The Market Reports

Synopsis

The global market for Chemical Mechanical Polishing Machine (CMP) was estimated to be worth US$ 3956 million in 2024 and is forecast to a readjusted size of US$ 6655 million by 2031 with a CAGR of 8.2% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Chemical Mechanical Polishing Machine (CMP) cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

Chemical Mechanical Polishing is more commonly known as CMP Polishing. This is the process where the top surface of a wafer is polished with a slurry containing an abrasive grit, suspended within reactive chemical agents.

The polishing action is partly mechanical and partly chemical. The mechanical element of the process applies downward pressure while the chemical reaction that takes place increases the material removal rate and this is usually tailored to suit the type of material being processed.

The proliferation of cutting-edge technologies, such as 5G, artificial intelligence, and the Internet of Things (IoT), has intensified the demand for innovative semiconductor solutions, further propelling the market. The trend towards miniaturization in electronics also requires highly precise and uniform polishing processes, making chemical mechanical planarization (CMP) indispensable in modern manufacturing. The expansion of industries such as automotive and consumer electronics, which rely on high-performance chips, further drives market demand.

Innovations in chemical mechanical planarization (CMP) materials and techniques, such as the development of eco-friendly slurries and processes, also present opportunities for differentiation and market expansion.

This report aims to provide a comprehensive presentation of the global market for Chemical Mechanical Polishing Machine (CMP), focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Chemical Mechanical Polishing Machine (CMP) by region & country, by Type, and by Application.

The Chemical Mechanical Polishing Machine (CMP) market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chemical Mechanical Polishing Machine (CMP).

Market Segmentation

By Company

• Applied Materials
• Ebara Corporation
• KC Tech
• ACCRETECH
• Tianjin Huahaiqingke
• Logitech
• Revasum
• Alpsitec
• Semicore Microelectronics
• Sizone Tech
• Okamoto Machine Tool

Segment by Type

• 300mm Polishing Machine
• 200mm Polishing Machine
• Others

Segment by Application

• Semiconductor Plants
• Research Institutes

Segment by Region

• North America: United States, Canada, and Mexico
• Europe: United Kingdom, Germany, France, Spain, Italy, and Rest of Europe
• Asia Pacific: China, India, Japan, Australia, South Korea, and Rest of Asia Pacific
• Middle East & Africa: Saudi Arabia, South Africa, and Rest of MEA
• Latin America: Brazil, Argentina, and Rest of Latin America

*If you need a regional or country-specific version, or customized segmentation, we can tailor the report to your requirements.