SynopsisSpherical silica for melamine-urea-formaldehyde (MUF) refers to silica-based particles used as an extender and reinforcement in MUF adhesives and resins. The global Spherical Silica for MUF market was valued at US$ 25 million in 2023 and is anticipated t.....
SynopsisElectronic grade silica filler refers to high-purity silica particles used in electronic materials and components, such as encapsulants, potting compounds, and printed circuit boards (PCBs). The global Electronic Grade Silica Filler market was valued at .....
SynopsisSilica and alumina spherical filler refers to composite particles containing silica and alumina used as fillers in various industrial applications, including adhesives, coatings, and composites. The global Silica and Alumina Spherical Filler market was v.....
SynopsisO-cresol novolac epoxy resin is a type of epoxy resin based on o-cresol and formaldehyde. It is used as a high-performance adhesive and encapsulant in electronic applications. The global O-Cresol Novolac Epoxy Resin market was valued at US$ million in 20.....
SynopsisBisphenol A solid epoxy resin is a thermosetting resin based on bisphenol A and epichlorohydrin. It is used as a versatile adhesive, coating, and composite material. The global Bisphenol A Solid Epoxy Resin market was valued at US$ million in 2023 and is.....
SynopsisHigh purity bisphenol A epoxy resin is a specialized epoxy resin with extremely low impurities and high chemical purity. It is used in applications requiring the highest level of cleanliness and reliability. The global High Purity Bisphenol A Epoxy Resin.....
SynopsisHigh purity bisphenol F epoxy resin is a specialized epoxy resin with extremely low impurities and high chemical purity. It is used in applications requiring the highest level of cleanliness and reliability. The global High Purity Bisphenol F Epoxy Resin.....
SynopsisElectronic grade bisphenol A epoxy resin is a specialized epoxy resin designed for use in electronic applications, such as encapsulation, potting, and coating of electronic components. The global Electronic Grade Bisphenol A Epoxy Resin market was valued.....
SynopsisElectronic grade bisphenol F epoxy resin is a specialized epoxy resin designed for use in electronic applications, such as encapsulation, potting, and coating of electronic components. The global Electronic Grade Bisphenol F Epoxy Resin market was valued.....
SynopsisLiquid epoxy encapsulant material refers to a low-viscosity epoxy resin used for encapsulating and protecting electronic components and devices. The global Liquid Epoxy Encapsulant Material market was valued at US$ 652 million in 2023 and is anticipated .....
