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Fan-Out Packaging-Global Market Insights and Sales Trends 2025
Synopsis
Fan-Out Packaging can be defined as any package with connections fanned-out of the chip surface, enabling more external I/Os. Conventional fan-out packages use an epoxy mold compound to fully embed the dies, rather than placing them upon a substrate or interposer. Fan-Out packaging typically involves dicing chips on a silicon wafer, and then very precisely positioning the known-good chips on a thin “reconstituted” or carrier wafer/panel, which is then molded and followed by a redistribution layer (RDL) atop the molded area (chip and fan-out area), and then forming solder balls on top.
The global Fan-Out Packaging market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Fan-Out Packaging in various end use industries. The expanding demands from the Consumer Electronics, Automobile Industry, Aerospace and Defense and Telecom Industry, are propelling Fan-Out Packaging market. Core Fan-Out Packaging, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the High-Density Fan-Out Packaging segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for Fan-Out Packaging market, driven by demand from China, the second largest economy with some signs of stabilising, the Fan-Out Packaging market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Fan-Out Packaging, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Fan-Out Packaging market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Fan-Out Packaging market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Fan-Out Packaging sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Fan-Out Packaging covered in this report include ASE Group, YoleDeveloppement, Atotech, NXP, Camtek, STATS ChipPAC, Deca Technologies, INTEVAC and Onto Innovation, etc.
The global Fan-Out Packaging market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
ASE Group
YoleDeveloppement
Atotech
NXP
Camtek
STATS ChipPAC
Deca Technologies
INTEVAC
Onto Innovation
Amkor Technology Inc.
Samsung Electro-Mechanics
Powertech Technology Inc.
Global Fan-Out Packaging market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Fan-Out Packaging market, Segment by Type:
Core Fan-Out Packaging
High-Density Fan-Out Packaging
Global Fan-Out Packaging market, by Application
Consumer Electronics
Automobile Industry
Aerospace and Defense
Telecom Industry
Other
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Fan-Out Packaging companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Fan-Out Packaging can be defined as any package with connections fanned-out of the chip surface, enabling more external I/Os. Conventional fan-out packages use an epoxy mold compound to fully embed the dies, rather than placing them upon a substrate or interposer. Fan-Out packaging typically involves dicing chips on a silicon wafer, and then very precisely positioning the known-good chips on a thin “reconstituted” or carrier wafer/panel, which is then molded and followed by a redistribution layer (RDL) atop the molded area (chip and fan-out area), and then forming solder balls on top.
The global Fan-Out Packaging market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Fan-Out Packaging in various end use industries. The expanding demands from the Consumer Electronics, Automobile Industry, Aerospace and Defense and Telecom Industry, are propelling Fan-Out Packaging market. Core Fan-Out Packaging, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the High-Density Fan-Out Packaging segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for Fan-Out Packaging market, driven by demand from China, the second largest economy with some signs of stabilising, the Fan-Out Packaging market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Fan-Out Packaging, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Fan-Out Packaging market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Fan-Out Packaging market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Fan-Out Packaging sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Fan-Out Packaging covered in this report include ASE Group, YoleDeveloppement, Atotech, NXP, Camtek, STATS ChipPAC, Deca Technologies, INTEVAC and Onto Innovation, etc.
The global Fan-Out Packaging market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
ASE Group
YoleDeveloppement
Atotech
NXP
Camtek
STATS ChipPAC
Deca Technologies
INTEVAC
Onto Innovation
Amkor Technology Inc.
Samsung Electro-Mechanics
Powertech Technology Inc.
