SynopsisThe global Boron Nitride Ceramic market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030. North American market for Boron Nitride Ceramic is estimated to increas.....
SynopsisIP Intercom refers to intercom can send and receive data via a computer network. IP Intercom have the features of high picture quality, stable, free from line interference, little distance limit. wiring is simple, easy to maintain, higher equipment cost, lower.....
SynopsisThe global Boron Oxide Ceramics market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030. North American market for Boron Oxide Ceramics is estimated to increase .....
SynopsisThis report studies Ceramic Substrate for Automotive applications, include the DBC, AMB, DBA, DPC, LTCC and HTCC Ceramic Substrates, used for power modules, LED, and ECUs, etc. The global Ceramic Substrate for Automotive market was valued at US$ 818 mill.....
SynopsisThis report studies Ceramic Substrate for Sensor Package. The global Ceramic Substrate for Sensors market was valued at US$ 48 million in 2023 and is anticipated to reach US$ 81.2 million by 2030, witnessing a CAGR of 6.7% during the forecast period 2024.....
SynopsisThis report studies Ceramic Substrate for Automotive LED, include the DPC, LTCC and HTCC Ceramic Substrates, used for Automotive LED lighting, etc. The global Ceramic Substrate for Automotive LED market was valued at US$ 138 million in 2023 and is antici.....
SynopsisThe global High Precision Pressure Transducers market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030. North American market for High Precision Pressure Transdu.....
SynopsisLTCC is i a multilayer ceramic technology, resembling organic printed circuit boards. A typical module consists of a number of ceramic layers with printed concuctors and other integrated passive components. The sheets are laminated and co-fired at 850 ºC to fo.....
SynopsisThe global High Pressure Transducers market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030. North American market for High Pressure Transducers is estimated to.....
SynopsisThis report studies Ceramic Substrate for Sensor Package. The global Ceramic Substrate for MEMS Sensor Package market was valued at US$ 48 million in 2023 and is anticipated to reach US$ 81.2 million by 2030, witnessing a CAGR of 6.7% during the forecast.....
