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Electronic Solder Paste-Global Market Insights and Sales Trends 2025
Synopsis
The global Electronic Solder Paste market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Electronic Solder Paste in various end use industries. The expanding demands from the LTCC, Chip Inductors, Piezoelectric Ceramic and LEDs, are propelling Electronic Solder Paste market. Internal Electrode Paste, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the External Electrode Paste segment is estimated at % CAGR for the next seven-year period.
The driving factors for the use of electronic solder paste include:
1. Efficient and Reliable Soldering: Electronic solder paste provides efficient and reliable soldering of electronic components. It ensures strong and consistent connections, allowing for the proper flow and adhesion of solder to the electronic joints.
2. Flux Integration: Solder paste incorporates flux, which helps remove oxides and contaminants from the soldering surface. This flux integration simplifies the soldering process, eliminates the need for separate flux application, and ensures better wetting and bonding of the solder.
3. Fine-Pitch Component Assembly: Solder paste is suitable for fine-pitch component assembly, where small solder joints are required in crowded electronic circuit boards. Its composition and consistency allow for precise dispensing and accurate placement of solder in tight spaces.
4. Ease of Use: Solder paste is typically supplied in a syringe or tubular form, making it easy to handle and apply. Its viscosity and flow properties are designed for convenient dispensing through automated screen printing or dispensing equipment, allowing for high-volume production.
5. Solder Joint Visual Inspection: The uniform and paste-like consistency of solder paste assists in the visual inspection of solder joints after the soldering process. This facilitates quality control and ensures that satisfactory solder connections are achieved.
6. Solder Alloy Compatibility: Solder paste is available in different solder alloys, such as lead-based (Pb) or lead-free options (e.g., SAC305 or SnAgCu), ensuring compatibility with various electronic assembly processes and regulatory requirements.
7. Reduced Solder Waste: Solder paste allows for precise application, minimizing the amount of excess solder and reducing material waste. This is particularly important for high-volume manufacturing, where efficient use of materials is crucial for cost-effectiveness.
8. Compatibility with Reflow Soldering: Solder paste is specifically designed for reflow soldering processes, which involve the use of heating to melt and re-solidify the solder. It ensures proper wetting and bonding during thermal cycles encountered in reflow profiles, leading to reliable solder joints.
9. Industry Standards and Consistency: Solder paste manufacturers often adhere to industry standards and specifications (e.g., J-STD-004, IPC), ensuring consistency, reliability, and compatibility with common assembly processes and equipment.
Overall, the driving factors for the use of electronic solder paste encompass efficient and reliable soldering, flux integration, suitability for fine-pitch component assembly, ease of use, solder joint visual inspection, solder alloy compatibility, reduced solder waste, compatibility with reflow soldering, and adherence to industry standards. These factors contribute to the broad usage of electronic solder paste in the electronics assembly industry, enabling the assembly of complex electronic circuitry with high reliability and efficiency.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Electronic Solder Paste, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Electronic Solder Paste market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Electronic Solder Paste market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Electronic Solder Paste sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Electronic Solder Paste covered in this report include SRA Soldering Products, RadioShack, Noritake, Kester, Tamura, Pulsar Process Measurement, Alpha Assembly Solutions and Heraeus, etc.
The global Electronic Solder Paste market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
SRA Soldering Products
RadioShack
Noritake
Kester
Tamura
Pulsar Process Measurement
Alpha Assembly Solutions
Heraeus
Global Electronic Solder Paste market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Electronic Solder Paste market, Segment by Type:
Internal Electrode Paste
External Electrode Paste
Global Electronic Solder Paste market, by Application
LTCC
Chip Inductors
Piezoelectric Ceramic
LEDs
Circuit Board
Other
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Electronic Solder Paste manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Electronic Solder Paste in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
The global Electronic Solder Paste market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Electronic Solder Paste in various end use industries. The expanding demands from the LTCC, Chip Inductors, Piezoelectric Ceramic and LEDs, are propelling Electronic Solder Paste market. Internal Electrode Paste, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the External Electrode Paste segment is estimated at % CAGR for the next seven-year period.
