The Market Reports

Synopsis
The global market for Bonder was estimated to be worth US$ 2572 million in 2024 and is forecast to a readjusted size of US$ 3748 million by 2031 with a CAGR of 4.9% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Bonder cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Wire Bonder, Die Bonder, and FC Bonder are specialized types of bonding machines used in the semiconductor industry for the assembly of integrated circuits (ICs) and other electronic components. Each serves a specific purpose in the manufacturing process:
Wire Bonder:
A wire bonder is a machine used to create wire bonds, which are electrical connections between the leads of a semiconductor device and the conductive pads on the die. This process is critical in packaging semiconductor devices. The wire bonder uses a fine wire (often gold or aluminum) to form a connection by creating a ball or wedge at the end of the wire, which is then pressed onto the pad on the die. There are two primary types of wire bonding:
Ball Bonder: This machine forms a ball at the end of the wire and uses it to make the first bond (the ball bond) on the die pad. The wire is then stretched to the lead and another bond (the stitch bond) is formed.
Wedge Bonder: This machine uses a wedge-shaped tool to bond the wire to the die pad and the lead.
Die Bonder:
A die bonder is a machine that attaches semiconductor dice (the individual chips or integrated circuits) to their packages. This is typically done using an adhesive, solder, or eutectic bonding. The die bonder positions the die with precision and applies the necessary force and heat to create a secure bond between the die and the package substrate. This process is essential for ensuring the mechanical and electrical integrity of the final semiconductor device.
FC Bonder (Flip Chip Bonder):
FC bonding, also known as flip chip bonding, is a technique where the die is mounted face-down onto a substrate, with the bond pads on the die's active surface directly connecting to the pads on the substrate. An FC bonder is designed to perform this process. The bonder can use various methods to attach the die, including soldering, conductive adhesive, or ultrasonic bonding. Flip chip technology is often used in high-performance applications due to its smaller footprint and better heat dissipation.
All these bonding machines are precision instruments that must maintain tight tolerances to ensure the reliability and performance of the electronic components they are used to assemble. They are equipped with advanced vision systems and control software to achieve the high accuracy required for these delicate operations.
Market DriversSemiconductor
Industry Growth: Rapid development in areas such as 5G, AI, IoT, automotive electronics, etc. is driving the demand for advanced packaging technologies, which in turn is increasing the demand for bonding machines.
Advanced Packaging Technologies: Popularity of technologies such as wafer level packaging (WLP), 3D packaging, and heterogeneous integration is driving the demand for high-precision bonding machines.
MEMS and Sensor Applications: Widespread use of MEMS and sensors in consumer electronics, automotive, medical, and other fields has increased the demand for bonding machines.
Miniaturisation and high performance trends: electronic devices are developing towards smaller, lighter and higher performance, requiring more precise bonding technology.
Emerging application fields: the development of emerging fields such as flexible electronics, wearable devices, AR/VR, etc. provides new growth points for the bonding machine market.
Market ChallengesHigh
Technical Threshold: The development and production of high-precision bonding machines requires a high level of technical accumulation, which restricts new entrants.
Cost pressure: High-end bonding machines are expensive, and small and medium-sized enterprises may face procurement pressure.
Supply Chain Risk: Uncertainty in the global supply chain may affect the production and delivery of bonding machines.
Market Trends
High Precision and Multifunctionality: As packaging technology becomes more complex, the market demand for high-precision and multifunctional bonding machines increases.
Automation and Intelligence: The application of automated bonding machines and intelligent production lines is gradually gaining popularity, improving production efficiency and consistency.
New bonding technologies: The development of new technologies such as laser bonding and low-temperature bonding has brought new opportunities to the bonding machine market.
Environmental protection and energy saving: the demand for environmentally friendly bonding machines and energy saving technologies is gradually increasing.
Regionalised production: In order to reduce supply chain risks, the production of bonding machines is gradually developing in the direction of regionalisation and localisation.
Regional Market Analysis
Asia-Pacific: The global centre of semiconductor and electronics manufacturing, especially China, South Korea, Japan and Taiwan, has the highest market demand.
North America: technological innovation and high-end manufacturing to drive market demand.
Europe: Strong demand in automotive and industrial electronics.
Other regions: the market is in the development stage with high potential.
Future OutlookWith
the continued development of semiconductor, MEMS, sensors and other fields, the bonding machine market will maintain rapid growth. High precision, automation, intelligence and the application of new bonding technology will become the main direction of future development.
Bonding machine market prospects, technological progress and industry demand is the main driving force. In the future, high precision, automation, intelligence and new bonding technology will become the mainstream of the market.
This report aims to provide a comprehensive presentation of the global market for Bonder, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Bonder by region & country, by Type, and by Application.
The Bonder market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Bonder.
Market Segmentation
By Company
Besi
ASMPT Ltd
Kulicke & Soffa
Shibaura
Shinkawa Ltd.
Fasford Technology
SUSS MicroTec
Hanmi
Palomar Technologies
Panasonic
Toray Engineering
Ultrasonic Engineering
Hesse GmbH
SET
F&K Delvotec
WestBond, Inc.
Hybond
DIAS Automation
Segment by Type
Wire Bonder
Die Bonder
FC Bonder
Segment by Application
Integrated device manufacturer (IDMs)
Outsourced semiconductor assembly and test (OSATs)
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Bonder manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Bonder in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Bonder in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index