The Market Reports

Synopsis
The global market for Electroless Plating Solutions was estimated to be worth US$ 4515 million in 2024 and is forecast to a readjusted size of US$ 6317 million by 2031 with a CAGR of 4.9% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Electroless Plating Solutions cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Electroless Plating Solution is a surface treatment solution that deposits a metal or alloy film on the surface of a material through an autocatalytic chemical reduction reaction. The biggest difference between chemical plating and electroplating is the way to drive the deposition of the coating.
This article focuses on all types of Electroless Plating Solutions, including ENEPIG, ENIG, Electroless Nickel, Electroless Gold, Electroless Copper, Electroless Tin, and Electroless Silver.
From the perspective of different process solution systems, the mainstream Electroless Plating Solutions include ENIG, ENEPIG, Electroless Plating copper, Electroless Plating nickel, Electroless Plating tin, Electroless Plating gold, Electroless Plating silver, etc. Different solution systems have different application scenarios. For example, Electroless Plating nickel is the most widely used, such as PCB, semiconductors, automobiles, industrial machinery, petrochemicals and other scenarios, while ENIG and ENEPIG are mainly used in PCB and semiconductors. At present, Electroless Plating copper solution accounts for the highest proportion in the entire application. With the increase in the market penetration rate of semiconductor advanced packaging substrates, ENIG and ENEPIG are expected to exceed 27% of the market share of ENIG and ENEPIG solutions by 2031 due to their own advantages.
At present, the core manufacturers of Electroless Plating Solutions in the world mainly include C. Uyemura & Co, Atotech (MKS), Dupont, MacDermid Enthone Industrial Solutions, JCU Corporation, YMT, MK Chem & Tech Co., Ltd, GHTECH, OKUNO Chemical Industries, etc. It is expected that the industry competition will be more significant in the next few years, and the market will be fragmented, but the high-end application market will still be dominated by leading companies. In the global high-end PCB field, the mainstream companies of Electroless Plating Solutions include Atotech (MKS), MacDermid Enthone Industrial Solutions, etc. These companies still have obvious advantages over Chinese local companies in terms of brand awareness, product technology, etc. In recent years, with the expansion of downstream market demand and the continuous improvement of industry technology level, industries such as PCB, electronic semiconductors, and new energy vehicles are facing good development opportunities. Chinese local manufacturers (GHTECH, Guangzhou Sanfu New Materials Technology Co., Ltd, Guangdong Skychem Technology, etc.) are also gradually emerging in the domestic market in China, relying on their technological innovation and localized services to gradually expand their market share.
The future trends of Electroless Plating Solutions are mainly reflected in the following aspects:
1. High performance and customization: With the development of high-end PCB, advanced semiconductor packaging, automotive electronics, optical sensors, aerospace and other fields, higher requirements are put forward for Electroless Plating Solutions, such as high uniformity, high purity, ultra-thin coating, environmentally friendly cyanide-free process, etc. Electroless Plating Solutions will gradually develop in the direction of high performance and customization. Among them, high uniformity is mainly reflected in the precision of the potion formula. In IC substrates and wafer-level packaging applications, the spacing of fine lines is getting smaller and smaller, reaching the sub-micron level, which requires the chemical plating layer to maintain extremely high uniformity on the entire substrate surface to avoid problems such as overplating.
2. Environmental protection: Global environmental protection regulations are becoming stricter (such as RoHS, REACH, and China's green manufacturing system), which promotes Electroless Plating Solutions to present three major industry trends: 1) Accelerated iteration of cyanide-free gold salt technology; 2) Improved penetration of low-toxic reducing agents; 3) Expansion of the market scale of environmentally friendly Electroless Plating Solutions.
3. Low-phosphorus/phosphorus-free process: Traditional Electroless Plating nickel mainly uses sodium hypophosphite as a reducing agent, resulting in a high phosphorus content in the Ni-P alloy coating, generally around 10%. With technological innovation and development, downstream industries have higher requirements for the reliability and environmental protection of the solution. For example, in high-frequency, high-speed communications and data transmission, high-phosphorus Ni-P is prone to signal loss, and low-phosphorus/phosphorus-free Electroless Plating nickel can significantly improve transmission efficiency.
This report aims to provide a comprehensive presentation of the global market for Electroless Plating Solutions, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Electroless Plating Solutions by region & country, by Type, and by Application.
The Electroless Plating Solutions market size, estimations, and forecasts are provided in terms of sales volume (Tons) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electroless Plating Solutions.
Market Segmentation
By Company
C. Uyemura & Co
Atotech (MKS)
Dupont
MacDermid Enthone Industrial Solutions
OKUNO Chemical Industries
JCU Corporation
GHTECH
Guangdong Skychem Technology
Shenzhen Baikal Electronic Materials Co., Ltd
Jetchem
Guangzhou Sanfu New Materials Technology Co., Ltd
Shenzhen Chuangzhi Success Technology
HLHC
Shenhzen Yicheng
Shenzhen Hotchain
Shenzhen ZhengTianWei Science&Technology
Shenzhen Songbai
TANAKA
Shenzhen Xingjingwei
Kanigen
Guangdong Shuo Cheng Technology
Hubei Harvar
YMT
MK Chem & Tech Co., Ltd
JX Advanced Metals Corp
PacTech
KPM Tech Vina
Japan Pure Chemical
Micron Coatings Group
Argos
KC Jones Plating Company
Segment by Type
ENEPIG
ENIG
Electroless Nickel Solution
Electroless Copper Solution
Electroless Gold Solution
Electroless Tin Solution
Electroless Silver and Others
Segment by Application
Semiconductor
PCB
Automotive
Decoration
Optical Devices
Aerospace
Electrical Appliances
Industrial Machinery
Petrochemical
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Electroless Plating Solutions manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Electroless Plating Solutions in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Electroless Plating Solutions in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index