SynopsisThe global BNC Terminator market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for BNC Terminator is estimated to increase from $ mill.....
SynopsisGlobal Aircraft and Aerospace Pressure Sensor market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukr.....
SynopsisDeepwater exploration and production is the investigation, research and relative production of various conditions on the seabed for numerous scientific or commercial purposes. The global Deepwater Exploration and Production market size is expected to rea.....
SynopsisFMCW Lidar technology combines the most advanced microwave radar signal processing concept with laser technology, and realizes the detection of more dimensions and higher sensitivity by accurately manipulating and demodulating the laser micron wavelength, so a.....
SynopsisThe global Auto Dialing Software market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Auto Dialing Software in various end use industries. The expanding d.....
SynopsisThe chipset is the core of the motherboard. A motherboard’s CPU, memory, major I/O device and expansion card support all depend on the chipset. When building a server/workstation, the chipset, processor and memory should be considered as a whole. The server/wo.....
SynopsisThe global Lightweight Material Connection Technology Solution market was valued at US$ 4451 million in 2023 and is anticipated to reach US$ 42640 million by 2030, witnessing a CAGR of 38.1% during the forecast period 2024-2030. Lightweight material conn.....
SynopsisThe global Low and Medium-voltage Frequency Converter market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Low and Medium-voltage .....
SynopsisA chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. Ac.....
SynopsisSWIR (Short Wave Infrared) Lenses are specifically designed for Machine Vision applications in NIR and SWIR etc fields. The global SWIR (Short Wavelength Infrared) Lenses market was valued at US$ million in 2023 and is anticipated to reach US$ million by.....
