SynopsisAn Audio Over Fiber Extender is a device used to transmit audio signals over long distances using fiber optic cables. This technology is commonly employed in professional audio applications where high-quality, interference-free transmission is required over ex.....
SynopsisATM outsourcing is a business process delegation to a partner under the conditions defined in advance. ATM outsourcing includes the following: ATM renting, hardware and software maintenance, ATM monitoring and reporting, ATM Lifecycle management. Cash Recyclin.....
SynopsisThe global Entertainment Building Design market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Entertainment Building Design is est.....
SynopsisSilicon-on-insulator substrate is a semiconductor technology that involves the integration of a silicon carbide (SiC) material onto an insulating substrate. The goal of the technology is to enhance the performance of electronic devices by leveraging the superi.....
Synopsis Highlights The global E-Commerce Marketing market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 .....
SynopsisThe global Risk Management Consulting market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Risk Management Consulting is estimated.....
SynopsisGlobal GNSS Receiver ICs market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to.....
Synopsis During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and allows the chip to be connected to a circuit.....
Synopsis3D time-of-flight (ToF) sensor is part of the 3D ToF image sensor family. The device combines ToF sensing with an optimally-designed analog-to-digital converter (ADC) and a versatile, programmable timing generator (TG). The built-in TG controls t.....
SynopsisMultilayer ceramic chip capacitors, or MLCCs, are important building blocks in today’s modern electronics and make up approximately 30% of the total components in a typical hybrid circuit module. Multilayer capacitors consist of a monolithic ceramic block with.....
