SynopsisGlobal Ethernet Expansion Board market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have.....
SynopsisThe system is generally composed of front-end equipment, image processing and transmission equipment, and network client. Front-end equipment is composed of camera, platform, decoder, protective cover, bracket, alarm detector, pickup and so on. It is responsib.....
SynopsisSoftware developer services providers offer services to help businesses develop and create software based on the requirements of their client. In some cases, software developer providers can also be hired to enhance a business’ existing product. These provider.....
SynopsisThe global Survey Software for Non-Profits market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Survey Software for Non-Profits is.....
SynopsisAWG wafer refers to the manufacturing material and shape of Arrayed Waveguide Grating (AWG for short). An AWG wafer is a substrate for optical devices, usually made of silicon-based materials, with a series of fine waveguide grating structures. The manufacturi.....
SynopsisSemiconductor DRAM Memory Chips The global Semiconductor DRAM Memory Chips market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. The global market for .....
SynopsisPurpose-built backup appliances (PBBA) are to recover and protect data and applications. Such appliances have features such as data encryption replication, and deduplication. The global Purpose-Built Backup Appliance (PBBA) market was valued at US$ 5622......
SynopsisThe global Spin-Wave Logic Devices market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Spin-Wave Logic Devices in various end use industries. The expandi.....
SynopsisThe global Surplus Lines Insurance market size is expected to reach US$ 9017.9 million by 2029, growing at a CAGR of 3.3% from 2023 to 2029. The market is mainly driven by the significant applications of Surplus Lines Insurance in various end use industries. T.....
SynopsisGlobal SiP Packaging Solder Paste market is projected to reach US$ million in 2030, increasing from US$ million in 2023, with the CAGR of % during the period of 2024 to 2030. Key manufacturers engaged in the SiP Packaging Solder Paste industry include Ma.....
