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Electronic Underfill Material-Global Market Insights and Sales Trends 2025
Synopsis
The global Electronic Underfill Material market size is expected to reach US$ 428.3 million by 2029, growing at a CAGR of 4.6% from 2023 to 2029. The market is mainly driven by the significant applications of Electronic Underfill Material in various end use industries. The expanding demands from the Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP),, are propelling Electronic Underfill Material market. Capillary Underfill Material (CUF), one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the No Flow Underfill Material (NUF) segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for Electronic Underfill Material market, driven by demand from China, the second largest economy with some signs of stabilising, the Electronic Underfill Material market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Electronic Underfill Material, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Electronic Underfill Material market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Electronic Underfill Material market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Electronic Underfill Material sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Electronic Underfill Material covered in this report include Henkel, Namics, Nordson Corporation, H.B. Fuller, Epoxy Technology Inc., Yincae Advanced Material, LLC, Master Bond Inc., Zymet Inc. and AIM Metals & Alloys LP, etc.
The global Electronic Underfill Material market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Henkel
Namics
Nordson Corporation
H.B. Fuller
Epoxy Technology Inc.
Yincae Advanced Material, LLC
Master Bond Inc.
Zymet Inc.
AIM Metals & Alloys LP
Won Chemicals Co. Ltd
Global Electronic Underfill Material market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Electronic Underfill Material market, Segment by Type:
Capillary Underfill Material (CUF)
No Flow Underfill Material (NUF)
Molded Underfill Material (MUF)
Global Electronic Underfill Material market, by Application
Flip Chips
Ball Grid Array (BGA)
Chip Scale Packaging (CSP)
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Electronic Underfill Material manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Electronic Underfill Material in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
The global Electronic Underfill Material market size is expected to reach US$ 428.3 million by 2029, growing at a CAGR of 4.6% from 2023 to 2029. The market is mainly driven by the significant applications of Electronic Underfill Material in various end use industries. The expanding demands from the Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP),, are propelling Electronic Underfill Material market. Capillary Underfill Material (CUF), one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the No Flow Underfill Material (NUF) segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for Electronic Underfill Material market, driven by demand from China, the second largest economy with some signs of stabilising, the Electronic Underfill Material market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Electronic Underfill Material, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Electronic Underfill Material market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Electronic Underfill Material market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Electronic Underfill Material sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Electronic Underfill Material covered in this report include Henkel, Namics, Nordson Corporation, H.B. Fuller, Epoxy Technology Inc., Yincae Advanced Material, LLC, Master Bond Inc., Zymet Inc. and AIM Metals & Alloys LP, etc.
The global Electronic Underfill Material market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Henkel
Namics
Nordson Corporation
H.B. Fuller
Epoxy Technology Inc.
Yincae Advanced Material, LLC
Master Bond Inc.
Zymet Inc.
AIM Metals & Alloys LP
Won Chemicals Co. Ltd
Global Electronic Underfill Material market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Electronic Underfill Material market, Segment by Type:
Capillary Underfill Material (CUF)
No Flow Underfill Material (NUF)
Molded Underfill Material (MUF)
Global Electronic Underfill Material market, by Application
Flip Chips
Ball Grid Array (BGA)
Chip Scale Packaging (CSP)
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Electronic Underfill Material manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Electronic Underfill Material in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Electronic Underfill Material Market Overview
1.1 Electronic Underfill Material Product Overview
1.2 Electronic Underfill Material Market Segment by Type
1.2.1 Capillary Underfill Material (CUF)
1.2.2 No Flow Underfill Material (NUF)
1.2.3 Molded Underfill Material (MUF)
1.3 Global Electronic Underfill Material Market Size by Type
1.3.1 Global Electronic Underfill Material Market Size Overview by Type (2018-2029)
1.3.2 Global Electronic Underfill Material Historic Market Size Review by Type (2018-2023)
