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Embedded Die Packaging-Global Market Insights and Sales Trends 2025

Embedded Die Packaging-Global Market Insights and Sales Trends 2025

Publishing Date : Mar, 2025

License Type :
 

Report Code : 1848019

No of Pages : 104

Synopsis
Embedded die packaging involves embedding components inside the substrate through a multi-step manufacturing process.
The global Embedded Die Packaging market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Embedded Die Packaging in various end use industries. The expanding demands from the Consumer Electronics, IT & Telecommunications, Automotive and Healthcare, are propelling Embedded Die Packaging market. Embedded Die in Rigid Board, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Embedded Die in Flexible Board segment is estimated at % CAGR for the next seven-year period.
Rising demand from North America region is a major driver for the growth of the Embedded Die Packaging market.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Embedded Die Packaging, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Embedded Die Packaging market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Embedded Die Packaging market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Embedded Die Packaging sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Embedded Die Packaging covered in this report include ASE Group, AT & S, General Electric, Amkor Technology, TDK-Epcos, Schweizer, Fujikura, Microchip Technology and Infineon, etc.
The global Embedded Die Packaging market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
ASE Group
AT & S
General Electric
Amkor Technology
TDK-Epcos
Schweizer
Fujikura
Microchip Technology
Infineon
Toshiba Corporation
Fujitsu Limited
STMICROELECTRONICS
Global Embedded Die Packaging market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Embedded Die Packaging market, Segment by Type:
Embedded Die in Rigid Board
Embedded Die in Flexible Board
Embedded Die in IC Package Substrate
Global Embedded Die Packaging market, by Application
Consumer Electronics
IT & Telecommunications
Automotive
Healthcare
Others
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Embedded Die Packaging companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Index
1 Market Overview of Embedded Die Packaging
1.1 Embedded Die Packaging Market Overview
1.1.1 Embedded Die Packaging Product Scope
1.1.2 Embedded Die Packaging Market Status and Outlook
1.2 Global Embedded Die Packaging Market Size Overview by Region 2018 VS 2022 VS 2029
1.3 Global Embedded Die Packaging Market Size by Region (2018-2029)
1.4 Global Embedded Die Packaging Historic Market Size by Region (2018-2023)
1.5 Global Embedded Die Packaging Market Size Forecast by Region (2024-2029)
1.6 Key Regions, Embedded Die Packaging Market Size (2018-2029)
1.6.1 North America Embedded Die Packaging Market Size (2018-2029)
1.6.2 Europe Embedded Die Packaging Market Size (2018-2029)
1.6.3 Asia-Pacific Embedded Die Packaging Market Size (2018-2029)
1.6.4 Latin America Embedded Die Packaging Market Size (2018-2029)
1.6.5 Middle East & Africa Embedded Die Packaging Market Size (2018-2029)
2 Embedded Die Packaging Market by Type
2.1 Introduction
2.1.1 Embedded Die in Rigid Board
2.1.2 Embedded Die in Flexible Board
2.1.3 Embedded Die in IC Package Substrate
2.2 Global Embedded Die Packaging Market Size by Type: 2018 VS 2022 VS 2029
2.2.1 Global Embedded Die Packaging Historic Market Size by Type (2018-2023)
2.2.2 Global Embedded Die Packaging Forecasted Market Size by Type (2024-2029)
2.3 Key Regions Market Size by Type
2.3.1 North America Embedded Die Packaging Revenue Breakdown by Type (2018-2029)
2.3.2 Europe Embedded Die Packaging Revenue Breakdown by Type (2018-2029)
2.3.3 Asia-Pacific Embedded Die Packaging Revenue Breakdown by Type (2018-2029)
2.3.4 Latin America Embedded Die Packaging Revenue Breakdown by Type (2018-2029)
2.3.5 Middle East and Africa Embedded Die Packaging Revenue Breakdown by Type (2018-2029)
3 Embedded Die Packaging Market Overview by Application
3.1 Introduction
3.1.1 Consumer Electronics
3.1.2 IT & Telecommunications
3.1.3 Automotive
3.1.4 Healthcare
3.1.5 Others
3.2 Global Embedded Die Packaging Market Size by Application: 2018 VS 2022 VS 2029
3.2.1 Global Embedded Die Packaging Historic Market Size by Application (2018-2023)
3.2.2 Global Embedded Die Packaging Forecasted Market Size by Application (2024-2029)
3.3 Key Regions Market Size by Application
3.3.1 North America Embedded Die Packaging Revenue Breakdown by Application (2018-2029)
3.3.2 Europe Embedded Die Packaging Revenue Breakdown by Application (2018-2029)
3.3.3 Asia-Pacific Embedded Die Packaging Revenue Breakdown by Application (2018-2029)
3.3.4 Latin America Embedded Die Packaging Revenue Breakdown by Application (2018-2029)
3.3.5 Middle East and Africa Embedded Die Packaging Revenue Breakdown by Application (2018-2029)
4 Embedded Die Packaging Competition Analysis by Players
