The Market Reports

Synopsis

The global market for Epoxy Resin Encapsulation Glue for LED Display was estimated to be worth US$ 461 million in 2024 and is forecast to a readjusted size of US$ 1368 million by 2031 with a CAGR of 17.1% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Epoxy Resin Encapsulation Glue for LED Display cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

In addition to meeting the requirements of high precision and device reliability of chip packaging, LED chip packaging also needs to ensure the realization of optical performance, so the packaging process requirements are extremely strict. As one of the core materials in the LED chip packaging process, electronic packaging material products must have various composite functions such as refraction, light transmission, electrical conductivity, thermal conductivity, water vapor barrier, shock absorption and impact resistance on the basis of basic functions such as bonding, fixing and encapsulation. Product performance and quality stability have an important impact on the light efficiency, reliability and life of LED devices, modules and terminal products, which in turn determines its high product added value.

Epoxy resin encapsulation glue for LED display is a high-temperature resistant insulating sealing material. After mixing, it has low viscosity, strong fluidity and appropriate operable time, which is easy to produce. It can be cured at room temperature or heated during use. The cured product has high hardness, smooth surface and good gloss. Epoxy resin encapsulation glue for LED display can play the role of fixing, insulation, waterproof, oil-proof, dust-proof, anti-theft, corrosion-resistant, aging-resistant, cold and hot shock-resistant, etc. It has a wide range of applications, such as LED display and LED backplane.

The electronic packaging materials industry belongs to the new materials industry in the strategic emerging industries that the country focuses on supporting and developing. Electronic packaging materials are one of the key materials for electronic components and electronic appliances, and occupy an important position in electronic materials. Epoxy resin encapsulation glue for LED display is an important branch of electronic packaging materials and plays an important role in it.

The global small, medium and large-size display panel market is developing rapidly. Chinese manufacturers represented by BOE occupy most of the market share. China has become the most important growth pole leading the development of the global display industry.

Liquid crystal display (LCD) will continue to maintain a leading market share in the fields of televisions and monitors due to its mature technology and high cost performance. Epoxy resin encapsulation glue, as one of the main encapsulation materials, still plays an important role.

As an important driving light source for TFT-LCD liquid crystal display screens, the development of LED backlight modules is mainly driven by the development of the liquid crystal display industry and terminal fields. In the future, as liquid crystal displays continue to break through and develop in large sizes, ultra-high definition, and high-end, the prospects for the replacement of consumer electronic products are promising, and the market space for LED backlight modules is still broad.

This report aims to provide a comprehensive presentation of the global market for Epoxy Resin Encapsulation Glue for LED Display, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Epoxy Resin Encapsulation Glue for LED Display by region & country, by Type, and by Application.

The Epoxy Resin Encapsulation Glue for LED Display market size, estimations, and forecasts are provided in terms of sales volume (Tons) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Epoxy Resin Encapsulation Glue for LED Display.

Market Segmentation
By Company

• 3M
• Henkel
• Parker LORD
• Shantou Niche-Tech Kaiser Co., Ltd.
• Beijing Kmt Technology Co., Ltd
• Yongdeji Technology (Suzhou) Co., Ltd.
• SolEpoxy
• Epic Resins
• Robnor ResinLab
• Hubei Huitian New Materials Co., Ltd.
• Shanghai Dodi Polymer Material Co., Ltd.
• Dongguan Huachuang Electronic Materials Co., Ltd.
• Guangdong Wanmu New Material Technology Co., Ltd.
• Guangdong Anders Industrial Co., Ltd.
• Dongguan Sains Industrial Co., Ltd.

Segment by Type

• Two-component Epoxy Encapsulant
• One-component Epoxy Encapsulant

Segment by Application

• Consumer Electronics
• Automotive Screen
• Advertising Screen
• Others

Segment by Region

• North America: United States, Canada, and Mexico
• Europe: United Kingdom, Germany, France, Spain, Italy, and Rest of Europe
• Asia Pacific: China, India, Japan, Australia, South Korea, and Rest of Asia Pacific
• Middle East & Africa: Saudi Arabia, South Africa, and Rest of MEA
• Latin America: Brazil, Argentina, and Rest of Latin America

*If you need a regional or country-specific version, or customized segmentation, we can tailor the report to your requirements.