The driving factors for the use of electronic solder paste include:
1. Efficient and Reliable Soldering: Electronic solder paste provides efficient and reliable soldering of electronic components. It ensures strong and consistent connections, allowing for the proper flow and adhesion of solder to the electronic joints.
2. Flux Integration: Solder paste incorporates flux, which helps remove oxides and contaminants from the soldering surface. This flux integration simplifies the soldering process, eliminates the need for separate flux application, and ensures better wetting and bonding of the solder.
3. Fine-Pitch Component Assembly: Solder paste is suitable for fine-pitch component assembly, where small solder joints are required in crowded electronic circuit boards. Its composition and consistency allow for precise dispensing and accurate placement of solder in tight spaces.
4. Ease of Use: Solder paste is typically supplied in a syringe or tubular form, making it easy to handle and apply. Its viscosity and flow properties are designed for convenient dispensing through automated screen printing or dispensing equipment, allowing for high-volume production.
5. Solder Joint Visual Inspection: The uniform and paste-like consistency of solder paste assists in the visual inspection of solder joints after the soldering process. This facilitates quality control and ensures that satisfactory solder connections are achieved.
6. Solder Alloy Compatibility: Solder paste is available in different solder alloys, such as lead-based (Pb) or lead-free options (e.g., SAC305 or SnAgCu), ensuring compatibility with various electronic assembly processes and regulatory requirements.
7. Reduced Solder Waste: Solder paste allows for precise application, minimizing the amount of excess solder and reducing material waste. This is particularly important for high-volume manufacturing, where efficient use of materials is crucial for cost-effectiveness.
8. Compatibility with Reflow Soldering: Solder paste is specifically designed for reflow soldering processes, which involve the use of heating to melt and re-solidify the solder. It ensures proper wetting and bonding during thermal cycles encountered in reflow profiles, leading to reliable solder joints.
9. Industry Standards and Consistency: Solder paste manufacturers often adhere to industry standards and specifications (e.g., J-STD-004, IPC), ensuring consistency, reliability, and compatibility with common assembly processes and equipment.
Overall, the driving factors for the use of electronic solder paste encompass efficient and reliable soldering, flux integration, suitability for fine-pitch component assembly, ease of use, solder joint visual inspection, solder alloy compatibility, reduced solder waste, compatibility with reflow soldering, and adherence to industry standards. These factors contribute to the broad usage of electronic solder paste in the electronics assembly industry, enabling the assembly of complex electronic circuitry with high reliability and efficiency.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Electronic Solder Paste, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Electronic Solder Paste market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Electronic Solder Paste market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Electronic Solder Paste sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Electronic Solder Paste covered in this report include SRA Soldering Products, RadioShack, Noritake, Kester, Tamura, Pulsar Process Measurement, Alpha Assembly Solutions and Heraeus, etc.
