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IT & Electronics Market Reports

Synopsis The global AI Infrastructure market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. As an important force driving a new round of scientific.....

No Of Pages : 87
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisA fiber media converter, also known as fiber transceiver or Ethernet media converter is a networking device that allows connecting two different media types, such as a twisted pair or coaxial cable to a fiber-optic cable. This type of device is very important .....

No Of Pages : 133
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisConnected healthcare is a socio-technical model for healthcare management and delivery by using technology to provide healthcare services remotely. Connected health, also known as technology enabled care (TEC) aims to maximize healthcare resources and provide .....

No Of Pages : 97
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisDriver-free wireless LAN cards refer to wireless network adapters that can automatically identify and run in multiple operating systems without installing additional drivers. Such wireless cards typically support standard network protocols, such as the IEEE 80.....

No Of Pages : 96
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisOnline tutoring provides high school students with personalized support, academic assistance, and the convenience of remote learning. It can help them excel academically, improve their understanding of challenging subjects, and boost their confidence in their .....

No Of Pages : 91
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisHelp desk software is a suite of tools that enable you to provide information or support to customers with concerns, complaints or inquiries about your product or service. It is a platform that unifies queries from various customer-facing support channels, su.....

No Of Pages : 123
Publication Date: Mar, 2025
Single User Price : US$ 3,350.00

SynopsisIn integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in mult.....

No Of Pages : 101
Publication Date: Mar, 2025
Single User Price : US$ 3,350.00