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SynopsisA perforating gun for perforating earth formations, primarily in oil and gas wells. The gun includes a straight metal tube in which explosive jet charges are carried. Global Perforating Gun key players include Schlumberger, Core Laboratories, Halliburton.....

No Of Pages : 113
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisGlobal High Precision MEMS Inclinometer market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine W.....

No Of Pages : 121
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisCarbon black deep processing is the process of making the poorly flowing and easily flown powdered carbon black into granules in the granulator, relying on its continuous rotation. The granulated carbon black is easy to transport and use, and also reduces the .....

No Of Pages : 112
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisFlight safety camera systems are a kind of camera system which installed in the cabin of the airplane or out to help pilots to ensure safety in the flight. Flight safety camera systems include CDSS (Cockpit Door Surveillance System), Cabin Surveillance System,.....

No Of Pages : 103
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisDigital RF Memory is an electronic method for digitally capturing and retransmitting RF signals The global Digital RF Memory market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forec.....

No Of Pages : 86
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisThe global Wafer Metrology System market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. Following a strong growth of 26.2 percent in the year 2021, WSTS revi.....

No Of Pages : 92
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisBall Bonder is one sort of semiconductor manufacturing machine, ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a chip and the outside world as part of semiconductor device fabrication. K.....

No Of Pages : 126
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00