1.3.3 Global Electronic Underfill Material Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Electronic Underfill Material Sales Breakdown by Type (2018-2023)
1.4.2 Europe Electronic Underfill Material Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Electronic Underfill Material Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Electronic Underfill Material Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Electronic Underfill Material Sales Breakdown by Type (2018-2023)
2 Global Electronic Underfill Material Market Competition by Company
2.1 Global Top Players by Electronic Underfill Material Sales (2018-2023)
2.2 Global Top Players by Electronic Underfill Material Revenue (2018-2023)
2.3 Global Top Players by Electronic Underfill Material Price (2018-2023)
2.4 Global Top Manufacturers Electronic Underfill Material Manufacturing Base Distribution, Sales Area, Product Type
2.5 Electronic Underfill Material Market Competitive Situation and Trends
2.5.1 Electronic Underfill Material Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Electronic Underfill Material Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Electronic Underfill Material as of 2022)
2.7 Date of Key Manufacturers Enter into Electronic Underfill Material Market
2.8 Key Manufacturers Electronic Underfill Material Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Electronic Underfill Material Status and Outlook by Region
3.1 Global Electronic Underfill Material Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Electronic Underfill Material Historic Market Size by Region
3.2.1 Global Electronic Underfill Material Sales in Volume by Region (2018-2023)
3.2.2 Global Electronic Underfill Material Sales in Value by Region (2018-2023)
3.2.3 Global Electronic Underfill Material Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Electronic Underfill Material Forecasted Market Size by Region
3.3.1 Global Electronic Underfill Material Sales in Volume by Region (2024-2029)
3.3.2 Global Electronic Underfill Material Sales in Value by Region (2024-2029)
3.3.3 Global Electronic Underfill Material Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Electronic Underfill Material by Application
4.1 Electronic Underfill Material Market Segment by Application
4.1.1 Flip Chips
4.1.2 Ball Grid Array (BGA)
4.1.3 Chip Scale Packaging (CSP)
4.2 Global Electronic Underfill Material Market Size by Application
4.2.1 Global Electronic Underfill Material Market Size Overview by Application (2018-2029)
4.2.2 Global Electronic Underfill Material Historic Market Size Review by Application (2018-2023)
4.2.3 Global Electronic Underfill Material Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Electronic Underfill Material Sales Breakdown by Application (2018-2023)
4.3.2 Europe Electronic Underfill Material Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Electronic Underfill Material Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Electronic Underfill Material Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Electronic Underfill Material Sales Breakdown by Application (2018-2023)
5 North America Electronic Underfill Material by Country
5.1 North America Electronic Underfill Material Historic Market Size by Country
5.1.1 North America Electronic Underfill Material Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Electronic Underfill Material Sales in Volume by Country (2018-2023)
5.1.3 North America Electronic Underfill Material Sales in Value by Country (2018-2023)
5.2 North America Electronic Underfill Material Forecasted Market Size by Country
5.2.1 North America Electronic Underfill Material Sales in Volume by Country (2024-2029)
5.2.2 North America Electronic Underfill Material Sales in Value by Country (2024-2029)
6 Europe Electronic Underfill Material by Country
6.1 Europe Electronic Underfill Material Historic Market Size by Country
6.1.1 Europe Electronic Underfill Material Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Electronic Underfill Material Sales in Volume by Country (2018-2023)
6.1.3 Europe Electronic Underfill Material Sales in Value by Country (2018-2023)
6.2 Europe Electronic Underfill Material Forecasted Market Size by Country
6.2.1 Europe Electronic Underfill Material Sales in Volume by Country (2024-2029)
6.2.2 Europe Electronic Underfill Material Sales in Value by Country (2024-2029)
7 Asia-Pacific Electronic Underfill Material by Region
7.1 Asia-Pacific Electronic Underfill Material Historic Market Size by Region
7.1.1 Asia-Pacific Electronic Underfill Material Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Electronic Underfill Material Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Electronic Underfill Material Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Electronic Underfill Material Forecasted Market Size by Region
7.2.1 Asia-Pacific Electronic Underfill Material Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Electronic Underfill Material Sales in Value by Region (2024-2029)
8 Latin America Electronic Underfill Material by Country
8.1 Latin America Electronic Underfill Material Historic Market Size by Country
