The Market Reports

Synopsis
The global market for Dry Etching Equipment was estimated to be worth US$ 12500 million in 2024 and is forecast to a readjusted size of US$ 19190 million by 2031 with a CAGR of 6.4% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Dry Etching Equipment cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface.
Currently, global production of Dry Etching Equipment is concentrated. The top three manufacturers held 92.16% of the market, in terms of Dry Etching Equipment sales value in 2019. As for the region, APAC is the largest consumption region, holding 76.07% sales revenue market share in 2019, followed by North America, with 13% market share.
With the continuous reduction of integrated circuit process, especially the production of 7nm-28nm advanced process, the demand for dry etching equipment continues to increase. Since DUV lithography machines are limited by the wavelength of light, wafer fabs need to adopt multiple mask processes and use etching processes to achieve smaller sizes. The etching process required for 7nm integrated circuit production is 140 times, which is 2.5 times the 40 times required for 28nm production.
Etching equipment accounts for the highest proportion in the global semiconductor equipment market.
Global competition:
The global etching equipment market presents a highly concentrated competition pattern, with international giants such as Lam Research, Applied Materials, and Tokyo Electron occupying a dominant position. These companies have advanced technology and rich customer resources and have strong competitiveness in the global market.
Chinese competition:
In the Chinese market, local companies such as AMEC and North Huachuang have strong competitiveness in the field of etching machines and have become leading companies in the domestic etching machine industry. These companies continue to increase R&D investment, improve product performance and technical level, and actively seize market share.
Technological progress:
With the continuous advancement of semiconductor technology, the line width of integrated circuits continues to decrease, and the requirements for etching equipment are getting higher and higher.
The development of 3D integrated circuits has promoted the development of etching technology. For example, the competition for the number of stacking layers of 3D NAND has put forward higher requirements for high aspect ratio etching and multi-stack stacking technology.
Market demand:
The rapid development of artificial intelligence, 5G, Internet of Things and other fields has driven the increase in demand for semiconductor chips, which in turn has promoted the growth of the etching equipment market.
Mainland China has become the world's largest semiconductor equipment market for four consecutive years, and the number of new wafer fab projects ranks first in the world, providing a broad development space for the dry etching equipment market.
Policy support:
The Chinese government has continuously issued relevant policies to support the development of the semiconductor industry, including increasing R&D investment and improving the localization rate, which will further promote the growth of the dry etching equipment market.
In summary, the dry etching equipment market has broad development prospects and huge market potential. With technological progress, increased market demand and continuous strengthening of policy support, the dry etching equipment market will continue to grow.
This report aims to provide a comprehensive presentation of the global market for Dry Etching Equipment, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Dry Etching Equipment by region & country, by Type, and by Application.
The Dry Etching Equipment market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Dry Etching Equipment.
Market Segmentation
By Company
Lam Research
Tokyo Electron Limited
Applied Materials
Hitachi High-Tech
SEMES
AMEC
NAURA
SPTS Technologies (KLA)
Oxford Instruments
ULVAC
Plasma-Therm
GigaLane
VM
Jusung Engineering
SAMCO
Segment by Type
Inductively Coupled Plasma (ICP)
Capacitive Coupled Plasma (CCP)
Reactive Ion Etching (RIE)
Deep Reactive Ion Etching (DRIE)
Others
Segment by Application
Logic and Memory
MEMS
Power Device
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Dry Etching Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Dry Etching Equipment in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Dry Etching Equipment in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index