SynopsisEthylenebistetrabromophthalimide (BT93W) is a unique white-colored additive that combines stable,aromatic bromine with an imide structure. The global Ethylenebistetrabromophthalimide (BT93W) market was valued at US$ 31 million in 2023 and is anticipated .....
SynopsisGlass fiber is an inorganic non-metallic material made of natural ores such as pyrophyllite. It has the characteristics of light weight and high strength. It is the most commonly used reinforcement material in the composite materials used in the manufacture of.....
SynopsisThe global Thermal Spray Coating Materials market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Thermal Spray Coating Mater.....
SynopsisExtruded polystyrene foam (XPS) consists of closed cells, offers improved surface roughness and higher stiffness and reduced thermal conductivity. The density range is about 28–45 kg/m3. Extruded polystyrene material is also used in crafts and model buil.....
SynopsisThe global Reinforced Truss Floor Deck market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while e.....
SynopsisThe global High Purity Niobium Product market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for High Purity Niobium Product is estimat.....
SynopsisFeNi soft magnetic powder is a type of powder made from a mixture of iron and nickel. It is commonly used in the production of soft magnetic materials that have high magnetic permeability and low coercivity. FeNi soft magnetic powder is known for its excellent.....
SynopsisThe global OLED Intermediates and Front End Materials market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for OLED Intermediates and .....
SynopsisDie bonding paste, also known as die attach paste or die attach adhesive, is a specialized material used in semiconductor packaging to bond semiconductor chips (or dies) to their substrate or package. This process is a critical step in semiconductor manufactur.....
Synopsis The global Polymorphic High-Nickel NCM Ternary Precursor market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The polymorphic high-nickel NCM ter.....
