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Synopsis Global Semiconductor Heat Exchangers market is projected to reach US$ 841.1 million in 2029, increasing from US$ 660 million in 2022, with the CAGR of 5.3% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVI.....

No Of Pages : 102
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis Global Semiconductor Recirculating Chillers market is projected to reach US$ 841.1 million in 2029, increasing from US$ 660 million in 2022, with the CAGR of 5.3% during the period of 2023 to 2029. Influencing issues, such as economy environment.....

No Of Pages : 119
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis Global Semiconductor Circulating Chillers market is projected to reach US$ 841.1 million in 2029, increasing from US$ 660 million in 2022, with the CAGR of 5.3% during the period of 2023 to 2029. Influencing issues, such as economy environments,.....

No Of Pages : 115
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis This is a lightweight composite material manufactured by infiltrating Silicon Carbide (SiC) with Magnesium (Mg). Mg-SiC Composite Materials can be used as Base plate for power module for electric railway, industrial machinery and automotive (HEV.....

No Of Pages : 65
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis This is a lightweight composite material manufactured by infiltrating Silicon Carbide (SiC) with Magnesium (Mg). Mg-SiC Composite Materials can be used as Base plate for power module for electric railway, industrial machinery and automotive (HEV.....

No Of Pages : 70
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis Ag (Silver), having a higher thermal conductivity than Copper, is the material with the highest thermal conductivity among metals. This is a composite material of Silver and Diamond, the thermal conductivity is 600W/(m・K). Global Ag (Sil.....

No Of Pages : 66
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis This report studies the heatspreader (heat dissipation plate) for semiconductor modules. This is a lightweight composite material manufactured by infiltrating Silicon Carbide (SiC) with Magnesium (Mg). Mg-SiC Composite Materials can be used as B.....

No Of Pages : 71
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis CPC is a 3 layered composite material, copper, copper-molybdenum and copper. Controlling composition of copper molybdenum and laminated thickness of copper, thermal conductivity ratio and thermal expansion ratio is adjustable depending on custom.....

No Of Pages : 86
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis Helical bevel gearboxes are angular gearboxes where the output shaft of the gear unit turns 90 degrees in reference to the rotor shaft of the motor. Global Helical Bevel Gearbox market is projected to reach US$ million in 2029, increasin.....

No Of Pages : 98
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00