The Market Reports

Synopsis
The global market for Die Sorting Equipment was estimated to be worth US$ 355 million in 2024 and is forecast to a readjusted size of US$ 530 million by 2031 with a CAGR of 5.7% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Die Sorting Equipment cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Die sorting equipment, often referred to as die sorters, are machines used in semiconductor manufacturing to sort and categorize individual dies based on various criteria such as performance, electrical characteristics, or defects. These machines play a crucial role in the production of integrated circuits (ICs) and other electronic devices by ensuring that only dies meeting specific quality standards are used in the assembly process.
The global die sorting equipment market plays a critical role in the semiconductor backend process, facilitating the precise placement of individual semiconductor dies onto substrates or packages. As semiconductor node geometries shrink and chip integration increases, the need for high-throughput, high-precision die sorting solutions has become more pressing. The market is currently led by key players such as KLA-Tencor, YAC Garter, and Ueno Seiki, with the top three vendors collectively accounting for approximately 37% of the global market. These companies are recognized for their continuous innovation in automation, vision inspection, and throughput efficiency, positioning them as integral players in an industry characterized by rapid technological advancement and tight production tolerances.
Asia-Pacific (APAC) dominates the global market, commanding an overwhelming share of approximately 83%, driven by the region's concentration of semiconductor foundries, outsourced semiconductor assembly and test (OSAT) facilities, and electronics manufacturing hubs. Countries like Taiwan, South Korea, China, and Japan serve as the backbone of global semiconductor packaging and assembly, with substantial capital investments flowing into advanced packaging and heterogeneous integration. The presence of high-volume manufacturing in APAC, coupled with government support and robust supply chain infrastructure, continues to propel regional demand for die sorting equipment.
From a product segmentation perspective, High Speed Die Sorting systems account for around 83% of total market share, reflecting the industry’s strong preference for equipment that supports ultra-fast die placement and sorting accuracy. These systems are particularly vital for applications requiring high throughput, such as mobile processors, memory chips, and sensors. Technological enhancements in vision alignment, defect detection, and wafer mapping have further optimized these machines for large-scale, defect-free production environments.
In terms of application, OSATs (Outsourced Semiconductor Assembly and Test providers) represent the largest end-user segment, capturing roughly 76% of the market. These players rely heavily on die sorting equipment to meet the stringent quality and delivery expectations of global chipmakers and systems integrators. As advanced packaging technologies—such as 2.5D/3D ICs, chiplets, and fan-out wafer-level packaging—gain traction, OSATs are increasingly demanding flexible, high-performance die sorting platforms. Looking ahead, the global die sorting equipment market is expected to remain on a growth trajectory, supported by expanding semiconductor demand, the proliferation of AI and 5G applications, and the shift toward more complex chip architectures that require precision back-end manufacturing solutions.
This report aims to provide a comprehensive presentation of the global market for Die Sorting Equipment, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Die Sorting Equipment by region & country, by Type, and by Application.
The Die Sorting Equipment market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Die Sorting Equipment.
Market Segmentation
By Company
KLA-Tencor
YAC Garter
Ueno Seiki
MPI Corporation
Semiconductor Technologies & Instruments Pte Ltd
Air-Vac Automation
Suzhou MTS Automation Equipment
Mühlbauer
Canon Machinery
Cohu
Hangzhou Changchuan Technology
Royce Instruments
Syagrus Systems
Segment by Type
High Speed Die Sorting
Standard Speed Die Sorting
Segment by Application
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Die Sorting Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Die Sorting Equipment in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Die Sorting Equipment in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index