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Chemicals Market Reports

SynopsisThe global Perfluorinated Elastomers (FFKM) market was valued at US$ 396 million in 2023 and is anticipated to reach US$ 543.7 million by 2030, witnessing a CAGR of 4.7% during the forecast period 2024-2030. There are several driving factors that make pe.....

No Of Pages : 98
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisFire resistant polyurethane foam is a flame retardant based polyurethane expanding foam, which sets in a solid form by using moisture present in the atmosphere. Market Analysis and Insights: Global Fireproof Polyurethane Foam Market Due to the COVI.....

No Of Pages : 106
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisShrink Wrap serves as a superior alternative to tarping because it provides your boat or equipment with a glove-like cover that won't shift or chafe. A taut shrink wrap cover is achieved by applying heat to your installed cover using a propane heat gun. .....

No Of Pages : 101
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisMarket Analysis and Insights: Global Silver Impregnated Graphite (SIG) Contacts Market Due to the COVID-19 pandemic, the global Silver Impregnated Graphite (SIG) Contacts market size is estimated to be worth US$ million in 2022 and is forecast to a read.....

No Of Pages : 94
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisPressure-sensitive adhesive (PSA, self-adhesive, self-stick adhesive) is a type of nonreactive adhesive which forms a bond when pressure is applied to bond the adhesive with a surface. No solvent, water, or heat is needed to activate the adhesive. It is used i.....

No Of Pages : 85
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis Aerospace grade aramid fiber honeycomb exhibits outstanding flammability properties. It is manufactured from Meta-Aramid paper and coated with a heat resistant phenolic resin. Market Analysis and Insights: Global Aerospace Grade Ar.....

No Of Pages : 94
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisThe global Electrical Fiberglass for PCB market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. According to our Semiconductor Research Center, the global tot.....

No Of Pages : 104
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisSemiconductor underfill is an epoxy-based material used to fill the gap between a semiconductor die and its package substrate to enhance mechanical and thermal reliability. The global Semiconductor Underfill market was valued at US$ 153 million in 2023 a.....

No Of Pages : 103
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00