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2.5D and 3D TSV-Global Market Insights and Sales Trends 2025
Synopsis
The global 2.5D and 3D TSV market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of 2.5D and 3D TSV in various end use industries. The expanding demands from the Mobile and Consumer Electronics, Communication Equipment, Automotive and Transportation Electronics and Other, are propelling 2.5D and 3D TSV market. 2.5D TSV, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the 3D TSV segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for 2.5D and 3D TSV market, driven by demand from China, the second largest economy with some signs of stabilising, the 2.5D and 3D TSV market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for 2.5D and 3D TSV, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global 2.5D and 3D TSV market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global 2.5D and 3D TSV market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, 2.5D and 3D TSV sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of 2.5D and 3D TSV covered in this report include Samsung, Intel, ASE Group, GlobalFoundries, Amkor Technology, Micron Technology, TSMC, UMC and SK Hynix, etc.
The global 2.5D and 3D TSV market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Samsung
Intel
ASE Group
GlobalFoundries
Amkor Technology
Micron Technology
TSMC
UMC
SK Hynix
Shinko
Unimicron
Fujitsu Interconnect
Xperi
Global 2.5D and 3D TSV market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global 2.5D and 3D TSV market, Segment by Type:
2.5D TSV
3D TSV
Global 2.5D and 3D TSV market, by Application
Mobile and Consumer Electronics
Communication Equipment
Automotive and Transportation Electronics
Other
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of 2.5D and 3D TSV companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
The global 2.5D and 3D TSV market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of 2.5D and 3D TSV in various end use industries. The expanding demands from the Mobile and Consumer Electronics, Communication Equipment, Automotive and Transportation Electronics and Other, are propelling 2.5D and 3D TSV market. 2.5D TSV, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the 3D TSV segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for 2.5D and 3D TSV market, driven by demand from China, the second largest economy with some signs of stabilising, the 2.5D and 3D TSV market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for 2.5D and 3D TSV, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global 2.5D and 3D TSV market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global 2.5D and 3D TSV market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, 2.5D and 3D TSV sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of 2.5D and 3D TSV covered in this report include Samsung, Intel, ASE Group, GlobalFoundries, Amkor Technology, Micron Technology, TSMC, UMC and SK Hynix, etc.
The global 2.5D and 3D TSV market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Samsung
Intel
ASE Group
GlobalFoundries
Amkor Technology
Micron Technology
TSMC
UMC
SK Hynix
Shinko
Unimicron
Fujitsu Interconnect
Xperi
Global 2.5D and 3D TSV market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global 2.5D and 3D TSV market, Segment by Type:
2.5D TSV
3D TSV
Global 2.5D and 3D TSV market, by Application
Mobile and Consumer Electronics
Communication Equipment
Automotive and Transportation Electronics
Other
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of 2.5D and 3D TSV companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Index1 Market Overview of 2.5D and 3D TSV
