SynopsisEndpoint security software aims to bring together all cyber security and privacy controls for business PCs into a single management dashboard. This means everything from a standard firewall to antivirus software with malware removal and ransomware protection f.....
SynopsisThe global DLP Splicing Screen market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030. North American market for DLP Splicing Screen is estimated to increase fr.....
SynopsisPeltier modules contain two external ceramic plates separated by semiconductor pellets. One of the plates absorbs heat (becomes cooler) and the other plate dissipates heat (becomes hotter) when a current is passed through the semiconductor pellets.Refrigeratio.....
SynopsisThe global market for Man-Portable Military Communication System was valued at US$ 3693 million in the year 2024 and is projected to reach a revised size of US$ 4682 million by 2031, growing at a CAGR of 3.5% during the forecast period. The Global Mobile.....
SynopsisField service management software enables companies to be more flexible and nimble in providing service to customers. They can communicate in real time with customers, provide on-site information about products and repair issues, and offer more timely service......
SynopsisThe global Test Data Management (TDM) market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Test Data Management (TDM) in various end use industries. The e.....
SynopsisFinancial Risk Manager (FRM) is a professional designation issued by the Global Association of Risk Professionals (GARP). The GARP FRM accreditation is globally recognized as the premier certification for financial risk professionals dealing in financial marke.....
SynopsisTemperature Control Logistics (TCL), also regarded as cold chain logistics or perishable logistics, is an integrated temperature control system where the quality, integrity and safety of products are maintained throughout the process of export, packaging, tran.....
SynopsisIn microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they.....
SynopsisThe global AI PC Chip market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for AI PC Chip is estimated to increase from $ million in 2.....
