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Backside Grinding Tape-Global Market Insights and Sales Trends 2025
Synopsis
Backside Grinding Tape is a tape used to protect the surface of the wafer during back grinding after the IC circuit is formed on the wafer. It is pasted on the circuit surface to prevent damage to the circuit surface and contamination of the wafer surface, and plays a role in improving the precision of wafer grinding. The physical and chemical properties are particularly excellent, and the wafer patterns and chips are perfectly protected during the process.
The global Backside Grinding Tape market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Backside Grinding Tape in various end use industries. The expanding demands from the Semiconductor Wafer, Semiconductor Chip and Others,, are propelling Backside Grinding Tape market. UV Type, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Non-UV Type segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for Backside Grinding Tape market, driven by demand from China, the second largest economy with some signs of stabilising, the Backside Grinding Tape market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Backside Grinding Tape, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Backside Grinding Tape market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Backside Grinding Tape market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Backside Grinding Tape sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Backside Grinding Tape covered in this report include Furukawa Electric, LG Chem, Nitto Denko, Mitsui Chemicals, LINTEC, Denka, AI Technology, DSK Technologies and Minitron Elektronik, etc.
The global Backside Grinding Tape market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Furukawa Electric
LG Chem
Nitto Denko
Mitsui Chemicals
LINTEC
Denka
AI Technology
DSK Technologies
Minitron Elektronik
Disco Corporation
Fine Technology
AMC Co Ltd
Toyo Adtec
Force-One Applied Materials
Global Backside Grinding Tape market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Backside Grinding Tape market, Segment by Type:
UV Type
Non-UV Type
Global Backside Grinding Tape market, by Application
Semiconductor Wafer
Semiconductor Chip
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Backside Grinding Tape manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Backside Grinding Tape in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Backside Grinding Tape is a tape used to protect the surface of the wafer during back grinding after the IC circuit is formed on the wafer. It is pasted on the circuit surface to prevent damage to the circuit surface and contamination of the wafer surface, and plays a role in improving the precision of wafer grinding. The physical and chemical properties are particularly excellent, and the wafer patterns and chips are perfectly protected during the process.
The global Backside Grinding Tape market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Backside Grinding Tape in various end use industries. The expanding demands from the Semiconductor Wafer, Semiconductor Chip and Others,, are propelling Backside Grinding Tape market. UV Type, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Non-UV Type segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for Backside Grinding Tape market, driven by demand from China, the second largest economy with some signs of stabilising, the Backside Grinding Tape market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Backside Grinding Tape, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Backside Grinding Tape market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Backside Grinding Tape market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Backside Grinding Tape sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Backside Grinding Tape covered in this report include Furukawa Electric, LG Chem, Nitto Denko, Mitsui Chemicals, LINTEC, Denka, AI Technology, DSK Technologies and Minitron Elektronik, etc.
The global Backside Grinding Tape market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Furukawa Electric
LG Chem
Nitto Denko
Mitsui Chemicals
LINTEC
Denka
AI Technology
DSK Technologies
Minitron Elektronik
Disco Corporation
Fine Technology
AMC Co Ltd
Toyo Adtec
Force-One Applied Materials
Global Backside Grinding Tape market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Backside Grinding Tape market, Segment by Type:
UV Type
Non-UV Type
Global Backside Grinding Tape market, by Application
Semiconductor Wafer
Semiconductor Chip
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Backside Grinding Tape manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Backside Grinding Tape in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Backside Grinding Tape Market Overview
1.1 Backside Grinding Tape Product Overview
1.2 Backside Grinding Tape Market Segment by Type
1.2.1 UV Type
1.2.2 Non-UV Type
1.3 Global Backside Grinding Tape Market Size by Type
1.3.1 Global Backside Grinding Tape Market Size Overview by Type (2018-2029)
1.3.2 Global Backside Grinding Tape Historic Market Size Review by Type (2018-2023)
1.3.3 Global Backside Grinding Tape Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Backside Grinding Tape Sales Breakdown by Type (2018-2023)
