SynopsisThe global In-Car Voice System market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for In-Car Voice System is estimated to increase f.....
SynopsisHigh electron mobility transistors (HEMTs) are transistors that use a 2-dimensional electron gas (2DEG) that is created by a junction between two materials with different band gaps. Gallium nitride (GaN) based HEMTs feature faster switching speed, higher therm.....
SynopsisThe global Access Management & Authentication market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Access Management & Authenticat.....
SynopsisA DataOps platform automates the data delivery process and enables continuous data delivery. API-driven automation integrates data delivery into workflows across hybrid and multi-cloud environments, from structured, unstructured, SQL, NoSQL, and cloud-native d.....
SynopsisThe global Driverless Taxi (Robotaxis) Services market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Driverless Taxi (Robotaxis) S.....
SynopsisThe global Strain Amplifier market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Strain Amplifier is estimated to increase from $ .....
SynopsisThe global Tensor Processing Unit (TPU) market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Tensor Processing Unit (TPU) is estim.....
SynopsisA ball grid array (BGA) socket is designed for mounting package boards that use a grid of solder balls, known as BGAs. Unlike the pin grid array (PGA) type, where lattice-shaped pins in a grid are inserted into a socket, BGA package boards are typically mounte.....
SynopsisThe global M.2 Interface Solid State Drive market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for M.2 Interface Solid State Drive is.....
SynopsisThick film substrates are typically made from thick film ceramic materials that act as insulators and thick film metal pastes that act as conductors. This report studies thick film multilayer ceramic substrates. The global Thick Film Multilayer Ceramic S.....