The global Electronic Solder Paste market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
SRA Soldering Products
RadioShack
Noritake
Kester
Tamura
Pulsar Process Measurement
Alpha Assembly Solutions
Heraeus
Global Electronic Solder Paste market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Electronic Solder Paste market, Segment by Type:
Internal Electrode Paste
External Electrode Paste
Global Electronic Solder Paste market, by Application
LTCC
Chip Inductors
Piezoelectric Ceramic
LEDs
Circuit Board
Other
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Electronic Solder Paste manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Electronic Solder Paste in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Electronic Solder Paste Market Overview
1.1 Electronic Solder Paste Product Overview
1.2 Electronic Solder Paste Market Segment by Type
1.2.1 Internal Electrode Paste
1.2.2 External Electrode Paste
1.3 Global Electronic Solder Paste Market Size by Type
1.3.1 Global Electronic Solder Paste Market Size Overview by Type (2018-2029)
1.3.2 Global Electronic Solder Paste Historic Market Size Review by Type (2018-2023)
1.3.3 Global Electronic Solder Paste Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Electronic Solder Paste Sales Breakdown by Type (2018-2023)
1.4.2 Europe Electronic Solder Paste Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Electronic Solder Paste Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Electronic Solder Paste Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Electronic Solder Paste Sales Breakdown by Type (2018-2023)
2 Global Electronic Solder Paste Market Competition by Company
2.1 Global Top Players by Electronic Solder Paste Sales (2018-2023)
2.2 Global Top Players by Electronic Solder Paste Revenue (2018-2023)
2.3 Global Top Players by Electronic Solder Paste Price (2018-2023)
2.4 Global Top Manufacturers Electronic Solder Paste Manufacturing Base Distribution, Sales Area, Product Type
2.5 Electronic Solder Paste Market Competitive Situation and Trends
2.5.1 Electronic Solder Paste Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Electronic Solder Paste Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Electronic Solder Paste as of 2022)
2.7 Date of Key Manufacturers Enter into Electronic Solder Paste Market
2.8 Key Manufacturers Electronic Solder Paste Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Electronic Solder Paste Status and Outlook by Region
3.1 Global Electronic Solder Paste Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Electronic Solder Paste Historic Market Size by Region
3.2.1 Global Electronic Solder Paste Sales in Volume by Region (2018-2023)
3.2.2 Global Electronic Solder Paste Sales in Value by Region (2018-2023)
3.2.3 Global Electronic Solder Paste Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Electronic Solder Paste Forecasted Market Size by Region
3.3.1 Global Electronic Solder Paste Sales in Volume by Region (2024-2029)
3.3.2 Global Electronic Solder Paste Sales in Value by Region (2024-2029)
3.3.3 Global Electronic Solder Paste Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Electronic Solder Paste by Application
4.1 Electronic Solder Paste Market Segment by Application
4.1.1 LTCC
4.1.2 Chip Inductors
4.1.3 Piezoelectric Ceramic
4.1.4 LEDs
4.1.5 Circuit Board
4.1.6 Other
4.2 Global Electronic Solder Paste Market Size by Application
4.2.1 Global Electronic Solder Paste Market Size Overview by Application (2018-2029)
4.2.2 Global Electronic Solder Paste Historic Market Size Review by Application (2018-2023)
4.2.3 Global Electronic Solder Paste Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Electronic Solder Paste Sales Breakdown by Application (2018-2023)
4.3.2 Europe Electronic Solder Paste Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Electronic Solder Paste Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Electronic Solder Paste Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Electronic Solder Paste Sales Breakdown by Application (2018-2023)
5 North America Electronic Solder Paste by Country
5.1 North America Electronic Solder Paste Historic Market Size by Country
5.1.1 North America Electronic Solder Paste Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Electronic Solder Paste Sales in Volume by Country (2018-2023)
5.1.3 North America Electronic Solder Paste Sales in Value by Country (2018-2023)
5.2 North America Electronic Solder Paste Forecasted Market Size by Country
5.2.1 North America Electronic Solder Paste Sales in Volume by Country (2024-2029)
5.2.2 North America Electronic Solder Paste Sales in Value by Country (2024-2029)
6 Europe Electronic Solder Paste by Country
6.1 Europe Electronic Solder Paste Historic Market Size by Country
6.1.1 Europe Electronic Solder Paste Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Electronic Solder Paste Sales in Volume by Country (2018-2023)
6.1.3 Europe Electronic Solder Paste Sales in Value by Country (2018-2023)
6.2 Europe Electronic Solder Paste Forecasted Market Size by Country
