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Fan-in Wafer Level Packaging-Global Market Insights and Sales Trends 2025
Synopsis
Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them.
The global Fan-in Wafer Level Packaging market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Fan-in Wafer Level Packaging in various end use industries. The expanding demands from the CMOS Image Sensor, Wireless Connectivity, Logic and Memory IC and MEMS and Sensor, are propelling Fan-in Wafer Level Packaging market. 200mm Wafer Level Packaging, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the 300mm Wafer Level Packaging segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.102% year-on-year.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Fan-in Wafer Level Packaging, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Fan-in Wafer Level Packaging market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Fan-in Wafer Level Packaging market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Fan-in Wafer Level Packaging sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Fan-in Wafer Level Packaging covered in this report include STATS ChipPAC, STMicroelectronics, TSMC, Texas Instruments, Rudolph Technologies, SEMES, SUSS MicroTec, Veeco/CNT and FlipChip International, etc.
The global Fan-in Wafer Level Packaging market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
STATS ChipPAC
STMicroelectronics
TSMC
Texas Instruments
Rudolph Technologies
SEMES
SUSS MicroTec
Veeco/CNT
FlipChip International
Global Fan-in Wafer Level Packaging market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Fan-in Wafer Level Packaging market, Segment by Type:
200mm Wafer Level Packaging
300mm Wafer Level Packaging
Other
Global Fan-in Wafer Level Packaging market, by Application
CMOS Image Sensor
Wireless Connectivity
Logic and Memory IC
MEMS and Sensor
Analog and Mixed IC
Other
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Fan-in Wafer Level Packaging companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them.
The global Fan-in Wafer Level Packaging market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Fan-in Wafer Level Packaging in various end use industries. The expanding demands from the CMOS Image Sensor, Wireless Connectivity, Logic and Memory IC and MEMS and Sensor, are propelling Fan-in Wafer Level Packaging market. 200mm Wafer Level Packaging, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the 300mm Wafer Level Packaging segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.102% year-on-year.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Fan-in Wafer Level Packaging, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Fan-in Wafer Level Packaging market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Fan-in Wafer Level Packaging market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Fan-in Wafer Level Packaging sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Fan-in Wafer Level Packaging covered in this report include STATS ChipPAC, STMicroelectronics, TSMC, Texas Instruments, Rudolph Technologies, SEMES, SUSS MicroTec, Veeco/CNT and FlipChip International, etc.
The global Fan-in Wafer Level Packaging market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
STATS ChipPAC
STMicroelectronics
TSMC
Texas Instruments
Rudolph Technologies
SEMES
SUSS MicroTec
Veeco/CNT
FlipChip International
Global Fan-in Wafer Level Packaging market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Fan-in Wafer Level Packaging market, Segment by Type:
200mm Wafer Level Packaging
300mm Wafer Level Packaging
Other
Global Fan-in Wafer Level Packaging market, by Application
CMOS Image Sensor
Wireless Connectivity
Logic and Memory IC
MEMS and Sensor
Analog and Mixed IC
