SynopsisThe global Prescriptive Security in BFSI market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Prescriptive Security in BFSI is est.....
SynopsisThis report studies the Golf GPS market status and outlook of global and major regions, from angles of manufacturers, regions, product types and end industries; this report analyzes the top manufacturers in global and major regions, and splits the Golf GPS mar.....
SynopsisClearing and Settlement Service refers to the service of settlement and clearing in financial transactions. In financial markets, after a buyer and seller conduct a transaction, settlement and clearing of the transaction are necessary steps. Clearing refers to.....
SynopsisAn electrostatic chuck is a component inside semiconductor equipment that is used to hold the semiconductor wafer. In the IoT Society, the demand for semiconductor is growing, which in turn has led to annual increases in the need for installing semiconductor-m.....
SynopsisDry-type amorphous alloy transformer is a new type of high-efficiency energy-saving transformer, which combines the advantages of amorphous alloy material with low loss and traditional epoxy resin cast transformer in high insulation and mechanical strength. Co.....
SynopsisThin film ceramic substrates, mainly covers the Alumina thin film substrates, and AlN thin film substrates. The global Thin Film Ceramic Substrates in Electronic Packaging market was valued at US$ 59 million in 2023 and is anticipated to reach US$ 89 mil.....
SynopsisThe global Software-Defined Perimeter Software market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Software-Defined Perimeter Sof.....
SynopsisThe global 3D Time-of-flight Camera Module market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for 3D Time-of-flight Camera Module is.....
SynopsisSilver Sintering Paste is a kind of high silver-filled die attach paste, which can achieve ultra-high thermal conductivity. Silver sintered pastes offer a robust lead-free alternative to solder pastes increasing the lifetime of the device up to 10 times. It ca.....
SynopsisContact finger is a small mechanical part used to make connection or grounding on electronic projects. These contacts are made to support harsh environment (humidity, temperature, and vibrations). Contact finger are widely used on on-board electronic projects......
