The Market Reports

Synopsis
The global market for Cu-Diamond was estimated to be worth US$ 165 million in 2024 and is forecast to a readjusted size of US$ 371 million by 2031 with a CAGR of 12.4% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Cu-Diamond cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Cu-Diamond is a composite material of diamond powder and copper alloy. High quality artificially synthesized diamond powder is used, which has a thermal conductivity of around 600W/M.K and an extremely low coefficient of thermal expansion. Under appropriate processes, diamond particles can form metallurgical bonding interfaces with copper alloys, resulting in copper diamond composite materials with excellent thermal conductivity and suitable coefficient of thermal expansion.
Pure copper has good conductivity and high thermal conductivity (385-400W/(m · K)), which is about 1.7 times that of pure aluminum. Its CTE is 17 × 10-6/K, which is also lower than that of pure aluminum (23 × 10-6/K). Compared with aluminum based composite materials, copper based composite materials only need to add a smaller amount of reinforcement, and their thermal expansion coefficient can match that of semiconductors, making it easier to obtain higher thermal conductivity. More importantly, copper based composite materials can not only integrate high thermal conductivity and low coefficient of expansion to meet thermal management functional characteristics, but also have good heat resistance, corrosion resistance, and chemical stability, which can meet the requirements of extreme service conditions such as high temperature and corrosive environment to a greater extent, such as nuclear power engineering, acid-base and dry wet hot cold alternating atmospheric environment, etc. Therefore, when density is not the primary consideration factor, copper based composite materials are often the ideal choice for advanced thermal management materials, especially diamond copper composite materials, which have become one of the research hotspots of metal based composite materials in recent years. It is expected that with the development of satellite communication and advanced autonomous driving, as well as the commercialization of 6G communication, the global demand for this material will rapidly increase.
This report aims to provide a comprehensive presentation of the global market for Cu-Diamond, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Cu-Diamond by region & country, by Type, and by Application.
The Cu-Diamond market size, estimations, and forecasts are provided in terms of sales volume (K Pcs) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Cu-Diamond.
Market Segmentation
By Company
Parker
A.L.M.T. Corp (Sumitomo Electric Industries)
Element Six
Qnnect
Xi’An TRUSUNG Advanced Material
Changsha Saneway Electronic Materials
Tiger Technologies
TGS
Segment by Type
Thermal Conductivity 550w/(m·k)
Thermal Conductivity 600w/(m·k)
Others
Segment by Application
Electronic Product
Aerospace
Communication Equipment
Automobile
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Cu-Diamond manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Cu-Diamond in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Cu-Diamond in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index