1.1 2.5D and 3D TSV Market Overview
1.1.1 2.5D and 3D TSV Product Scope
1.1.2 2.5D and 3D TSV Market Status and Outlook
1.2 Global 2.5D and 3D TSV Market Size Overview by Region 2018 VS 2022 VS 2029
1.3 Global 2.5D and 3D TSV Market Size by Region (2018-2029)
1.4 Global 2.5D and 3D TSV Historic Market Size by Region (2018-2023)
1.5 Global 2.5D and 3D TSV Market Size Forecast by Region (2024-2029)
1.6 Key Regions, 2.5D and 3D TSV Market Size (2018-2029)
1.6.1 North America 2.5D and 3D TSV Market Size (2018-2029)
1.6.2 Europe 2.5D and 3D TSV Market Size (2018-2029)
1.6.3 Asia-Pacific 2.5D and 3D TSV Market Size (2018-2029)
1.6.4 Latin America 2.5D and 3D TSV Market Size (2018-2029)
1.6.5 Middle East & Africa 2.5D and 3D TSV Market Size (2018-2029)
2 2.5D and 3D TSV Market by Type
2.1 Introduction
2.1.1 2.5D TSV
2.1.2 3D TSV
2.2 Global 2.5D and 3D TSV Market Size by Type: 2018 VS 2022 VS 2029
2.2.1 Global 2.5D and 3D TSV Historic Market Size by Type (2018-2023)
2.2.2 Global 2.5D and 3D TSV Forecasted Market Size by Type (2024-2029)
2.3 Key Regions Market Size by Type
2.3.1 North America 2.5D and 3D TSV Revenue Breakdown by Type (2018-2029)
2.3.2 Europe 2.5D and 3D TSV Revenue Breakdown by Type (2018-2029)
2.3.3 Asia-Pacific 2.5D and 3D TSV Revenue Breakdown by Type (2018-2029)
2.3.4 Latin America 2.5D and 3D TSV Revenue Breakdown by Type (2018-2029)
2.3.5 Middle East and Africa 2.5D and 3D TSV Revenue Breakdown by Type (2018-2029)
3 2.5D and 3D TSV Market Overview by Application
3.1 Introduction
3.1.1 Mobile and Consumer Electronics
3.1.2 Communication Equipment
3.1.3 Automotive and Transportation Electronics
3.1.4 Other
3.2 Global 2.5D and 3D TSV Market Size by Application: 2018 VS 2022 VS 2029
3.2.1 Global 2.5D and 3D TSV Historic Market Size by Application (2018-2023)
3.2.2 Global 2.5D and 3D TSV Forecasted Market Size by Application (2024-2029)
3.3 Key Regions Market Size by Application
3.3.1 North America 2.5D and 3D TSV Revenue Breakdown by Application (2018-2029)
3.3.2 Europe 2.5D and 3D TSV Revenue Breakdown by Application (2018-2029)
3.3.3 Asia-Pacific 2.5D and 3D TSV Revenue Breakdown by Application (2018-2029)
3.3.4 Latin America 2.5D and 3D TSV Revenue Breakdown by Application (2018-2029)
3.3.5 Middle East and Africa 2.5D and 3D TSV Revenue Breakdown by Application (2018-2029)
4 2.5D and 3D TSV Competition Analysis by Players
4.1 Global 2.5D and 3D TSV Market Size by Players (2018-2023)
4.2 Global Top Players by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in 2.5D and 3D TSV as of 2022)
4.3 Date of Key Players Enter into 2.5D and 3D TSV Market
4.4 Global Top Players 2.5D and 3D TSV Headquarters and Area Served
4.5 Key Players 2.5D and 3D TSV Product Solution and Service
4.6 Competitive Status
4.6.1 2.5D and 3D TSV Market Concentration Rate
4.6.2 Mergers & Acquisitions, Expansion Plans
5 Company (Top Players) Profiles
5.1 Samsung
5.1.1 Samsung Profile
5.1.2 Samsung Main Business
5.1.3 Samsung 2.5D and 3D TSV Products, Services and Solutions
5.1.4 Samsung 2.5D and 3D TSV Revenue (US$ Million) & (2018-2023)
5.1.5 Samsung Recent Developments
5.2 Intel
5.2.1 Intel Profile
5.2.2 Intel Main Business
5.2.3 Intel 2.5D and 3D TSV Products, Services and Solutions
5.2.4 Intel 2.5D and 3D TSV Revenue (US$ Million) & (2018-2023)
5.2.5 Intel Recent Developments
5.3 ASE Group
5.3.1 ASE Group Profile
5.3.2 ASE Group Main Business
5.3.3 ASE Group 2.5D and 3D TSV Products, Services and Solutions
5.3.4 ASE Group 2.5D and 3D TSV Revenue (US$ Million) & (2018-2023)
5.3.5 GlobalFoundries Recent Developments
