SynopsisThe global Computational Fluid Dynamics Simulation Software market was valued at US$ 704.5 million in 2023 and is anticipated to reach US$ 1448.2 million by 2030, witnessing a CAGR of 11.0% during the forecast period 2024-2030. North American market for .....
SynopsisSemiconductor temperature control equipment is a type of equipment specially used in the semiconductor manufacturing process. It is mainly used to accurately control the temperature of the reaction chamber to meet the temperature control needs of the semicondu.....
SynopsisProduct Carbon Footprint Calculator is to measure the environmental impact of your products or services, taking into account all stages of a product’s life cycle. It is a methodological framework that allows you to evaluate how your product design and activiti.....
SynopsisThe global Semiconductor O-Rings and Seals market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. The global market for semiconductor was estimated at US$ 579.....
SynopsisThe global Air Taxi Service market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating m.....
SynopsisThe global Motorhome and Campervan Hire market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The Global Info Research report includes an overview of the developm.....
Synopsis The global Electric Vehicle EV High Voltage DC Contactor market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Rus.....
SynopsisAbrasive cleaning involve using abrasive materials to remove surface contaminants, coatings, or unwanted layers from substrates. The choice of abrasive cleaning method depends on factors such as the type of substrate, the nature of the contaminants, and the de.....
SynopsisMicroelectronics package housing refers to the external enclosure or casing used to protect and house microelectronic devices. Microelectronics packaging involves the process of encapsulating microelectronic components, such as integrated circuits (ICs), senso.....
SynopsisThe global Align Key Points market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030. North American market for Align Key Points is estimated to increase from $ m.....