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Automotive Power Module Packaging-Global Market Insights and Sales Trends 2025
Synopsis
Technical trends in power module packaging are mainly driven by the entrance of the Wide Band Gap (WBG) materials and the challenging system requirements of the booming EV/HEV industry. Indeed, the introduction of the WBG semiconductors SiC and GaN are pushing the development of new power packaging solutions, as these devices can work at higher junction temperatures and higher switching frequencies with smaller die sizes
The global Automotive Power Module Packaging market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Automotive Power Module Packaging in various end use industries. The expanding demands from the Battery Electric Vehicles (BEV) and Plug-in Hybrid Electric Vehicles (PHEV), are propelling Automotive Power Module Packaging market. Intelligent Power Module, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the SiC Module segment is estimated at % CAGR for the next seven-year period.
Automotive is a key driver of this industry. According to data from the World Automobile Organization (OICA), global automobile production and sales in 2017 reached their peak in the past 10 years, at 97.3 million and 95.89 million respectively. In 2018, the global economic expansion ended, and the global auto market declined as a whole. In 2022, there will wear units 81.6 million vehicles in the world. At present, more than 90% of the world's automobiles are concentrated in the three continents of Asia, Europe and North America, of which Asia automobile production accounts for 56% of the world, Europe accounts for 20%, and North America accounts for 16%. The world major automobile producing countries include China, the United States, Japan, South Korea, Germany, India, Mexico, and other countries; among them, China is the largest automobile producing country in the world, accounting for about 32%. Japan is the world's largest car exporter, exporting more than 3.5 million vehicles in 2022.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Automotive Power Module Packaging, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Automotive Power Module Packaging market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Automotive Power Module Packaging market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Automotive Power Module Packaging sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Automotive Power Module Packaging covered in this report include Amkor Technology, Kulicke and Soffa Industries, Infineon Technologies, STMicroelectronics, Fuji Electric, Toshiba Electronic Device & Storage Corporation, Semikron, STATS ChipPAC and Starpower Semiconductor, etc.
The global Automotive Power Module Packaging market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Amkor Technology
Kulicke and Soffa Industries
Infineon Technologies
STMicroelectronics
Fuji Electric
Toshiba Electronic Device & Storage Corporation
Semikron
STATS ChipPAC
Starpower Semiconductor
Bosch
Toyota
Mitsubishi
Global Automotive Power Module Packaging market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Automotive Power Module Packaging market, Segment by Type:
Intelligent Power Module
SiC Module
GaN Module
Other
Global Automotive Power Module Packaging market, by Application
Battery Electric Vehicles (BEV)
Plug-in Hybrid Electric Vehicles (PHEV)
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Automotive Power Module Packaging companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Technical trends in power module packaging are mainly driven by the entrance of the Wide Band Gap (WBG) materials and the challenging system requirements of the booming EV/HEV industry. Indeed, the introduction of the WBG semiconductors SiC and GaN are pushing the development of new power packaging solutions, as these devices can work at higher junction temperatures and higher switching frequencies with smaller die sizes
The global Automotive Power Module Packaging market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Automotive Power Module Packaging in various end use industries. The expanding demands from the Battery Electric Vehicles (BEV) and Plug-in Hybrid Electric Vehicles (PHEV), are propelling Automotive Power Module Packaging market. Intelligent Power Module, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the SiC Module segment is estimated at % CAGR for the next seven-year period.
Automotive is a key driver of this industry. According to data from the World Automobile Organization (OICA), global automobile production and sales in 2017 reached their peak in the past 10 years, at 97.3 million and 95.89 million respectively. In 2018, the global economic expansion ended, and the global auto market declined as a whole. In 2022, there will wear units 81.6 million vehicles in the world. At present, more than 90% of the world's automobiles are concentrated in the three continents of Asia, Europe and North America, of which Asia automobile production accounts for 56% of the world, Europe accounts for 20%, and North America accounts for 16%. The world major automobile producing countries include China, the United States, Japan, South Korea, Germany, India, Mexico, and other countries; among them, China is the largest automobile producing country in the world, accounting for about 32%. Japan is the world's largest car exporter, exporting more than 3.5 million vehicles in 2022.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Automotive Power Module Packaging, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Automotive Power Module Packaging market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Automotive Power Module Packaging market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Automotive Power Module Packaging sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Automotive Power Module Packaging covered in this report include Amkor Technology, Kulicke and Soffa Industries, Infineon Technologies, STMicroelectronics, Fuji Electric, Toshiba Electronic Device & Storage Corporation, Semikron, STATS ChipPAC and Starpower Semiconductor, etc.
