SynopsisThe global Fraud Detection and Prevention Software & Tools market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Fraud Detection and Prevention Software & .....
SynopsisThe global Overall Equipment Effectiveness Software market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Overall Equipment Effectiveness Software in vario.....
SynopsisThe global Cold Forming Services market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Cold Forming Services is estimated to.....
SynopsisThe global Marine VHF Two-Way Radio market was valued at US$ 125.2 million in 2023 and is anticipated to reach US$ 163.7 million by 2030, witnessing a CAGR of 4.0% during the forecast period 2024-2030. The Marine VHF Two-Way Radio market, which involves .....
Synopsis The global Duplex Scanners market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Duplex Scanners is estimated to.....
SynopsisPolicy-based management is an administrative approach that is used to simplify the management of a given endeavor by establishing policies to deal with situations that are likely to occur. The global Policy Management in Telecom market size is expected t.....
SynopsisThis allowed Wi-Fi routers and devices to simultaneously transmit or receive multiple streams of data between each other, increasing the speed of the connection. The global SU-MIMO Wi-Fi Chipset market size is expected to reach US$ million by 2029, growi.....
SynopsisMultilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bonded together by PP(prepreg), Multilayer PCB is one of the most complex types in printed circuit .....
SynopsisIC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC co.....
SynopsisThe global Employee Online Attendance Tracking System market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Employee Online Attenda.....