6.2.1 Europe Electronic Solder Paste Sales in Volume by Country (2024-2029)
6.2.2 Europe Electronic Solder Paste Sales in Value by Country (2024-2029)
7 Asia-Pacific Electronic Solder Paste by Region
7.1 Asia-Pacific Electronic Solder Paste Historic Market Size by Region
7.1.1 Asia-Pacific Electronic Solder Paste Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Electronic Solder Paste Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Electronic Solder Paste Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Electronic Solder Paste Forecasted Market Size by Region
7.2.1 Asia-Pacific Electronic Solder Paste Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Electronic Solder Paste Sales in Value by Region (2024-2029)
8 Latin America Electronic Solder Paste by Country
8.1 Latin America Electronic Solder Paste Historic Market Size by Country
8.1.1 Latin America Electronic Solder Paste Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Electronic Solder Paste Sales in Volume by Country (2018-2023)
8.1.3 Latin America Electronic Solder Paste Sales in Value by Country (2018-2023)
8.2 Latin America Electronic Solder Paste Forecasted Market Size by Country
8.2.1 Latin America Electronic Solder Paste Sales in Volume by Country (2024-2029)
8.2.2 Latin America Electronic Solder Paste Sales in Value by Country (2024-2029)
9 Middle East and Africa Electronic Solder Paste by Country
9.1 Middle East and Africa Electronic Solder Paste Historic Market Size by Country
9.1.1 Middle East and Africa Electronic Solder Paste Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Electronic Solder Paste Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Electronic Solder Paste Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Electronic Solder Paste Forecasted Market Size by Country
9.2.1 Middle East and Africa Electronic Solder Paste Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Electronic Solder Paste Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 SRA Soldering Products
10.1.1 SRA Soldering Products Company Information
10.1.2 SRA Soldering Products Introduction and Business Overview
10.1.3 SRA Soldering Products Electronic Solder Paste Sales, Revenue and Gross Margin (2018-2023)
10.1.4 SRA Soldering Products Electronic Solder Paste Products Offered
10.1.5 SRA Soldering Products Recent Development
10.2 RadioShack
10.2.1 RadioShack Company Information
10.2.2 RadioShack Introduction and Business Overview
10.2.3 RadioShack Electronic Solder Paste Sales, Revenue and Gross Margin (2018-2023)
10.2.4 RadioShack Electronic Solder Paste Products Offered
10.2.5 RadioShack Recent Development
10.3 Noritake
10.3.1 Noritake Company Information
10.3.2 Noritake Introduction and Business Overview
10.3.3 Noritake Electronic Solder Paste Sales, Revenue and Gross Margin (2018-2023)
10.3.4 Noritake Electronic Solder Paste Products Offered
10.3.5 Noritake Recent Development
10.4 Kester
10.4.1 Kester Company Information
10.4.2 Kester Introduction and Business Overview
10.4.3 Kester Electronic Solder Paste Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Kester Electronic Solder Paste Products Offered
10.4.5 Kester Recent Development
10.5 Tamura
10.5.1 Tamura Company Information
10.5.2 Tamura Introduction and Business Overview
10.5.3 Tamura Electronic Solder Paste Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Tamura Electronic Solder Paste Products Offered
10.5.5 Tamura Recent Development
10.6 Pulsar Process Measurement
10.6.1 Pulsar Process Measurement Company Information
10.6.2 Pulsar Process Measurement Introduction and Business Overview
10.6.3 Pulsar Process Measurement Electronic Solder Paste Sales, Revenue and Gross Margin (2018-2023)
10.6.4 Pulsar Process Measurement Electronic Solder Paste Products Offered
10.6.5 Pulsar Process Measurement Recent Development
10.7 Alpha Assembly Solutions
10.7.1 Alpha Assembly Solutions Company Information
10.7.2 Alpha Assembly Solutions Introduction and Business Overview
10.7.3 Alpha Assembly Solutions Electronic Solder Paste Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Alpha Assembly Solutions Electronic Solder Paste Products Offered
10.7.5 Alpha Assembly Solutions Recent Development
10.8 Heraeus
10.8.1 Heraeus Company Information
10.8.2 Heraeus Introduction and Business Overview
10.8.3 Heraeus Electronic Solder Paste Sales, Revenue and Gross Margin (2018-2023)
10.8.4 Heraeus Electronic Solder Paste Products Offered
10.8.5 Heraeus Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Electronic Solder Paste Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Electronic Solder Paste Industrial Chain Analysis
11.4 Electronic Solder Paste Market Dynamics
11.4.1 Electronic Solder Paste Industry Trends
11.4.2 Electronic Solder Paste Market Drivers
11.4.3 Electronic Solder Paste Market Challenges
11.4.4 Electronic Solder Paste Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Electronic Solder Paste Distributors
12.3 Electronic Solder Paste Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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