1.4.2 Europe Backside Grinding Tape Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Backside Grinding Tape Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Backside Grinding Tape Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Backside Grinding Tape Sales Breakdown by Type (2018-2023)
2 Global Backside Grinding Tape Market Competition by Company
2.1 Global Top Players by Backside Grinding Tape Sales (2018-2023)
2.2 Global Top Players by Backside Grinding Tape Revenue (2018-2023)
2.3 Global Top Players by Backside Grinding Tape Price (2018-2023)
2.4 Global Top Manufacturers Backside Grinding Tape Manufacturing Base Distribution, Sales Area, Product Type
2.5 Backside Grinding Tape Market Competitive Situation and Trends
2.5.1 Backside Grinding Tape Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Backside Grinding Tape Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Backside Grinding Tape as of 2022)
2.7 Date of Key Manufacturers Enter into Backside Grinding Tape Market
2.8 Key Manufacturers Backside Grinding Tape Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Backside Grinding Tape Status and Outlook by Region
3.1 Global Backside Grinding Tape Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Backside Grinding Tape Historic Market Size by Region
3.2.1 Global Backside Grinding Tape Sales in Volume by Region (2018-2023)
3.2.2 Global Backside Grinding Tape Sales in Value by Region (2018-2023)
3.2.3 Global Backside Grinding Tape Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Backside Grinding Tape Forecasted Market Size by Region
3.3.1 Global Backside Grinding Tape Sales in Volume by Region (2024-2029)
3.3.2 Global Backside Grinding Tape Sales in Value by Region (2024-2029)
3.3.3 Global Backside Grinding Tape Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Backside Grinding Tape by Application
4.1 Backside Grinding Tape Market Segment by Application
4.1.1 Semiconductor Wafer
4.1.2 Semiconductor Chip
4.1.3 Others
4.2 Global Backside Grinding Tape Market Size by Application
4.2.1 Global Backside Grinding Tape Market Size Overview by Application (2018-2029)
4.2.2 Global Backside Grinding Tape Historic Market Size Review by Application (2018-2023)
4.2.3 Global Backside Grinding Tape Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Backside Grinding Tape Sales Breakdown by Application (2018-2023)
4.3.2 Europe Backside Grinding Tape Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Backside Grinding Tape Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Backside Grinding Tape Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Backside Grinding Tape Sales Breakdown by Application (2018-2023)
5 North America Backside Grinding Tape by Country
5.1 North America Backside Grinding Tape Historic Market Size by Country
5.1.1 North America Backside Grinding Tape Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Backside Grinding Tape Sales in Volume by Country (2018-2023)
5.1.3 North America Backside Grinding Tape Sales in Value by Country (2018-2023)
5.2 North America Backside Grinding Tape Forecasted Market Size by Country
5.2.1 North America Backside Grinding Tape Sales in Volume by Country (2024-2029)
5.2.2 North America Backside Grinding Tape Sales in Value by Country (2024-2029)
6 Europe Backside Grinding Tape by Country
6.1 Europe Backside Grinding Tape Historic Market Size by Country
6.1.1 Europe Backside Grinding Tape Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Backside Grinding Tape Sales in Volume by Country (2018-2023)
6.1.3 Europe Backside Grinding Tape Sales in Value by Country (2018-2023)
6.2 Europe Backside Grinding Tape Forecasted Market Size by Country
6.2.1 Europe Backside Grinding Tape Sales in Volume by Country (2024-2029)
6.2.2 Europe Backside Grinding Tape Sales in Value by Country (2024-2029)
7 Asia-Pacific Backside Grinding Tape by Region
7.1 Asia-Pacific Backside Grinding Tape Historic Market Size by Region
7.1.1 Asia-Pacific Backside Grinding Tape Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Backside Grinding Tape Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Backside Grinding Tape Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Backside Grinding Tape Forecasted Market Size by Region
7.2.1 Asia-Pacific Backside Grinding Tape Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Backside Grinding Tape Sales in Value by Region (2024-2029)
8 Latin America Backside Grinding Tape by Country
8.1 Latin America Backside Grinding Tape Historic Market Size by Country
8.1.1 Latin America Backside Grinding Tape Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Backside Grinding Tape Sales in Volume by Country (2018-2023)
8.1.3 Latin America Backside Grinding Tape Sales in Value by Country (2018-2023)
8.2 Latin America Backside Grinding Tape Forecasted Market Size by Country
8.2.1 Latin America Backside Grinding Tape Sales in Volume by Country (2024-2029)
8.2.2 Latin America Backside Grinding Tape Sales in Value by Country (2024-2029)
9 Middle East and Africa Backside Grinding Tape by Country
9.1 Middle East and Africa Backside Grinding Tape Historic Market Size by Country
