SynopsisWafer level package epoxy molding compound is a specialized epoxy resin used in the packaging of semiconductor devices directly at the wafer level. This process is commonly known as wafer-level packaging (WLP). The global Wafer Level Package Epoxy Moldin.....
SynopsisMolding compounds for discretes are epoxy resins used in the encapsulation and packaging of discrete semiconductor devices, such as diodes, transistors, and power modules. The global Molding Compounds for Discrete market was valued at US$ 1293 million in.....
SynopsisMolding compounds for ICs (Integrated Circuits) are epoxy resins used in the encapsulation and packaging of semiconductor ICs. The global Molding Compounds for ICs market was valued at US$ 1047 million in 2023 and is anticipated to reach US$ 1625.2 milli.....
SynopsisHigh thermal conductive epoxy molding compound is a specialized epoxy resin with high thermal conductivity, used in semiconductor packaging to enhance heat dissipation and thermal management. The global High Thermal Conductive Epoxy Molding Compound mark.....
SynopsisMolding compounds for power devices are specialized epoxy resins designed for encapsulating and packaging high-power semiconductor devices, such as power transistors and diodes. The global Molding Compounds for Power Device market was valued at US$ 1293 .....
SynopsisFC underfills (Flip-Chip Underfills) are specialized epoxy-based materials used to fill the gap between a flip-chip die and its substrate to enhance the mechanical and thermal reliability of flip-chip packages. The global FC Underfills market was valued .....
SynopsisSemiconductor underfill is an epoxy-based material used to fill the gap between a semiconductor die and its package substrate to enhance mechanical and thermal reliability. The global Semiconductor Underfill market was valued at US$ 153 million in 2023 a.....
SynopsisHeat dissipation sheet (HD sheet) is a thermal interface material (TIM) used to improve heat transfer between electronic components and heat sinks or other cooling surfaces. The global Heat Dissipation Sheet (HD Sheet) market was valued at US$ 182 millio.....
SynopsisHeat dissipation grease (HD grease) is a thermal interface material (TIM) used to improve heat transfer between electronic components and heat sinks or other cooling surfaces. The global Heat Dissipation Grease (HD Grease) market was valued at US$ 144 mi.....
SynopsisHeat dissipation adhesive (HD adhesive) is a thermal interface material (TIM) used to improve heat transfer between electronic components and heat sinks or other cooling surfaces. The global Heat Dissipation Adhesive (HD Adhesive) market was valued at US.....