Global Fan-Out Packaging market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Fan-Out Packaging market, Segment by Type:
Core Fan-Out Packaging
High-Density Fan-Out Packaging
Global Fan-Out Packaging market, by Application
Consumer Electronics
Automobile Industry
Aerospace and Defense
Telecom Industry
Other
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Fan-Out Packaging companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Index1 Market Overview of Fan-Out Packaging
1.1 Fan-Out Packaging Market Overview
1.1.1 Fan-Out Packaging Product Scope
1.1.2 Fan-Out Packaging Market Status and Outlook
1.2 Global Fan-Out Packaging Market Size Overview by Region 2018 VS 2022 VS 2029
1.3 Global Fan-Out Packaging Market Size by Region (2018-2029)
1.4 Global Fan-Out Packaging Historic Market Size by Region (2018-2023)
1.5 Global Fan-Out Packaging Market Size Forecast by Region (2024-2029)
1.6 Key Regions, Fan-Out Packaging Market Size (2018-2029)
1.6.1 North America Fan-Out Packaging Market Size (2018-2029)
1.6.2 Europe Fan-Out Packaging Market Size (2018-2029)
1.6.3 Asia-Pacific Fan-Out Packaging Market Size (2018-2029)
1.6.4 Latin America Fan-Out Packaging Market Size (2018-2029)
1.6.5 Middle East & Africa Fan-Out Packaging Market Size (2018-2029)
2 Fan-Out Packaging Market by Type
2.1 Introduction
2.1.1 Core Fan-Out Packaging
2.1.2 High-Density Fan-Out Packaging
2.2 Global Fan-Out Packaging Market Size by Type: 2018 VS 2022 VS 2029
2.2.1 Global Fan-Out Packaging Historic Market Size by Type (2018-2023)
2.2.2 Global Fan-Out Packaging Forecasted Market Size by Type (2024-2029)
2.3 Key Regions Market Size by Type
2.3.1 North America Fan-Out Packaging Revenue Breakdown by Type (2018-2029)
2.3.2 Europe Fan-Out Packaging Revenue Breakdown by Type (2018-2029)
2.3.3 Asia-Pacific Fan-Out Packaging Revenue Breakdown by Type (2018-2029)
2.3.4 Latin America Fan-Out Packaging Revenue Breakdown by Type (2018-2029)
2.3.5 Middle East and Africa Fan-Out Packaging Revenue Breakdown by Type (2018-2029)
3 Fan-Out Packaging Market Overview by Application
3.1 Introduction
3.1.1 Consumer Electronics
3.1.2 Automobile Industry
3.1.3 Aerospace and Defense
3.1.4 Telecom Industry
3.1.5 Other
3.2 Global Fan-Out Packaging Market Size by Application: 2018 VS 2022 VS 2029
3.2.1 Global Fan-Out Packaging Historic Market Size by Application (2018-2023)
3.2.2 Global Fan-Out Packaging Forecasted Market Size by Application (2024-2029)
3.3 Key Regions Market Size by Application
3.3.1 North America Fan-Out Packaging Revenue Breakdown by Application (2018-2029)
3.3.2 Europe Fan-Out Packaging Revenue Breakdown by Application (2018-2029)
3.3.3 Asia-Pacific Fan-Out Packaging Revenue Breakdown by Application (2018-2029)
3.3.4 Latin America Fan-Out Packaging Revenue Breakdown by Application (2018-2029)
3.3.5 Middle East and Africa Fan-Out Packaging Revenue Breakdown by Application (2018-2029)
4 Fan-Out Packaging Competition Analysis by Players
4.1 Global Fan-Out Packaging Market Size by Players (2018-2023)
4.2 Global Top Players by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Fan-Out Packaging as of 2022)
4.3 Date of Key Players Enter into Fan-Out Packaging Market
4.4 Global Top Players Fan-Out Packaging Headquarters and Area Served
4.5 Key Players Fan-Out Packaging Product Solution and Service
4.6 Competitive Status
4.6.1 Fan-Out Packaging Market Concentration Rate
4.6.2 Mergers & Acquisitions, Expansion Plans
5 Company (Top Players) Profiles
5.1 ASE Group
5.1.1 ASE Group Profile
5.1.2 ASE Group Main Business
5.1.3 ASE Group Fan-Out Packaging Products, Services and Solutions
5.1.4 ASE Group Fan-Out Packaging Revenue (US$ Million) & (2018-2023)
5.1.5 ASE Group Recent Developments
5.2 YoleDeveloppement
5.2.1 YoleDeveloppement Profile
5.2.2 YoleDeveloppement Main Business
5.2.3 YoleDeveloppement Fan-Out Packaging Products, Services and Solutions
5.2.4 YoleDeveloppement Fan-Out Packaging Revenue (US$ Million) & (2018-2023)