Other
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Fan-in Wafer Level Packaging companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Index1 Market Overview of Fan-in Wafer Level Packaging
1.1 Fan-in Wafer Level Packaging Market Overview
1.1.1 Fan-in Wafer Level Packaging Product Scope
1.1.2 Fan-in Wafer Level Packaging Market Status and Outlook
1.2 Global Fan-in Wafer Level Packaging Market Size Overview by Region 2018 VS 2022 VS 2029
1.3 Global Fan-in Wafer Level Packaging Market Size by Region (2018-2029)
1.4 Global Fan-in Wafer Level Packaging Historic Market Size by Region (2018-2023)
1.5 Global Fan-in Wafer Level Packaging Market Size Forecast by Region (2024-2029)
1.6 Key Regions, Fan-in Wafer Level Packaging Market Size (2018-2029)
1.6.1 North America Fan-in Wafer Level Packaging Market Size (2018-2029)
1.6.2 Europe Fan-in Wafer Level Packaging Market Size (2018-2029)
1.6.3 Asia-Pacific Fan-in Wafer Level Packaging Market Size (2018-2029)
1.6.4 Latin America Fan-in Wafer Level Packaging Market Size (2018-2029)
1.6.5 Middle East & Africa Fan-in Wafer Level Packaging Market Size (2018-2029)
2 Fan-in Wafer Level Packaging Market by Type
2.1 Introduction
2.1.1 200mm Wafer Level Packaging
2.1.2 300mm Wafer Level Packaging
2.1.3 Other
2.2 Global Fan-in Wafer Level Packaging Market Size by Type: 2018 VS 2022 VS 2029
2.2.1 Global Fan-in Wafer Level Packaging Historic Market Size by Type (2018-2023)
2.2.2 Global Fan-in Wafer Level Packaging Forecasted Market Size by Type (2024-2029)
2.3 Key Regions Market Size by Type
2.3.1 North America Fan-in Wafer Level Packaging Revenue Breakdown by Type (2018-2029)
2.3.2 Europe Fan-in Wafer Level Packaging Revenue Breakdown by Type (2018-2029)
2.3.3 Asia-Pacific Fan-in Wafer Level Packaging Revenue Breakdown by Type (2018-2029)
2.3.4 Latin America Fan-in Wafer Level Packaging Revenue Breakdown by Type (2018-2029)
2.3.5 Middle East and Africa Fan-in Wafer Level Packaging Revenue Breakdown by Type (2018-2029)
3 Fan-in Wafer Level Packaging Market Overview by Application
3.1 Introduction
3.1.1 CMOS Image Sensor
3.1.2 Wireless Connectivity
3.1.3 Logic and Memory IC
3.1.4 MEMS and Sensor
3.1.5 Analog and Mixed IC
3.1.6 Other
3.2 Global Fan-in Wafer Level Packaging Market Size by Application: 2018 VS 2022 VS 2029
3.2.1 Global Fan-in Wafer Level Packaging Historic Market Size by Application (2018-2023)
3.2.2 Global Fan-in Wafer Level Packaging Forecasted Market Size by Application (2024-2029)
3.3 Key Regions Market Size by Application
3.3.1 North America Fan-in Wafer Level Packaging Revenue Breakdown by Application (2018-2029)
3.3.2 Europe Fan-in Wafer Level Packaging Revenue Breakdown by Application (2018-2029)
3.3.3 Asia-Pacific Fan-in Wafer Level Packaging Revenue Breakdown by Application (2018-2029)
3.3.4 Latin America Fan-in Wafer Level Packaging Revenue Breakdown by Application (2018-2029)
3.3.5 Middle East and Africa Fan-in Wafer Level Packaging Revenue Breakdown by Application (2018-2029)
4 Fan-in Wafer Level Packaging Competition Analysis by Players
4.1 Global Fan-in Wafer Level Packaging Market Size by Players (2018-2023)
4.2 Global Top Players by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Fan-in Wafer Level Packaging as of 2022)
4.3 Date of Key Players Enter into Fan-in Wafer Level Packaging Market
4.4 Global Top Players Fan-in Wafer Level Packaging Headquarters and Area Served
4.5 Key Players Fan-in Wafer Level Packaging Product Solution and Service
4.6 Competitive Status
4.6.1 Fan-in Wafer Level Packaging Market Concentration Rate
4.6.2 Mergers & Acquisitions, Expansion Plans
5 Company (Top Players) Profiles
5.1 STATS ChipPAC
5.1.1 STATS ChipPAC Profile
5.1.2 STATS ChipPAC Main Business
5.1.3 STATS ChipPAC Fan-in Wafer Level Packaging Products, Services and Solutions
