The Market Reports

Synopsis
The global market for DCB and AMB Substrates for Power Modules was estimated to be worth US$ 947 million in 2024 and is forecast to a readjusted size of US$ 2041 million by 2031 with a CAGR of 12.2% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on DCB and AMB Substrates for Power Modules cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic. This report studies the DBC ceramic substrate, including the AlN DBC Ceramic Substrate and Al2O3 DBC Ceramic Substrate. Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.
The global DBC ceramic substrates market is dominated by few players like Rogers Corporation, Ferrotec, NGK Electronics Devices, KCC, Shengda Tech, BYD, Heraeus Electronics and Nanjing Zhongjiang New Material, etc. Global five players hold a share over 79.8 percent in 2024. In recent years, more and more Chinese players enter the DBC ceramic substrates market, driven by the rapid growth of new energy vehicles in China market. In future, the Chinese players will play more roles around the world.
The global key manufacturers of AMB Ceramic Substrate include Rogers Corporation, Ferrotec, BYD, Toshiba Materials, Heraeus Electronics, Denka, Proterial and Mitsubishi Materials, etc. In 2023, the global top eight players had a share approximately 85% in terms of revenue.
Currently the AMB ceramic substrates are mainly produced in Japan, Germany and China, which account for 27.3%, 24.56% and 43.5% of the market share respectively in 2023. It is expected that China's production share will reach 57% in 2030. As NGK Electronics Devices and Ferrotec have started or built factories to produce AMB in Malaysia, Southeast Asia is expected to play an important role as a production base in the next few years.
This report aims to provide a comprehensive presentation of the global market for DCB and AMB Substrates for Power Modules, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of DCB and AMB Substrates for Power Modules by region & country, by Type, and by Application.
The DCB and AMB Substrates for Power Modules market size, estimations, and forecasts are provided in terms of sales volume (Square Meters) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding DCB and AMB Substrates for Power Modules.
Market Segmentation
By Company
Rogers Corporation
Heraeus Electronics
Kyocera
NGK Electronics Devices
Toshiba Materials
Denka
DOWA METALTECH
KCC
Proterial
Mitsubishi Materials
Jiangsu Fulehua Semiconductor Technology
BYD
Bomin Electronics
Zhejiang TC Ceramic Electronic
Shengda Tech
Beijing Moshi Technology
Nantong Winspower
Wuxi Tianyang Electronics
Fengpeng Electronics (Zhuhai)
Guangzhou Xianyi Electronic Technology
Fujian Huaqing Electronic Material Technology
Konfoong Materials International
Littelfuse IXYS
FJ Composite
Zhejiang Jingci Semiconductor
Taotao Technology
Guangde Dongfeng Semiconductor
Anhui Taoxinke Semiconductor
Suzhou Aicheng Technology
Segment by Type
DBC Ceramic Substrates
AMB Ceramic Substrate
Segment by Application
Automotive Power Modules
PV and Wind Power
Industrial Drives
Rail Transport
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of DCB and AMB Substrates for Power Modules manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of DCB and AMB Substrates for Power Modules in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of DCB and AMB Substrates for Power Modules in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index