5.2.5 YoleDeveloppement Recent Developments
5.3 Atotech
5.3.1 Atotech Profile
5.3.2 Atotech Main Business
5.3.3 Atotech Fan-Out Packaging Products, Services and Solutions
5.3.4 Atotech Fan-Out Packaging Revenue (US$ Million) & (2018-2023)
5.3.5 NXP Recent Developments
5.4 NXP
5.4.1 NXP Profile
5.4.2 NXP Main Business
5.4.3 NXP Fan-Out Packaging Products, Services and Solutions
5.4.4 NXP Fan-Out Packaging Revenue (US$ Million) & (2018-2023)
5.4.5 NXP Recent Developments
5.5 Camtek
5.5.1 Camtek Profile
5.5.2 Camtek Main Business
5.5.3 Camtek Fan-Out Packaging Products, Services and Solutions
5.5.4 Camtek Fan-Out Packaging Revenue (US$ Million) & (2018-2023)
5.5.5 Camtek Recent Developments
5.6 STATS ChipPAC
5.6.1 STATS ChipPAC Profile
5.6.2 STATS ChipPAC Main Business
5.6.3 STATS ChipPAC Fan-Out Packaging Products, Services and Solutions
5.6.4 STATS ChipPAC Fan-Out Packaging Revenue (US$ Million) & (2018-2023)
5.6.5 STATS ChipPAC Recent Developments
5.7 Deca Technologies
5.7.1 Deca Technologies Profile
5.7.2 Deca Technologies Main Business
5.7.3 Deca Technologies Fan-Out Packaging Products, Services and Solutions
5.7.4 Deca Technologies Fan-Out Packaging Revenue (US$ Million) & (2018-2023)
5.7.5 Deca Technologies Recent Developments
5.8 INTEVAC
5.8.1 INTEVAC Profile
5.8.2 INTEVAC Main Business
5.8.3 INTEVAC Fan-Out Packaging Products, Services and Solutions
5.8.4 INTEVAC Fan-Out Packaging Revenue (US$ Million) & (2018-2023)
5.8.5 INTEVAC Recent Developments
5.9 Onto Innovation
5.9.1 Onto Innovation Profile
5.9.2 Onto Innovation Main Business
5.9.3 Onto Innovation Fan-Out Packaging Products, Services and Solutions
5.9.4 Onto Innovation Fan-Out Packaging Revenue (US$ Million) & (2018-2023)
5.9.5 Onto Innovation Recent Developments
5.10 Amkor Technology Inc.
5.10.1 Amkor Technology Inc. Profile
5.10.2 Amkor Technology Inc. Main Business
5.10.3 Amkor Technology Inc. Fan-Out Packaging Products, Services and Solutions
5.10.4 Amkor Technology Inc. Fan-Out Packaging Revenue (US$ Million) & (2018-2023)
5.10.5 Amkor Technology Inc. Recent Developments
5.11 Samsung Electro-Mechanics
5.11.1 Samsung Electro-Mechanics Profile
5.11.2 Samsung Electro-Mechanics Main Business
5.11.3 Samsung Electro-Mechanics Fan-Out Packaging Products, Services and Solutions
5.11.4 Samsung Electro-Mechanics Fan-Out Packaging Revenue (US$ Million) & (2018-2023)
5.11.5 Samsung Electro-Mechanics Recent Developments
5.12 Powertech Technology Inc.
5.12.1 Powertech Technology Inc. Profile
5.12.2 Powertech Technology Inc. Main Business
5.12.3 Powertech Technology Inc. Fan-Out Packaging Products, Services and Solutions
5.12.4 Powertech Technology Inc. Fan-Out Packaging Revenue (US$ Million) & (2018-2023)
5.12.5 Powertech Technology Inc. Recent Developments
6 North America
6.1 North America Fan-Out Packaging Market Size by Country (2018-2029)
6.2 U.S.
6.3 Canada
7 Europe
7.1 Europe Fan-Out Packaging Market Size by Country (2018-2029)
7.2 Germany
7.3 France
7.4 U.K.
7.5 Italy
7.6 Russia
7.7 Nordic Countries
7.8 Rest of Europe
8 Asia-Pacific
8.1 Asia-Pacific Fan-Out Packaging Market Size by Region (2018-2029)
8.2 China
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
8.6 India
8.7 Australia
8.8 Rest of Asia-Pacific
9 Latin America
9.1 Latin America Fan-Out Packaging Market Size by Country (2018-2029)
9.2 Mexico
9.3 Brazil
9.4 Rest of Latin America
10 Middle East & Africa
10.1 Middle East & Africa Fan-Out Packaging Market Size by Country (2018-2029)
10.2 Turkey
10.3 Saudi Arabia
10.4 UAE
10.5 Rest of Middle East & Africa
11 Fan-Out Packaging Market Dynamics
11.1 Fan-Out Packaging Industry Trends
11.2 Fan-Out Packaging Market Drivers
11.3 Fan-Out Packaging Market Challenges
11.4 Fan-Out Packaging Market Restraints
12 Research Finding /Conclusion
13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer
13.4 Author List
Published By : QY Research
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