5.4 GlobalFoundries
5.4.1 GlobalFoundries Profile
5.4.2 GlobalFoundries Main Business
5.4.3 GlobalFoundries 2.5D and 3D TSV Products, Services and Solutions
5.4.4 GlobalFoundries 2.5D and 3D TSV Revenue (US$ Million) & (2018-2023)
5.4.5 GlobalFoundries Recent Developments
5.5 Amkor Technology
5.5.1 Amkor Technology Profile
5.5.2 Amkor Technology Main Business
5.5.3 Amkor Technology 2.5D and 3D TSV Products, Services and Solutions
5.5.4 Amkor Technology 2.5D and 3D TSV Revenue (US$ Million) & (2018-2023)
5.5.5 Amkor Technology Recent Developments
5.6 Micron Technology
5.6.1 Micron Technology Profile
5.6.2 Micron Technology Main Business
5.6.3 Micron Technology 2.5D and 3D TSV Products, Services and Solutions
5.6.4 Micron Technology 2.5D and 3D TSV Revenue (US$ Million) & (2018-2023)
5.6.5 Micron Technology Recent Developments
5.7 TSMC
5.7.1 TSMC Profile
5.7.2 TSMC Main Business
5.7.3 TSMC 2.5D and 3D TSV Products, Services and Solutions
5.7.4 TSMC 2.5D and 3D TSV Revenue (US$ Million) & (2018-2023)
5.7.5 TSMC Recent Developments
5.8 UMC
5.8.1 UMC Profile
5.8.2 UMC Main Business
5.8.3 UMC 2.5D and 3D TSV Products, Services and Solutions
5.8.4 UMC 2.5D and 3D TSV Revenue (US$ Million) & (2018-2023)
5.8.5 UMC Recent Developments
5.9 SK Hynix
5.9.1 SK Hynix Profile
5.9.2 SK Hynix Main Business
5.9.3 SK Hynix 2.5D and 3D TSV Products, Services and Solutions
5.9.4 SK Hynix 2.5D and 3D TSV Revenue (US$ Million) & (2018-2023)
5.9.5 SK Hynix Recent Developments
5.10 Shinko
5.10.1 Shinko Profile
5.10.2 Shinko Main Business
5.10.3 Shinko 2.5D and 3D TSV Products, Services and Solutions
5.10.4 Shinko 2.5D and 3D TSV Revenue (US$ Million) & (2018-2023)
5.10.5 Shinko Recent Developments
5.11 Unimicron
5.11.1 Unimicron Profile
5.11.2 Unimicron Main Business
5.11.3 Unimicron 2.5D and 3D TSV Products, Services and Solutions
5.11.4 Unimicron 2.5D and 3D TSV Revenue (US$ Million) & (2018-2023)
5.11.5 Unimicron Recent Developments
5.12 Fujitsu Interconnect
5.12.1 Fujitsu Interconnect Profile
5.12.2 Fujitsu Interconnect Main Business
5.12.3 Fujitsu Interconnect 2.5D and 3D TSV Products, Services and Solutions
5.12.4 Fujitsu Interconnect 2.5D and 3D TSV Revenue (US$ Million) & (2018-2023)
5.12.5 Fujitsu Interconnect Recent Developments
5.13 Xperi
5.13.1 Xperi Profile
5.13.2 Xperi Main Business
5.13.3 Xperi 2.5D and 3D TSV Products, Services and Solutions
5.13.4 Xperi 2.5D and 3D TSV Revenue (US$ Million) & (2018-2023)
5.13.5 Xperi Recent Developments
6 North America
6.1 North America 2.5D and 3D TSV Market Size by Country (2018-2029)
6.2 United States
6.3 Canada
7 Europe
7.1 Europe 2.5D and 3D TSV Market Size by Country (2018-2029)
7.2 Germany
7.3 France
7.4 U.K.
7.5 Italy
7.6 Russia
7.7 Nordic Countries
7.8 Rest of Europe
8 Asia-Pacific
8.1 Asia-Pacific 2.5D and 3D TSV Market Size by Region (2018-2029)
8.2 China
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
8.6 India
8.7 Australia
8.8 Rest of Asia-Pacific
9 Latin America
9.1 Latin America 2.5D and 3D TSV Market Size by Country (2018-2029)
9.2 Mexico
9.3 Brazil
9.4 Rest of Latin America
10 Middle East & Africa
10.1 Middle East & Africa 2.5D and 3D TSV Market Size by Country (2018-2029)
10.2 Turkey
10.3 Saudi Arabia
10.4 UAE
10.5 Rest of Middle East & Africa
11 2.5D and 3D TSV Market Dynamics
11.1 2.5D and 3D TSV Industry Trends
11.2 2.5D and 3D TSV Market Drivers
11.3 2.5D and 3D TSV Market Challenges
11.4 2.5D and 3D TSV Market Restraints
12 Research Finding /Conclusion
13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer
13.4 Author List
Published By : QY Research
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