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IT & Electronics Market Reports

SynopsisThe global Data Asset Management market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Data Asset Management is estimated to increa.....

No Of Pages : 89
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisThe global Gear Tooth Sensor market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Gear Tooth Sensor is estimated to increase from .....

No Of Pages : 101
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisThe global market for Conductive Silicon Carbide Wafer was valued at US$ 792 million in the year 2024 and is projected to reach a revised size of US$ 2091 million by 2031, growing at a CAGR of 15.1% during the forecast period. Silicon carbide is an inorg.....

No Of Pages : 105
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisThe satellite communication subsystem uses solely amateur radio band and it was developed to transmit downlink radio signals from HORYU-IV to any Earth ground stations and receive uplink command radio signals from Kyushu Institute of Technology ground station .....

No Of Pages : 86
Publication Date: Mar, 2025
Single User Price : US$ 3,350.00

SynopsisIntelligent queue management harnesses the power of technology, whether it be WiFi, cameras, or sensors, to monitor the status of a queuing area and provide managers with actionable information. Systems can help managers understand how queuing variables, such .....

No Of Pages : 101
Publication Date: Mar, 2025
Single User Price : US$ 3,350.00

SynopsisAs an important high-end branch product in printed circuit board products, COF flexible packaging substrates refer to packaged flexible substrates that have not yet been installed with chips and components. In the chip packaging process, it plays the role of c.....

No Of Pages : 105
Publication Date: Mar, 2025
Single User Price : US$ 3,350.00

SynopsisWafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. The global Fan-in Wa.....

No Of Pages : 74
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisBuffers and line drivers are integrated circuit devices that isolate the input circuit from the output circuit. This reduces the load seen by the input circuit and enables signals to be sent on PCB or cables over longer distances with higher fan-out. Fan out i.....

No Of Pages : 114
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisAn intelligent manhole cover management system (IMCS) is one of the most important basic platforms in a smart city to prevent frequent manhole cover accidents.The system is comprised of a monitoring device that is attached to manhole covers, a data concentrato.....

No Of Pages : 81
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisMarket Analysis and Insights: Global Metal Core Printed Circuit Board Market The global Metal Core Printed Circuit Board market was valued at US$ XX million in 2019 and it is expected to reach US$ XX million by the end of 2026, growing at a CAGR of XX% d.....

No Of Pages : 116
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00