5.1.4 STATS ChipPAC Fan-in Wafer Level Packaging Revenue (US$ Million) & (2018-2023)
5.1.5 STATS ChipPAC Recent Developments
5.2 STMicroelectronics
5.2.1 STMicroelectronics Profile
5.2.2 STMicroelectronics Main Business
5.2.3 STMicroelectronics Fan-in Wafer Level Packaging Products, Services and Solutions
5.2.4 STMicroelectronics Fan-in Wafer Level Packaging Revenue (US$ Million) & (2018-2023)
5.2.5 STMicroelectronics Recent Developments
5.3 TSMC
5.3.1 TSMC Profile
5.3.2 TSMC Main Business
5.3.3 TSMC Fan-in Wafer Level Packaging Products, Services and Solutions
5.3.4 TSMC Fan-in Wafer Level Packaging Revenue (US$ Million) & (2018-2023)
5.3.5 Texas Instruments Recent Developments
5.4 Texas Instruments
5.4.1 Texas Instruments Profile
5.4.2 Texas Instruments Main Business
5.4.3 Texas Instruments Fan-in Wafer Level Packaging Products, Services and Solutions
5.4.4 Texas Instruments Fan-in Wafer Level Packaging Revenue (US$ Million) & (2018-2023)
5.4.5 Texas Instruments Recent Developments
5.5 Rudolph Technologies
5.5.1 Rudolph Technologies Profile
5.5.2 Rudolph Technologies Main Business
5.5.3 Rudolph Technologies Fan-in Wafer Level Packaging Products, Services and Solutions
5.5.4 Rudolph Technologies Fan-in Wafer Level Packaging Revenue (US$ Million) & (2018-2023)
5.5.5 Rudolph Technologies Recent Developments
5.6 SEMES
5.6.1 SEMES Profile
5.6.2 SEMES Main Business
5.6.3 SEMES Fan-in Wafer Level Packaging Products, Services and Solutions
5.6.4 SEMES Fan-in Wafer Level Packaging Revenue (US$ Million) & (2018-2023)
5.6.5 SEMES Recent Developments
5.7 SUSS MicroTec
5.7.1 SUSS MicroTec Profile
5.7.2 SUSS MicroTec Main Business
5.7.3 SUSS MicroTec Fan-in Wafer Level Packaging Products, Services and Solutions
5.7.4 SUSS MicroTec Fan-in Wafer Level Packaging Revenue (US$ Million) & (2018-2023)
5.7.5 SUSS MicroTec Recent Developments
5.8 Veeco/CNT
5.8.1 Veeco/CNT Profile
5.8.2 Veeco/CNT Main Business
5.8.3 Veeco/CNT Fan-in Wafer Level Packaging Products, Services and Solutions
5.8.4 Veeco/CNT Fan-in Wafer Level Packaging Revenue (US$ Million) & (2018-2023)
5.8.5 Veeco/CNT Recent Developments
5.9 FlipChip International
5.9.1 FlipChip International Profile
5.9.2 FlipChip International Main Business
5.9.3 FlipChip International Fan-in Wafer Level Packaging Products, Services and Solutions
5.9.4 FlipChip International Fan-in Wafer Level Packaging Revenue (US$ Million) & (2018-2023)
5.9.5 FlipChip International Recent Developments
6 North America
6.1 North America Fan-in Wafer Level Packaging Market Size by Country (2018-2029)
6.2 U.S.
6.3 Canada
7 Europe
7.1 Europe Fan-in Wafer Level Packaging Market Size by Country (2018-2029)
7.2 Germany
7.3 France
7.4 U.K.
7.5 Italy
7.6 Russia
7.7 Nordic Countries
7.8 Rest of Europe
8 Asia-Pacific
8.1 Asia-Pacific Fan-in Wafer Level Packaging Market Size by Region (2018-2029)
8.2 China
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
8.6 India
8.7 Australia
8.8 Rest of Asia-Pacific
9 Latin America
9.1 Latin America Fan-in Wafer Level Packaging Market Size by Country (2018-2029)
9.2 Mexico
9.3 Brazil
9.4 Rest of Latin America
10 Middle East & Africa
10.1 Middle East & Africa Fan-in Wafer Level Packaging Market Size by Country (2018-2029)
10.2 Turkey
10.3 Saudi Arabia
10.4 UAE
10.5 Rest of Middle East & Africa
11 Fan-in Wafer Level Packaging Market Dynamics
11.1 Fan-in Wafer Level Packaging Industry Trends
11.2 Fan-in Wafer Level Packaging Market Drivers
11.3 Fan-in Wafer Level Packaging Market Challenges
11.4 Fan-in Wafer Level Packaging Market Restraints
12 Research Finding /Conclusion
13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer
13.4 Author List
Published By : QY Research
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