The Market Reports

Synopsis
The global market for Electron Beam Metrology & Inspection Equipment was estimated to be worth US$ 3126 million in 2024 and is forecast to a readjusted size of US$ 4960 million by 2031 with a CAGR of 6.8% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Electron Beam Metrology & Inspection Equipment cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Semiconductor Metrology & Inspection Equipment runs through every process of wafer manufacturing, from design verification to process control detection to wafer testing and finished product testing. Metrology & Inspection Equipment plays a vital role in controlling and improving the yield of wafer manufacturing. According to the testing link, semiconductor Metrology & Inspection can be divided into front-end inspection and back-end inspection. Front-end Metrology & Inspection occurs in the wafer preparation and silicon wafer manufacturing process, including the Metrology of various film thicknesses, nanostructure critical dimensions (CD), overlay errors and other dimensional parameters formed in the silicon wafer manufacturing process, and wafer surface defects, to ensure that the yield of the processing line is controlled above the specified level. According to different functions, front-end Metrology & Inspection equipment is divided into Metrology and defect inspection. The former is mainly for film thickness, film stress, critical dimensions, doping concentration, etc., and the latter is mainly used for wafer surface defect inspection, which is one of the keys to process control and yield management in semiconductor manufacturing.
The purpose of defect inspection is to accurately identify, locate and classify key defects (DOI, which refers to any defect type that is considered to have an impact on yield, reliability or performance) on the inspected wafer, thereby helping defect and yield engineers to quickly resolve defect problems, which is of great significance for wafer fabs to reduce production costs and improve wafer yield.
Electron Beam Metrology & Inspection Equipment plays a vital role in semiconductor manufacturing, and is mainly used for inspection of physical defects and electrical defects of wafers and integrated circuits, as well as the size Metrology of key graphics. These devices use electron beams to scan the wafers to be tested, obtain high-resolution electron beam images, and use different algorithms to analyze information such as defects and key dimensions on the wafers.
Electron Beam Metrology & Inspection Equipment includes three core equipments, each of which realizes precise control in semiconductor manufacturing through differentiated algorithms: DR-SEM performs sampling positioning based on the defect coordinates provided by optical detection, and completes defect authenticity identification and classification verification by collecting high-resolution SEM images; Electron beam wafer defect inspection equipment (EBI) adopts full scanning detection mode, batch acquires SEM images in the specified area according to the preset detection formula, and uses intelligent analysis algorithms to directly identify and classify micron to nanometer physical/potential defects; CD-SEM focuses on precise size control, accurately reaches the preset measurement coordinates through the automatic focus system, and after collecting images of specific areas, uses pixel-level computing technology to achieve nanometer-level measurement of key structural parameters such as line width and aperture, and feeds back the measurement data to the process equipment in real time to form a closed-loop control. The three types of equipment respectively undertake the functions of defect review, comprehensive screening and precise measurement through algorithm optimization, and jointly build a quality assurance system for advanced semiconductor processes.
From the production side, the core production areas of Electron Beam Metrology & Inspection Equipment are mainly the United States, Europe, Japan and China, among which the United States is the main production area, accounting for 46.5% of the market share in 2024. There are still large differences between Chinese Electron Beam Metrology & Inspection Equipment companies and international leading companies (such as Applied Materials and Hitachi High-Tech) in the application, technology, and product performance of advanced support fields. However, as the localization process of Chinese local manufacturers accelerates, some Chinese local companies have also gained a certain market share in the electron beam inspection and measurement equipment market, such as Jingce Electronic and DJEL. In addition, in recent years, there have been many new entrants from Chinese local enterprises, such as Wellrun Microelectronics, Suzhou Siscantech, Beijing Hengren, Wuxi Genxinyue Technology Co., Ltd, Suzhou AISTech, etc. However, at present, their scale is relatively small or some are still in the Demo stage. With the future development of China's semiconductor market, it is expected that the global competitive share of Chinese local manufacturers will gradually increase in the next few years, and China will maintain the fastest growth rate. With the advancement of China's Electron Beam Metrology & Inspection Equipment technology, the emergence of cost advantages and the strengthening of policy support, it is expected that the share will reach 4.9% in 2031.
In the future, as DRAM (high-bandwidth storage) and NAND technologies continue to become investment hotspots, the three-dimensional stacking architecture and performance limits of memory chips will place higher demands on semiconductor front-end Metrology & Inspection equipment. In order to meet the challenges of increased storage unit density and more complex processes, wafer inspection equipment needs to iterate to sub-nanometer precision and simultaneously develop full-dimensional inspection capabilities for defect location, material property analysis, and three-dimensional structure characterization. This technology upgrade that integrates optics, electron beams, and AI algorithms is becoming a key breakthrough direction for memory chip yield control and industry chain autonomy.
This report aims to provide a comprehensive presentation of the global market for Electron Beam Metrology & Inspection Equipment, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Electron Beam Metrology & Inspection Equipment by region & country, by Type, and by Application.
The Electron Beam Metrology & Inspection Equipment market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electron Beam Metrology & Inspection Equipment.
Market Segmentation
By Company
Applied Materials
Hitachi High-Tech
ASML
KLA
Advantest
Holon Co., Ltd
Wuhan Jingce Electronic Group
DJEL
Wellrun Microelectronics
Suzhou Siscantech
Beijing Hengren
Segment by Type
Electron Beam Metrology Equipment
Electron Beam Inspection Equipment
Segment by Application
Wafer
Mask
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Electron Beam Metrology & Inspection Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Electron Beam Metrology & Inspection Equipment in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Electron Beam Metrology & Inspection Equipment in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index