elastomers (FFKM) market was valued at US$ 396 million in 2023 and is anticipated to reach US$ 543.7 million by 2030, witnessing a CAGR of 4.7% during the forecast period 2024-2030. There are several driving factors that make pe.....
SynopsisFire resistant polyurethane foam is a flame retardant based polyurethane expanding foam, which sets in a solid form by using moisture present in the atmosphere. Market Analysis and Insights: Global Fireproof Polyurethane Foam Market Due to the COVI.....
SynopsisShrink Wrap serves as a superior alternative to tarping because it provides your boat or equipment with a glove-like cover that won't shift or chafe. A taut shrink wrap cover is achieved by applying heat to your installed cover using a propane heat gun. .....
SynopsisMarket Analysis and Insights: Global Silver Impregnated Graphite (SIG) Contacts Market Due to the COVID-19 pandemic, the global Silver Impregnated Graphite (SIG) Contacts market size is estimated to be worth US$ million in 2022 and is forecast to a read.....
SynopsisPressure-sensitive adhesive (PSA, self-adhesive, self-stick adhesive) is a type of nonreactive adhesive which forms a bond when pressure is applied to bond the adhesive with a surface. No solvent, water, or heat is needed to activate the adhesive. It is used i.....
Synopsis Aerospace grade aramid fiber honeycomb exhibits outstanding flammability properties. It is manufactured from Meta-Aramid paper and coated with a heat resistant phenolic resin. Market Analysis and Insights: Global Aerospace Grade Ar.....
SynopsisThe global Electrical Fiberglass for PCB market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. According to our Semiconductor Research Center, the global tot.....
Synopsis The global Chelating Resin for Removing Heavy Metals market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. Chelating resin is a highly efficient a.....
SynopsisSemiconductor underfill is an epoxy-based material used to fill the gap between a semiconductor die and its package substrate to enhance mechanical and thermal reliability. The global Semiconductor Underfill market was valued at US$ 153 million in 2023 a.....
SynopsisThe global Dental Abrasive Silica market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The Global Info Research report includes an overview of the development of.....