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Chemicals Market Reports

SynopsisFRP rebars are used widely in highways, bridges, & buildings application, as their superior strength-to weight ratio significantly exceeds that of any traditional rebar. The major players in global FRP Rebar market include Hughes Brothers, Schoeck, Armas.....

No Of Pages : 139
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisPolyvinylidene fluoride (PVDF), a synthetic resin produced by the polymerization of vinylidene fluoride (CH2=CF2). A tough plastic that is resistant to flame, electricity, and attack by most chemicals, PVDF is injection-molded into bottles for the chemical ind.....

No Of Pages : 110
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisSalicylic acid is a lipophilic monohydroxybenzoic acid, a type of phenolic acid, and a beta hydroxy acid (BHA). Global Salicylic Acid and Alpha Hydroxy Acid for Cosmetic key players include Seqens, Shandong Xinhua Pharmaceutical, Hebei Jingye Medical Tec.....

No Of Pages : 104
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisA Geonet Drainage Composite is a material used in construction projects to facilitate drainage of water and gases. It is typically made of a three-dimensional plastic core, often high-density polyethylene (HDPE), with a non-woven geotextile fabric bonded to on.....

No Of Pages : 117
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisThe global Silicone-free Food Antifoaming Agents market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were consider.....

No Of Pages : 108
Publication Date: Mar, 2025
Single User Price : US$ 3,480.00

SynopsisThe global Tetrodotoxin market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Tetrodotoxin is estimated to increase from $ million .....

No Of Pages : 85
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisWire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electroni.....

No Of Pages : 92
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00