The Market Reports

Synopsis
The global market for Copper Paste for PCB was estimated to be worth US$ 132 million in 2024 and is forecast to a readjusted size of US$ 186 million by 2031 with a CAGR of 5.5% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Copper Paste for PCB cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Copper paste for PCB (Printed Circuit Board) refers to a conductive material used in the manufacturing and repair of electronic circuit boards. It typically consists of finely powdered copper particles suspended in a binder or carrier medium. Copper paste for PCB has high conductivity, fine particle size, and oxidation resistance. It can be applied to the surface of pcb in the form of paste. The paste undergoes a heat treatment process, causing the copper particles to fuse together and form a conductive copper layer on the board. It can be customized according to specific thickness requirements and is widely used in consumer, electronics, communications, industrial/medical, automotive, military/aerospace and other fields.
With the continued miniaturization of electronic devices, the need for High-Density Interconnects (HDI) has surged. The increasing demand for HDI PCBs requires copper paste that can form fine, precise traces with higher reliability. This has led to the development of advanced copper paste formulations capable of handling finer features and maintaining conductivity over smaller surface areas. The rise of flexible, wearable electronics and IoT (Internet of Things) devices requires PCBs that can bend, stretch, and flex without compromising performance. Copper paste formulations are evolving to become more flexible and to adhere better to non-rigid substrates like polyimide. This allows for the creation of flexible PCBs (FPCBs) that are used in wearable devices, medical patches, and foldable displays.
There is increasing demand for PCBs that can handle high-speed signals and high-power applications, such as in 5G networks, automotive electronics, and high-frequency RF (Radio Frequency) devices. Copper paste must provide superior electrical conductivity, thermal dissipation, and lower resistance to handle high-frequency applications. This has led to the development of highly conductive copper pastes, sometimes incorporating additional materials like silver or carbon to boost performance. As demand for PCBs grows across industries such as automotive, telecommunications, and consumer electronics, manufacturers are focused on optimizing production costs while maintaining high quality. Advances in copper paste production are aiming to lower costs by improving material efficiency, enhancing manufacturing processes, and reducing waste. Additionally, manufacturers are exploring new ways to scale production without compromising paste quality.
This report aims to provide a comprehensive presentation of the global market for Copper Paste for PCB, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Copper Paste for PCB by region & country, by Type, and by Application.
The Copper Paste for PCB market size, estimations, and forecasts are provided in terms of sales volume (Tons) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Copper Paste for PCB.
Market Segmentation
By Company
Sumitomo Metal Mining
Kyoto Elex
Tatsuta
Chang Sung Corporation
NAMICS
Mitsuboshi Belting
Asahi Solder
Heraeus
Shoei Chemical
Asahi Chemical
Yuhon
Copprint
PrintCB
Ample Electronic Technology
Segment by Type
Low Temperature Sintered
Medium Temperature Sintered
High Temperature Sintered
Segment by Application
Consumer Electronics
Communications
Industrial/Medical
Automotive
Military/Aerospace
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Copper Paste for PCB manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Copper Paste for PCB in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Copper Paste for PCB in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index