SynopsisFiber Fused Taper Coupler is to bundle two or more optical fibers together, and then melt and stretch them on the tapering machine, and monitor the change of splitting ratio in real time. After the splitting ratio meets the requirements, the melting and stretc.....
SynopsisThe global Hermetic Fiber Optic Feedthroughs market was valued at US$ 735 million in 2023 and is anticipated to reach US$ 1230.3 million by 2030, witnessing a CAGR of 8.1% during the forecast period 2024-2030. North American market for Hermetic Fiber Opt.....
SynopsisThe global Metal Mining Support Activities market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered whi.....
SynopsisThe global Battery Management System Chip market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. The global market for semiconductor was estimated at US$ 579 .....
SynopsisThe global market for FOUP & FOSB Cleaner was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period. North American market for FOUP & FOSB Cleaner is estim.....
SynopsisDye penetrant inspection (DP), also called liquid penetrate inspection (LPI) or penetrant testing (PT), is a widely applied and low-cost inspection method used to check surface-breaking defects in all non-porous materials (metals, plastics, or ceramics). The p.....
Synopsis The global Silicon Parts for Etching market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were.....
SynopsisKey value databases save data as associative arrays where a single value is associated together with a key used as a signifier for the value. No two keys necessarily need the same structure, so data is simply accumulated into a single, large table. The g.....
SynopsisIn integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in mult.....
SynopsisThe full-link big data solution is a comprehensive data processing and analysis solution designed to help enterprises achieve efficient data management and value mining from data collection, storage, cleaning, processing to analysis and application. By integra.....
