SynopsisArray Processors perform calculations on large amounts of data. Therefore, they are used to increase the performance of the computer. The global Array Processor market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 202.....
SynopsisGlobal DSA Connector market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to gre.....
SynopsisHigh-productivity application platform as a service (hpaPaaS) solutions provide services for declarative, model-driven application design and development, and simplified one-button deployments. They typically create metadata and interpret that metadata at runt.....
Synopsis The global Infrared Quantum Cascade Laser market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The infrared quantum cascade laser is a special ty.....
SynopsisThe global Smart Automotive Illumination System market was valued at US$ 313 million in 2023 and is anticipated to reach US$ 839.6 million by 2030, witnessing a CAGR of 15.0% during the forecast period 2024-2030. With the continuous development of digiti.....
Synopsis The global Waste Recycling into Power Generation market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine Wa.....
SynopsisThe global USB Power Delivery ICs market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. Following a strong growth of 26.2 percent in the year 2021, WSTS revi.....
SynopsisHigh Bandwidth Memory (HBM) is a high-performance RAM interface for 3D-stacked DRAM from AMD and Hynix. It is to be used in conjunction with high-performance graphics accelerators and network devices. Hybrid Memory Cube (HMC) is a high-performance RAM interfac.....
SynopsisThe temperature requirements of the reliability indicators of industrial chips exceed the commercial level and meet the requirements of industrial applications. Industrial chip is the basic part of the whole industrial architecture. It solves the basic problem.....
SynopsisSystem integration is the process of integrating complex elements such as hardware equipment, software and IT service into one system and implementing all functions. The global Systems Integration Services market size is expected to reach US$ million by .....