4.1 Global Embedded Die Packaging Market Size by Players (2018-2023)
4.2 Global Top Players by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Embedded Die Packaging as of 2022)
4.3 Date of Key Players Enter into Embedded Die Packaging Market
4.4 Global Top Players Embedded Die Packaging Headquarters and Area Served
4.5 Key Players Embedded Die Packaging Product Solution and Service
4.6 Competitive Status
4.6.1 Embedded Die Packaging Market Concentration Rate
4.6.2 Mergers & Acquisitions, Expansion Plans
5 Company (Top Players) Profiles
5.1 ASE Group
5.1.1 ASE Group Profile
5.1.2 ASE Group Main Business
5.1.3 ASE Group Embedded Die Packaging Products, Services and Solutions
5.1.4 ASE Group Embedded Die Packaging Revenue (US$ Million) & (2018-2023)
5.1.5 ASE Group Recent Developments
5.2 AT & S
5.2.1 AT & S Profile
5.2.2 AT & S Main Business
5.2.3 AT & S Embedded Die Packaging Products, Services and Solutions
5.2.4 AT & S Embedded Die Packaging Revenue (US$ Million) & (2018-2023)
5.2.5 AT & S Recent Developments
5.3 General Electric
5.3.1 General Electric Profile
5.3.2 General Electric Main Business
5.3.3 General Electric Embedded Die Packaging Products, Services and Solutions
5.3.4 General Electric Embedded Die Packaging Revenue (US$ Million) & (2018-2023)
5.3.5 Amkor Technology Recent Developments
5.4 Amkor Technology
5.4.1 Amkor Technology Profile
5.4.2 Amkor Technology Main Business
5.4.3 Amkor Technology Embedded Die Packaging Products, Services and Solutions
5.4.4 Amkor Technology Embedded Die Packaging Revenue (US$ Million) & (2018-2023)
5.4.5 Amkor Technology Recent Developments
5.5 TDK-Epcos
5.5.1 TDK-Epcos Profile
5.5.2 TDK-Epcos Main Business
5.5.3 TDK-Epcos Embedded Die Packaging Products, Services and Solutions
5.5.4 TDK-Epcos Embedded Die Packaging Revenue (US$ Million) & (2018-2023)
5.5.5 TDK-Epcos Recent Developments
5.6 Schweizer
5.6.1 Schweizer Profile
5.6.2 Schweizer Main Business
5.6.3 Schweizer Embedded Die Packaging Products, Services and Solutions
5.6.4 Schweizer Embedded Die Packaging Revenue (US$ Million) & (2018-2023)
5.6.5 Schweizer Recent Developments
5.7 Fujikura
5.7.1 Fujikura Profile
5.7.2 Fujikura Main Business
5.7.3 Fujikura Embedded Die Packaging Products, Services and Solutions
5.7.4 Fujikura Embedded Die Packaging Revenue (US$ Million) & (2018-2023)
5.7.5 Fujikura Recent Developments
5.8 Microchip Technology
5.8.1 Microchip Technology Profile
5.8.2 Microchip Technology Main Business
5.8.3 Microchip Technology Embedded Die Packaging Products, Services and Solutions
5.8.4 Microchip Technology Embedded Die Packaging Revenue (US$ Million) & (2018-2023)
5.8.5 Microchip Technology Recent Developments
5.9 Infineon
5.9.1 Infineon Profile
5.9.2 Infineon Main Business
5.9.3 Infineon Embedded Die Packaging Products, Services and Solutions
5.9.4 Infineon Embedded Die Packaging Revenue (US$ Million) & (2018-2023)
5.9.5 Infineon Recent Developments
5.10 Toshiba Corporation
5.10.1 Toshiba Corporation Profile
5.10.2 Toshiba Corporation Main Business
5.10.3 Toshiba Corporation Embedded Die Packaging Products, Services and Solutions
5.10.4 Toshiba Corporation Embedded Die Packaging Revenue (US$ Million) & (2018-2023)
5.10.5 Toshiba Corporation Recent Developments
5.11 Fujitsu Limited
5.11.1 Fujitsu Limited Profile
5.11.2 Fujitsu Limited Main Business
5.11.3 Fujitsu Limited Embedded Die Packaging Products, Services and Solutions
5.11.4 Fujitsu Limited Embedded Die Packaging Revenue (US$ Million) & (2018-2023)
5.11.5 Fujitsu Limited Recent Developments
5.12 STMICROELECTRONICS
5.12.1 STMICROELECTRONICS Profile
5.12.2 STMICROELECTRONICS Main Business
5.12.3 STMICROELECTRONICS Embedded Die Packaging Products, Services and Solutions
5.12.4 STMICROELECTRONICS Embedded Die Packaging Revenue (US$ Million) & (2018-2023)
5.12.5 STMICROELECTRONICS Recent Developments
6 North America
6.1 North America Embedded Die Packaging Market Size by Country (2018-2029)
6.2 U.S.
6.3 Canada
7 Europe
7.1 Europe Embedded Die Packaging Market Size by Country (2018-2029)
7.2 Germany
7.3 France
7.4 U.K.
7.5 Italy
7.6 Russia
7.7 Nordic Countries
7.8 Rest of Europe
8 Asia-Pacific
8.1 Asia-Pacific Embedded Die Packaging Market Size by Region (2018-2029)
8.2 China
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
8.6 India
8.7 Australia
8.8 Rest of Asia-Pacific
9 Latin America
9.1 Latin America Embedded Die Packaging Market Size by Country (2018-2029)
9.2 Mexico
9.3 Brazil
9.4 Rest of Latin America
10 Middle East & Africa
10.1 Middle East & Africa Embedded Die Packaging Market Size by Country (2018-2029)
10.2 Turkey
10.3 Saudi Arabia
10.4 UAE
10.5 Rest of Middle East & Africa
11 Embedded Die Packaging Market Dynamics
11.1 Embedded Die Packaging Industry Trends
11.2 Embedded Die Packaging Market Drivers
11.3 Embedded Die Packaging Market Challenges
11.4 Embedded Die Packaging Market Restraints
12 Research Finding /Conclusion
13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer
13.4 Author List

Published By : QY Research

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