SynopsisThe global Optical Frequency Combs (OFC) market was valued at US$ 46.33 million in 2023 and is anticipated to reach US$ 69.89 million by 2030, witnessing a CAGR of 6.28% during the forecast period 2024-2030. North American market for Optical Frequency Co.....
Synopsis Hall-Effect Current Sensor based on the principle of magnetic balance hall, passes into current Ic from the control current end of hall element, and applies magnetic field with magnetic field intensity B to the normal direction of hall element p.....
SynopsisSaaS management platforms (SMPs) allow IT operations administrators to manage the day-to-day operations for Microsoft Office 365, Google G Suite and other frequently used SaaS applications. SMPs allow IT administrators to manage application policies, take corr.....
SynopsisThe global Mobile Business Process Management (BPM) market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Mobile Business Process Management (BPM) in vario.....
SynopsisSpecific Absorption Rate Test System is designed to measure electromagnetic fields and calculated SAR over a customer-specified frequency range. The global Specific Absorption Rate Test System market size is expected to reach US$ million by 2029, growing.....
SynopsisFM transmitter is the short of FM broadcast transmitter, mainly used for launch the voice and music programs of FM broadcast station by wireless methods. Currently, the major demand region are Africa, South America, Southeast Asia and South Asia other economic.....
SynopsisThe global Dynamometer Product & Services market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Dynamometer Product & Services in various end use industrie.....
SynopsisThe isolated half-bridge driver's function is to drive the gates of high- and low-side N-channel MOSFETs (or IGBTs) with a low output impedance to reduce the conduction losses, and a fast switching time to reduce the switching losses. The global Half Bri.....
SynopsisCurrently, 3D Packaging using Through Silicon Via technology (3D TSV) is one of the hottest topics in the semiconductor ecosystem. 3D TSV is vertical electrical connection (via) passing completely through a silicon wafer or die. These short vertical interconne.....
SynopsisThe global Quartz Substrate market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating m.....
