SynopsisThe global LED Driver Module market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for LED Driver Module is estimated to increase from .....
SynopsisMulti-core photonic crystal fiber is a special fiber with multiple cores in its cross-section, each core is surrounded by periodically arranged air holes. This structure can realize the simultaneous transmission of multiple optical signals and improve the info.....
SynopsisThe global Edge AI Modules market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. China and the United States are two leaders in AI industry. On the AI 100 li.....
SynopsisThe global Home Theater Speakers market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Home Theater Speakers is estimated to increa.....
SynopsisThe global Silicon Focus Rings market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Silicon Focus Rings is estimated to increase f.....
SynopsisThe Machine Learning Chips market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report seg.....
SynopsisThis report mainly focus on passivation services market.Passivation services can ensure that metallic materials are properly treated to avoid corrosion and other defects. An important part of metals processing, passivation helps extend the life and integrity o.....
SynopsisWafer Level Packaging (WLP) is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scale-packaging technology where many IC's can be stacked together using suitable interconnect processes (like TSV or metal bumps) followed by enc.....
SynopsisThe global Elevator Door Operator Controlling Board market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. According to data released by the National Bureau o.....
SynopsisThe global Web Performance Testing market was valued at US$ 885 million in 2023 and is anticipated to reach US$ 2664.3 million by 2030, witnessing a CAGR of 17.3% during the forecast period 2024-2030. North American market for Web Performance Testing is .....
