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IT & Electronics Market Reports

SynopsisPremise Cables are the wiring that is used to connect LAN and phone equipment within a building. It is made up of vertical and horizontal cable that runs from a central location such as a server room throughout the building to the individual desktops. Th.....

No Of Pages : 126
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisIn a radio receiver circuit, the RF front end is a generic term for all the circuitry between the antenna up to and including the mixer stage. The global RF Front End IC market size is expected to reach US$ million by 2029, growing at a CAGR of % from 20.....

No Of Pages : 100
Publication Date: Mar, 2025
Single User Price : US$ 3,350.00

SynopsisThe global Managed Live Chat Software market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Managed Live Chat Software is estimated.....

No Of Pages : 104
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisThe global Next Generation In-Vehicle Networking (IVN) market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Next Generation In-Vehicle Networking (IVN) in.....

No Of Pages : 114
Publication Date: Mar, 2025
Single User Price : US$ 3,350.00

Synopsis The brushless DC motor consists of a motor body and a driver, and is a typical mechatronic product. A brushless motor refers to a motor without brushes and commutators (or slip rings) Market Analysis and Insights: Global Single.....

No Of Pages : 87
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisThe isolated half-bridge driver's function is to drive the gates of high- and low-side N-channel MOSFETs (or IGBTs) with a low output impedance to reduce the conduction losses, and a fast switching time to reduce the switching losses. The global Half Bri.....

No Of Pages : 97
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisCurrently, 3D Packaging using Through Silicon Via technology (3D TSV) is one of the hottest topics in the semiconductor ecosystem. 3D TSV is vertical electrical connection (via) passing completely through a silicon wafer or die. These short vertical interconne.....

No Of Pages : 91
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisThe global Circuit Imaging Materials market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Circuit Imaging Materials is estimated t.....

No Of Pages : 86
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisThe global Smart Warehouse System market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Smart Warehouse System is estimated to incr.....

No Of Pages : 81
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisMillimeter wave amplifier is an electronic device used to amplify signals in the millimeter wave frequency band. The millimeter wave frequency band usually refers to the frequency range of 30 GHz to 300 GHz, corresponding to a wavelength range of 1 millimeter .....

No Of Pages : 98
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00