9.1.1 Middle East and Africa Backside Grinding Tape Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Backside Grinding Tape Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Backside Grinding Tape Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Backside Grinding Tape Forecasted Market Size by Country
9.2.1 Middle East and Africa Backside Grinding Tape Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Backside Grinding Tape Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 Furukawa Electric
10.1.1 Furukawa Electric Company Information
10.1.2 Furukawa Electric Introduction and Business Overview
10.1.3 Furukawa Electric Backside Grinding Tape Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Furukawa Electric Backside Grinding Tape Products Offered
10.1.5 Furukawa Electric Recent Development
10.2 LG Chem
10.2.1 LG Chem Company Information
10.2.2 LG Chem Introduction and Business Overview
10.2.3 LG Chem Backside Grinding Tape Sales, Revenue and Gross Margin (2018-2023)
10.2.4 LG Chem Backside Grinding Tape Products Offered
10.2.5 LG Chem Recent Development
10.3 Nitto Denko
10.3.1 Nitto Denko Company Information
10.3.2 Nitto Denko Introduction and Business Overview
10.3.3 Nitto Denko Backside Grinding Tape Sales, Revenue and Gross Margin (2018-2023)
10.3.4 Nitto Denko Backside Grinding Tape Products Offered
10.3.5 Nitto Denko Recent Development
10.4 Mitsui Chemicals
10.4.1 Mitsui Chemicals Company Information
10.4.2 Mitsui Chemicals Introduction and Business Overview
10.4.3 Mitsui Chemicals Backside Grinding Tape Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Mitsui Chemicals Backside Grinding Tape Products Offered
10.4.5 Mitsui Chemicals Recent Development
10.5 LINTEC
10.5.1 LINTEC Company Information
10.5.2 LINTEC Introduction and Business Overview
10.5.3 LINTEC Backside Grinding Tape Sales, Revenue and Gross Margin (2018-2023)
10.5.4 LINTEC Backside Grinding Tape Products Offered
10.5.5 LINTEC Recent Development
10.6 Denka
10.6.1 Denka Company Information
10.6.2 Denka Introduction and Business Overview
10.6.3 Denka Backside Grinding Tape Sales, Revenue and Gross Margin (2018-2023)
10.6.4 Denka Backside Grinding Tape Products Offered
10.6.5 Denka Recent Development
10.7 AI Technology
10.7.1 AI Technology Company Information
10.7.2 AI Technology Introduction and Business Overview
10.7.3 AI Technology Backside Grinding Tape Sales, Revenue and Gross Margin (2018-2023)
10.7.4 AI Technology Backside Grinding Tape Products Offered
10.7.5 AI Technology Recent Development
10.8 DSK Technologies
10.8.1 DSK Technologies Company Information
10.8.2 DSK Technologies Introduction and Business Overview
10.8.3 DSK Technologies Backside Grinding Tape Sales, Revenue and Gross Margin (2018-2023)
10.8.4 DSK Technologies Backside Grinding Tape Products Offered
10.8.5 DSK Technologies Recent Development
10.9 Minitron Elektronik
10.9.1 Minitron Elektronik Company Information
10.9.2 Minitron Elektronik Introduction and Business Overview
10.9.3 Minitron Elektronik Backside Grinding Tape Sales, Revenue and Gross Margin (2018-2023)
10.9.4 Minitron Elektronik Backside Grinding Tape Products Offered
10.9.5 Minitron Elektronik Recent Development
10.10 Disco Corporation
10.10.1 Disco Corporation Company Information
10.10.2 Disco Corporation Introduction and Business Overview
10.10.3 Disco Corporation Backside Grinding Tape Sales, Revenue and Gross Margin (2018-2023)
10.10.4 Disco Corporation Backside Grinding Tape Products Offered
10.10.5 Disco Corporation Recent Development
10.11 Fine Technology
10.11.1 Fine Technology Company Information
10.11.2 Fine Technology Introduction and Business Overview
10.11.3 Fine Technology Backside Grinding Tape Sales, Revenue and Gross Margin (2018-2023)
10.11.4 Fine Technology Backside Grinding Tape Products Offered
10.11.5 Fine Technology Recent Development
10.12 AMC Co Ltd
10.12.1 AMC Co Ltd Company Information
10.12.2 AMC Co Ltd Introduction and Business Overview
10.12.3 AMC Co Ltd Backside Grinding Tape Sales, Revenue and Gross Margin (2018-2023)
10.12.4 AMC Co Ltd Backside Grinding Tape Products Offered
10.12.5 AMC Co Ltd Recent Development
10.13 Toyo Adtec
10.13.1 Toyo Adtec Company Information
10.13.2 Toyo Adtec Introduction and Business Overview
10.13.3 Toyo Adtec Backside Grinding Tape Sales, Revenue and Gross Margin (2018-2023)
10.13.4 Toyo Adtec Backside Grinding Tape Products Offered
10.13.5 Toyo Adtec Recent Development
10.14 Force-One Applied Materials
10.14.1 Force-One Applied Materials Company Information
10.14.2 Force-One Applied Materials Introduction and Business Overview
10.14.3 Force-One Applied Materials Backside Grinding Tape Sales, Revenue and Gross Margin (2018-2023)
10.14.4 Force-One Applied Materials Backside Grinding Tape Products Offered
10.14.5 Force-One Applied Materials Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Backside Grinding Tape Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Backside Grinding Tape Industrial Chain Analysis
11.4 Backside Grinding Tape Market Dynamics
11.4.1 Backside Grinding Tape Industry Trends
11.4.2 Backside Grinding Tape Market Drivers
11.4.3 Backside Grinding Tape Market Challenges
11.4.4 Backside Grinding Tape Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Backside Grinding Tape Distributors
12.3 Backside Grinding Tape Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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