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Synopsis Global SiC-IPM Modules market is projected to reach US$ 43 million in 2029, increasing from US$ 13 million in 2022, with the CAGR of 15.8% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-U.....

No Of Pages : 73
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis The Aluminum Matrix Silicon Carbide Reinforced Material is a new kind of metal-base ceramic composites. Widely used in high - power electronic IGBT module package. Global Aluminum Matrix Silicon Carbide (Al-SiC) for IGBT market is projec.....

No Of Pages : 102
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis Global AlSiC IGBT Baseplates market is projected to reach US$ 38 million in 2029, increasing from US$ 27 million in 2022, with the CAGR of 5.7% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Rus.....

No Of Pages : 106
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis Global Base Plates for IGBT Modules market is projected to reach US$ 38 million in 2029, increasing from US$ 27 million in 2022, with the CAGR of 5.7% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 .....

No Of Pages : 100
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis Global AlSiC Baseplates for Power Modules market is projected to reach US$ 55 million in 2029, increasing from US$ 31 million in 2022, with the CAGR of 5.9% during the period of 2023 to 2029. Influencing issues, such as economy environments, COV.....

No Of Pages : 100
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis Global AlSiC IGBT Substrates market is projected to reach US$ 38 million in 2029, increasing from US$ 27 million in 2022, with the CAGR of 5.7% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Rus.....

No Of Pages : 101
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis ALSIC can be used in FCBGA package, high-density chip heat dissipation. Global AlSiC for Flip Chip (FC) Package market is projected to reach US$ 27 million in 2029, increasing from US$ 16 million in 2022, with the CAGR of 6.9% during the.....

No Of Pages : 67
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis Global AlSiC Heat Sinks market is projected to reach US$ 30 million in 2029, increasing from US$ 18 million in 2022, with the CAGR of 6.4% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-U.....

No Of Pages : 102
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis Global AlSiC Flip Chip Lids market is projected to reach US$ 23 million in 2029, increasing from US$ 14 million in 2022, with the CAGR of 6.8% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russ.....

No Of Pages : 66
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis Global AlSiC Hermetic Packaging market is projected to reach US$ 32 million in 2029, increasing from US$ 24 million in 2022, with the CAGR of 4.4% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and .....

No Of Pages : 108
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00