8.1.1 Latin America Electronic Underfill Material Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Electronic Underfill Material Sales in Volume by Country (2018-2023)
8.1.3 Latin America Electronic Underfill Material Sales in Value by Country (2018-2023)
8.2 Latin America Electronic Underfill Material Forecasted Market Size by Country
8.2.1 Latin America Electronic Underfill Material Sales in Volume by Country (2024-2029)
8.2.2 Latin America Electronic Underfill Material Sales in Value by Country (2024-2029)
9 Middle East and Africa Electronic Underfill Material by Country
9.1 Middle East and Africa Electronic Underfill Material Historic Market Size by Country
9.1.1 Middle East and Africa Electronic Underfill Material Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Electronic Underfill Material Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Electronic Underfill Material Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Electronic Underfill Material Forecasted Market Size by Country
9.2.1 Middle East and Africa Electronic Underfill Material Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Electronic Underfill Material Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 Henkel
10.1.1 Henkel Company Information
10.1.2 Henkel Introduction and Business Overview
10.1.3 Henkel Electronic Underfill Material Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Henkel Electronic Underfill Material Products Offered
10.1.5 Henkel Recent Development
10.2 Namics
10.2.1 Namics Company Information
10.2.2 Namics Introduction and Business Overview
10.2.3 Namics Electronic Underfill Material Sales, Revenue and Gross Margin (2018-2023)
10.2.4 Namics Electronic Underfill Material Products Offered
10.2.5 Namics Recent Development
10.3 Nordson Corporation
10.3.1 Nordson Corporation Company Information
10.3.2 Nordson Corporation Introduction and Business Overview
10.3.3 Nordson Corporation Electronic Underfill Material Sales, Revenue and Gross Margin (2018-2023)
10.3.4 Nordson Corporation Electronic Underfill Material Products Offered
10.3.5 Nordson Corporation Recent Development
10.4 H.B. Fuller
10.4.1 H.B. Fuller Company Information
10.4.2 H.B. Fuller Introduction and Business Overview
10.4.3 H.B. Fuller Electronic Underfill Material Sales, Revenue and Gross Margin (2018-2023)
10.4.4 H.B. Fuller Electronic Underfill Material Products Offered
10.4.5 H.B. Fuller Recent Development
10.5 Epoxy Technology Inc.
10.5.1 Epoxy Technology Inc. Company Information
10.5.2 Epoxy Technology Inc. Introduction and Business Overview
10.5.3 Epoxy Technology Inc. Electronic Underfill Material Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Epoxy Technology Inc. Electronic Underfill Material Products Offered
10.5.5 Epoxy Technology Inc. Recent Development
10.6 Yincae Advanced Material, LLC
10.6.1 Yincae Advanced Material, LLC Company Information
10.6.2 Yincae Advanced Material, LLC Introduction and Business Overview
10.6.3 Yincae Advanced Material, LLC Electronic Underfill Material Sales, Revenue and Gross Margin (2018-2023)
10.6.4 Yincae Advanced Material, LLC Electronic Underfill Material Products Offered
10.6.5 Yincae Advanced Material, LLC Recent Development
10.7 Master Bond Inc.
10.7.1 Master Bond Inc. Company Information
10.7.2 Master Bond Inc. Introduction and Business Overview
10.7.3 Master Bond Inc. Electronic Underfill Material Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Master Bond Inc. Electronic Underfill Material Products Offered
10.7.5 Master Bond Inc. Recent Development
10.8 Zymet Inc.
10.8.1 Zymet Inc. Company Information
10.8.2 Zymet Inc. Introduction and Business Overview
10.8.3 Zymet Inc. Electronic Underfill Material Sales, Revenue and Gross Margin (2018-2023)
10.8.4 Zymet Inc. Electronic Underfill Material Products Offered
10.8.5 Zymet Inc. Recent Development
10.9 AIM Metals & Alloys LP
10.9.1 AIM Metals & Alloys LP Company Information
10.9.2 AIM Metals & Alloys LP Introduction and Business Overview
10.9.3 AIM Metals & Alloys LP Electronic Underfill Material Sales, Revenue and Gross Margin (2018-2023)
10.9.4 AIM Metals & Alloys LP Electronic Underfill Material Products Offered
10.9.5 AIM Metals & Alloys LP Recent Development
10.10 Won Chemicals Co. Ltd
10.10.1 Won Chemicals Co. Ltd Company Information
10.10.2 Won Chemicals Co. Ltd Introduction and Business Overview
10.10.3 Won Chemicals Co. Ltd Electronic Underfill Material Sales, Revenue and Gross Margin (2018-2023)
10.10.4 Won Chemicals Co. Ltd Electronic Underfill Material Products Offered
10.10.5 Won Chemicals Co. Ltd Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Electronic Underfill Material Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Electronic Underfill Material Industrial Chain Analysis
11.4 Electronic Underfill Material Market Dynamics
11.4.1 Electronic Underfill Material Industry Trends
11.4.2 Electronic Underfill Material Market Drivers
11.4.3 Electronic Underfill Material Market Challenges
11.4.4 Electronic Underfill Material Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Electronic Underfill Material Distributors
12.3 Electronic Underfill Material Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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