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Fan-out Wafer Level Package-Global Market Insights and Sales Trends 2025
Synopsis
Fan-out wafer-level packaging is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions.
The global Fan-out Wafer Level Package market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Fan-out Wafer Level Package in various end use industries. The expanding demands from the Electronics & Semiconductor, Communication Engineering and Others,, are propelling Fan-out Wafer Level Package market. 200mm Wafers, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the 300mm Wafers segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Fan-out Wafer Level Package, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Fan-out Wafer Level Package market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Fan-out Wafer Level Package market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Fan-out Wafer Level Package sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Fan-out Wafer Level Package covered in this report include ASE, Amkor Technology, Deca Technology, Huatian Technology, Infineon, JCAP, Nepes, Spil and Stats ChipPAC, etc.
The global Fan-out Wafer Level Package market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
ASE
Amkor Technology
Deca Technology
Huatian Technology
Infineon
JCAP
Nepes
Spil
Stats ChipPAC
TSMC
Freescale
NANIUM
Taiwan Semiconductor Manufacturing
Global Fan-out Wafer Level Package market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Fan-out Wafer Level Package market, Segment by Type:
200mm Wafers
300mm Wafers
450mm Wafers
Others
Global Fan-out Wafer Level Package market, by Application
Electronics & Semiconductor
Communication Engineering
Others
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Fan-out Wafer Level Package companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Fan-out wafer-level packaging is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions.
The global Fan-out Wafer Level Package market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Fan-out Wafer Level Package in various end use industries. The expanding demands from the Electronics & Semiconductor, Communication Engineering and Others,, are propelling Fan-out Wafer Level Package market. 200mm Wafers, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the 300mm Wafers segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Fan-out Wafer Level Package, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Fan-out Wafer Level Package market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Fan-out Wafer Level Package market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Fan-out Wafer Level Package sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Fan-out Wafer Level Package covered in this report include ASE, Amkor Technology, Deca Technology, Huatian Technology, Infineon, JCAP, Nepes, Spil and Stats ChipPAC, etc.
The global Fan-out Wafer Level Package market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
ASE
Amkor Technology
Deca Technology
Huatian Technology
Infineon
JCAP
Nepes
Spil
Stats ChipPAC
TSMC
Freescale
NANIUM
Taiwan Semiconductor Manufacturing
Global Fan-out Wafer Level Package market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Fan-out Wafer Level Package market, Segment by Type:
200mm Wafers
300mm Wafers
450mm Wafers
Others
Global Fan-out Wafer Level Package market, by Application
Electronics & Semiconductor
Communication Engineering
Others
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Fan-out Wafer Level Package companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Index1 Market Overview of Fan-out Wafer Level Package
1.1 Fan-out Wafer Level Package Market Overview
1.1.1 Fan-out Wafer Level Package Product Scope
1.1.2 Fan-out Wafer Level Package Market Status and Outlook
1.2 Global Fan-out Wafer Level Package Market Size Overview by Region 2018 VS 2022 VS 2029
1.3 Global Fan-out Wafer Level Package Market Size by Region (2018-2029)
1.4 Global Fan-out Wafer Level Package Historic Market Size by Region (2018-2023)
1.5 Global Fan-out Wafer Level Package Market Size Forecast by Region (2024-2029)
1.6 Key Regions, Fan-out Wafer Level Package Market Size (2018-2029)
