SynopsisThe global Healthcare RTLS (Real-Time Location Systems) market was valued at US$ 4530.9 million in 2023 and is anticipated to reach US$ 6863 million by 2030, witnessing a CAGR of 6.2% during the forecast period 2024-2030. According to our research, the g.....
SynopsisGlobal Veterinary PACS market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to g.....
SynopsisBy balancing strength and hardness, high-purity silicon carbide (SiC) components are widely used in LED optoelectronics, integrated circuits, and third-generation semiconductors, such as wafer boats, tubes, and simulated wafers that replacing silicon wafers in.....
Synopsis Iris recognition technology is based on the iris in the eyes for identification, applied to security equipment (such as access control), and places with high confidentiality requirements. The global Iris Recognition market was valued a.....
SynopsisSilicon carbide (SiC) and gallium nitride (GaN) are two leading-edge semiconductor materials with key benefits including higher voltage operation, wider temperature ranges and increased switching frequencies when compared to existing silicon (Si) technology. T.....
SynopsisThis report studies the CMOS Image Sensor (CIS) used for Medical, covers the X-ray, and endoscope. The global CMOS Image Sensor (CIS) for Medical market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market i.....
SynopsisThe global SoC Test Systems market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of SoC Test Systems in various end use industries. The expanding demands fro.....
SynopsisThe Cyber (Liability) Insurance market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Cyber (Li.....
SynopsisVirtual surgical planning (VSP) includes the following steps: data acquisition, CT image analysis, 3D anthropometric analysis, surgical simulation, implant/model design through CAD software, and model printing through rapid prototyping. The global Virtua.....
SynopsisBGA, or Ball Grid Array, packaging is a type of integrated circuit (IC) packaging used in electronics. In a BGA package, solder balls play a crucial role in connecting the integrated circuit to the printed circuit board (PCB). The global BGA Packaging So.....
