SynopsisMolded interconnect substrate (MIS) is a mid-range packaging technology built on a leadframe substrate. It supports single- or multi-die configurations, enabling low-profile, fine-pitch packages. On the surface, MIS resembles a fan-out wafer-level package.
SynopsisThe global Electronic Circuit Three-Dimensional Processing Machine market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030. North American market for Electronic .....
SynopsisA capacitive level limit switch is a device used to detect liquid levels or liquid interfaces. It usually consists of two electrodes, one is the sensing electrode and the other is the ground electrode, and the capacitance between them changes with the liquid l.....
SynopsisIndustrial Automation Control Universal Servomechanism is a kind of system that can dynamically track the change of target and realize automatic control. It mainly takes position, speed and torque as the control quantity. Servo system, which integrates materia.....
SynopsisThe global Electric Linear Closer market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030. North American market for Electric Linear Closer is estimated to incre.....
SynopsisHSV1 ELISA kits are enzyme-linked immunosorbent assay kits used for the detection and quantification of antibodies specific to Herpes Simplex Virus type 1 (HSV1) in a biological sample. These kits utilize an ELISA method to detect the presence of antibodies pr.....
SynopsisThe global Electric Linear Cutting Stapler market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030. North American market for Electric Linear Cutting Stapler is .....
SynopsisLTE Cat.1 is a medium speed LTE standard designed for more feature-rich IoT applications that require higher data speeds. This report studies LTE Cat.1 Chipsets market. The global LTE Cat.1 Chipsets market was valued at US$ million in 2023 and is anticip.....
SynopsisIndustrial Automation Control General MCU, or microcontroller, is a computer chip level product that integrates a computer's CPU, RAM, ROM, timing counter and a variety of I/O interfaces on a chip. This integrated design enables MCU to perform different combin.....
SynopsisHIV-1 ELISA kits are enzyme-linked immunosorbent assay kits designed for the detection and quantification of antibodies specific to Human Immunodeficiency Virus type 1 (HIV-1) in biological samples. These kits use the ELISA method to detect the presence of ant.....