The global Automotive Power Module Packaging market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Amkor Technology
Kulicke and Soffa Industries
Infineon Technologies
STMicroelectronics
Fuji Electric
Toshiba Electronic Device & Storage Corporation
Semikron
STATS ChipPAC
Starpower Semiconductor
Bosch
Toyota
Mitsubishi
Global Automotive Power Module Packaging market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Automotive Power Module Packaging market, Segment by Type:
Intelligent Power Module
SiC Module
GaN Module
Other
Global Automotive Power Module Packaging market, by Application
Battery Electric Vehicles (BEV)
Plug-in Hybrid Electric Vehicles (PHEV)
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Automotive Power Module Packaging companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Index1 Market Overview of Automotive Power Module Packaging
1.1 Automotive Power Module Packaging Market Overview
1.1.1 Automotive Power Module Packaging Product Scope
1.1.2 Automotive Power Module Packaging Market Status and Outlook
1.2 Global Automotive Power Module Packaging Market Size Overview by Region 2018 VS 2022 VS 2029
1.3 Global Automotive Power Module Packaging Market Size by Region (2018-2029)
1.4 Global Automotive Power Module Packaging Historic Market Size by Region (2018-2023)
1.5 Global Automotive Power Module Packaging Market Size Forecast by Region (2024-2029)
1.6 Key Regions, Automotive Power Module Packaging Market Size (2018-2029)
1.6.1 North America Automotive Power Module Packaging Market Size (2018-2029)
1.6.2 Europe Automotive Power Module Packaging Market Size (2018-2029)
1.6.3 Asia-Pacific Automotive Power Module Packaging Market Size (2018-2029)
1.6.4 Latin America Automotive Power Module Packaging Market Size (2018-2029)
1.6.5 Middle East & Africa Automotive Power Module Packaging Market Size (2018-2029)
2 Automotive Power Module Packaging Market by Type
2.1 Introduction
2.1.1 Intelligent Power Module
2.1.2 SiC Module
2.1.3 GaN Module
2.1.4 Other
2.2 Global Automotive Power Module Packaging Market Size by Type: 2018 VS 2022 VS 2029
2.2.1 Global Automotive Power Module Packaging Historic Market Size by Type (2018-2023)
2.2.2 Global Automotive Power Module Packaging Forecasted Market Size by Type (2024-2029)
2.3 Key Regions Market Size by Type
2.3.1 North America Automotive Power Module Packaging Revenue Breakdown by Type (2018-2029)
2.3.2 Europe Automotive Power Module Packaging Revenue Breakdown by Type (2018-2029)
2.3.3 Asia-Pacific Automotive Power Module Packaging Revenue Breakdown by Type (2018-2029)
2.3.4 Latin America Automotive Power Module Packaging Revenue Breakdown by Type (2018-2029)
2.3.5 Middle East and Africa Automotive Power Module Packaging Revenue Breakdown by Type (2018-2029)
3 Automotive Power Module Packaging Market Overview by Application
3.1 Introduction
3.1.1 Battery Electric Vehicles (BEV)
3.1.2 Plug-in Hybrid Electric Vehicles (PHEV)
3.2 Global Automotive Power Module Packaging Market Size by Application: 2018 VS 2022 VS 2029
3.2.1 Global Automotive Power Module Packaging Historic Market Size by Application (2018-2023)
3.2.2 Global Automotive Power Module Packaging Forecasted Market Size by Application (2024-2029)
3.3 Key Regions Market Size by Application
3.3.1 North America Automotive Power Module Packaging Revenue Breakdown by Application (2018-2029)
3.3.2 Europe Automotive Power Module Packaging Revenue Breakdown by Application (2018-2029)
3.3.3 Asia-Pacific Automotive Power Module Packaging Revenue Breakdown by Application (2018-2029)
3.3.4 Latin America Automotive Power Module Packaging Revenue Breakdown by Application (2018-2029)
3.3.5 Middle East and Africa Automotive Power Module Packaging Revenue Breakdown by Application (2018-2029)
4 Automotive Power Module Packaging Competition Analysis by Players
4.1 Global Automotive Power Module Packaging Market Size by Players (2018-2023)
4.2 Global Top Players by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Automotive Power Module Packaging as of 2022)
4.3 Date of Key Players Enter into Automotive Power Module Packaging Market
4.4 Global Top Players Automotive Power Module Packaging Headquarters and Area Served
4.5 Key Players Automotive Power Module Packaging Product Solution and Service
4.6 Competitive Status
4.6.1 Automotive Power Module Packaging Market Concentration Rate
4.6.2 Mergers & Acquisitions, Expansion Plans
5 Company (Top Players) Profiles
5.1 Amkor Technology
5.1.1 Amkor Technology Profile
5.1.2 Amkor Technology Main Business
5.1.3 Amkor Technology Automotive Power Module Packaging Products, Services and Solutions
5.1.4 Amkor Technology Automotive Power Module Packaging Revenue (US$ Million) & (2018-2023)
5.1.5 Amkor Technology Recent Developments
5.2 Kulicke and Soffa Industries
5.2.1 Kulicke and Soffa Industries Profile
