SynopsisHigh thermal conductive epoxy molding compound is a specialized epoxy resin with high thermal conductivity, used in semiconductor packaging to enhance heat dissipation and thermal management. The global High Thermal Conductive Epoxy Molding Compound mark.....
SynopsisMolding compounds for power devices are specialized epoxy resins designed for encapsulating and packaging high-power semiconductor devices, such as power transistors and diodes. The global Molding Compounds for Power Device market was valued at US$ 1293 .....
SynopsisFC underfills (Flip-Chip Underfills) are specialized epoxy-based materials used to fill the gap between a flip-chip die and its substrate to enhance the mechanical and thermal reliability of flip-chip packages. The global FC Underfills market was valued .....
SynopsisSemiconductor underfill is an epoxy-based material used to fill the gap between a semiconductor die and its package substrate to enhance mechanical and thermal reliability. The global Semiconductor Underfill market was valued at US$ 153 million in 2023 a.....
SynopsisHeat dissipation sheet (HD sheet) is a thermal interface material (TIM) used to improve heat transfer between electronic components and heat sinks or other cooling surfaces. The global Heat Dissipation Sheet (HD Sheet) market was valued at US$ 182 millio.....
SynopsisHeat dissipation grease (HD grease) is a thermal interface material (TIM) used to improve heat transfer between electronic components and heat sinks or other cooling surfaces. The global Heat Dissipation Grease (HD Grease) market was valued at US$ 144 mi.....
SynopsisHeat dissipation adhesive (HD adhesive) is a thermal interface material (TIM) used to improve heat transfer between electronic components and heat sinks or other cooling surfaces. The global Heat Dissipation Adhesive (HD Adhesive) market was valued at US.....
SynopsisHeat dissipation gap filler (HD gap filler) is a thermal interface material (TIM) used to fill irregular gaps and voids between electronic components and heat sinks or other cooling surfaces, ensuring efficient heat dissipation. The global Heat Dissipati.....
SynopsisFillers for thermal interface materials refer to a wide range of particles and additives used to enhance the thermal conductivity and performance of thermal interface materials (TIMs), such as pastes, greases, and pads. The global Filler for Thermal Inte.....
SynopsisThermal gap filler pad is a type of thermal interface material (TIM) available in pad form, used to fill gaps between electronic components and heat sinks or other cooling surfaces, ensuring efficient heat dissipation. The global Thermal Gap Filler Pad m.....