5.2.2 Kulicke and Soffa Industries Main Business
5.2.3 Kulicke and Soffa Industries Automotive Power Module Packaging Products, Services and Solutions
5.2.4 Kulicke and Soffa Industries Automotive Power Module Packaging Revenue (US$ Million) & (2018-2023)
5.2.5 Kulicke and Soffa Industries Recent Developments
5.3 Infineon Technologies
5.3.1 Infineon Technologies Profile
5.3.2 Infineon Technologies Main Business
5.3.3 Infineon Technologies Automotive Power Module Packaging Products, Services and Solutions
5.3.4 Infineon Technologies Automotive Power Module Packaging Revenue (US$ Million) & (2018-2023)
5.3.5 STMicroelectronics Recent Developments
5.4 STMicroelectronics
5.4.1 STMicroelectronics Profile
5.4.2 STMicroelectronics Main Business
5.4.3 STMicroelectronics Automotive Power Module Packaging Products, Services and Solutions
5.4.4 STMicroelectronics Automotive Power Module Packaging Revenue (US$ Million) & (2018-2023)
5.4.5 STMicroelectronics Recent Developments
5.5 Fuji Electric
5.5.1 Fuji Electric Profile
5.5.2 Fuji Electric Main Business
5.5.3 Fuji Electric Automotive Power Module Packaging Products, Services and Solutions
5.5.4 Fuji Electric Automotive Power Module Packaging Revenue (US$ Million) & (2018-2023)
5.5.5 Fuji Electric Recent Developments
5.6 Toshiba Electronic Device & Storage Corporation
5.6.1 Toshiba Electronic Device & Storage Corporation Profile
5.6.2 Toshiba Electronic Device & Storage Corporation Main Business
5.6.3 Toshiba Electronic Device & Storage Corporation Automotive Power Module Packaging Products, Services and Solutions
5.6.4 Toshiba Electronic Device & Storage Corporation Automotive Power Module Packaging Revenue (US$ Million) & (2018-2023)
5.6.5 Toshiba Electronic Device & Storage Corporation Recent Developments
5.7 Semikron
5.7.1 Semikron Profile
5.7.2 Semikron Main Business
5.7.3 Semikron Automotive Power Module Packaging Products, Services and Solutions
5.7.4 Semikron Automotive Power Module Packaging Revenue (US$ Million) & (2018-2023)
5.7.5 Semikron Recent Developments
5.8 STATS ChipPAC
5.8.1 STATS ChipPAC Profile
5.8.2 STATS ChipPAC Main Business
5.8.3 STATS ChipPAC Automotive Power Module Packaging Products, Services and Solutions
5.8.4 STATS ChipPAC Automotive Power Module Packaging Revenue (US$ Million) & (2018-2023)
5.8.5 STATS ChipPAC Recent Developments
5.9 Starpower Semiconductor
5.9.1 Starpower Semiconductor Profile
5.9.2 Starpower Semiconductor Main Business
5.9.3 Starpower Semiconductor Automotive Power Module Packaging Products, Services and Solutions
5.9.4 Starpower Semiconductor Automotive Power Module Packaging Revenue (US$ Million) & (2018-2023)
5.9.5 Starpower Semiconductor Recent Developments
5.10 Bosch
5.10.1 Bosch Profile
5.10.2 Bosch Main Business
5.10.3 Bosch Automotive Power Module Packaging Products, Services and Solutions
5.10.4 Bosch Automotive Power Module Packaging Revenue (US$ Million) & (2018-2023)
5.10.5 Bosch Recent Developments
5.11 Toyota
5.11.1 Toyota Profile
5.11.2 Toyota Main Business
5.11.3 Toyota Automotive Power Module Packaging Products, Services and Solutions
5.11.4 Toyota Automotive Power Module Packaging Revenue (US$ Million) & (2018-2023)
5.11.5 Toyota Recent Developments
5.12 Mitsubishi
5.12.1 Mitsubishi Profile
5.12.2 Mitsubishi Main Business
5.12.3 Mitsubishi Automotive Power Module Packaging Products, Services and Solutions
5.12.4 Mitsubishi Automotive Power Module Packaging Revenue (US$ Million) & (2018-2023)
5.12.5 Mitsubishi Recent Developments
6 North America
6.1 North America Automotive Power Module Packaging Market Size by Country (2018-2029)
6.2 U.S.
6.3 Canada
7 Europe
7.1 Europe Automotive Power Module Packaging Market Size by Country (2018-2029)
7.2 Germany
7.3 France
7.4 U.K.
7.5 Italy
7.6 Russia
7.7 Nordic Countries
7.8 Rest of Europe
8 Asia-Pacific
8.1 Asia-Pacific Automotive Power Module Packaging Market Size by Region (2018-2029)
8.2 China
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
8.6 India
8.7 Australia
8.8 Rest of Asia-Pacific
9 Latin America
9.1 Latin America Automotive Power Module Packaging Market Size by Country (2018-2029)
9.2 Mexico
9.3 Brazil
9.4 Rest of Latin America
10 Middle East & Africa
10.1 Middle East & Africa Automotive Power Module Packaging Market Size by Country (2018-2029)
10.2 Turkey
10.3 Saudi Arabia
10.4 UAE
10.5 Rest of Middle East & Africa
11 Automotive Power Module Packaging Market Dynamics
11.1 Automotive Power Module Packaging Industry Trends
11.2 Automotive Power Module Packaging Market Drivers
11.3 Automotive Power Module Packaging Market Challenges
11.4 Automotive Power Module Packaging Market Restraints
12 Research Finding /Conclusion
13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer
13.4 Author List
Published By : QY Research
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