1.6.1 North America Fan-out Wafer Level Package Market Size (2018-2029)
1.6.2 Europe Fan-out Wafer Level Package Market Size (2018-2029)
1.6.3 Asia-Pacific Fan-out Wafer Level Package Market Size (2018-2029)
1.6.4 Latin America Fan-out Wafer Level Package Market Size (2018-2029)
1.6.5 Middle East & Africa Fan-out Wafer Level Package Market Size (2018-2029)
2 Fan-out Wafer Level Package Market by Type
2.1 Introduction
2.1.1 200mm Wafers
2.1.2 300mm Wafers
2.1.3 450mm Wafers
2.1.4 Others
2.2 Global Fan-out Wafer Level Package Market Size by Type: 2018 VS 2022 VS 2029
2.2.1 Global Fan-out Wafer Level Package Historic Market Size by Type (2018-2023)
2.2.2 Global Fan-out Wafer Level Package Forecasted Market Size by Type (2024-2029)
2.3 Key Regions Market Size by Type
2.3.1 North America Fan-out Wafer Level Package Revenue Breakdown by Type (2018-2029)
2.3.2 Europe Fan-out Wafer Level Package Revenue Breakdown by Type (2018-2029)
2.3.3 Asia-Pacific Fan-out Wafer Level Package Revenue Breakdown by Type (2018-2029)
2.3.4 Latin America Fan-out Wafer Level Package Revenue Breakdown by Type (2018-2029)
2.3.5 Middle East and Africa Fan-out Wafer Level Package Revenue Breakdown by Type (2018-2029)
3 Fan-out Wafer Level Package Market Overview by Application
3.1 Introduction
3.1.1 Electronics & Semiconductor
3.1.2 Communication Engineering
3.1.3 Others
3.2 Global Fan-out Wafer Level Package Market Size by Application: 2018 VS 2022 VS 2029
3.2.1 Global Fan-out Wafer Level Package Historic Market Size by Application (2018-2023)
3.2.2 Global Fan-out Wafer Level Package Forecasted Market Size by Application (2024-2029)
3.3 Key Regions Market Size by Application
3.3.1 North America Fan-out Wafer Level Package Revenue Breakdown by Application (2018-2029)
3.3.2 Europe Fan-out Wafer Level Package Revenue Breakdown by Application (2018-2029)
3.3.3 Asia-Pacific Fan-out Wafer Level Package Revenue Breakdown by Application (2018-2029)
3.3.4 Latin America Fan-out Wafer Level Package Revenue Breakdown by Application (2018-2029)
3.3.5 Middle East and Africa Fan-out Wafer Level Package Revenue Breakdown by Application (2018-2029)
4 Fan-out Wafer Level Package Competition Analysis by Players
4.1 Global Fan-out Wafer Level Package Market Size by Players (2018-2023)
4.2 Global Top Players by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Fan-out Wafer Level Package as of 2022)
4.3 Date of Key Players Enter into Fan-out Wafer Level Package Market
4.4 Global Top Players Fan-out Wafer Level Package Headquarters and Area Served
4.5 Key Players Fan-out Wafer Level Package Product Solution and Service
4.6 Competitive Status
4.6.1 Fan-out Wafer Level Package Market Concentration Rate
4.6.2 Mergers & Acquisitions, Expansion Plans
5 Company (Top Players) Profiles
5.1 ASE
5.1.1 ASE Profile
5.1.2 ASE Main Business
5.1.3 ASE Fan-out Wafer Level Package Products, Services and Solutions
5.1.4 ASE Fan-out Wafer Level Package Revenue (US$ Million) & (2018-2023)
5.1.5 ASE Recent Developments
5.2 Amkor Technology
5.2.1 Amkor Technology Profile
5.2.2 Amkor Technology Main Business
5.2.3 Amkor Technology Fan-out Wafer Level Package Products, Services and Solutions
5.2.4 Amkor Technology Fan-out Wafer Level Package Revenue (US$ Million) & (2018-2023)
5.2.5 Amkor Technology Recent Developments
5.3 Deca Technology
5.3.1 Deca Technology Profile
5.3.2 Deca Technology Main Business
5.3.3 Deca Technology Fan-out Wafer Level Package Products, Services and Solutions
5.3.4 Deca Technology Fan-out Wafer Level Package Revenue (US$ Million) & (2018-2023)
5.3.5 Huatian Technology Recent Developments
5.4 Huatian Technology
5.4.1 Huatian Technology Profile
5.4.2 Huatian Technology Main Business
5.4.3 Huatian Technology Fan-out Wafer Level Package Products, Services and Solutions
5.4.4 Huatian Technology Fan-out Wafer Level Package Revenue (US$ Million) & (2018-2023)
5.4.5 Huatian Technology Recent Developments
5.5 Infineon
5.5.1 Infineon Profile
5.5.2 Infineon Main Business
5.5.3 Infineon Fan-out Wafer Level Package Products, Services and Solutions
5.5.4 Infineon Fan-out Wafer Level Package Revenue (US$ Million) & (2018-2023)
5.5.5 Infineon Recent Developments
5.6 JCAP
5.6.1 JCAP Profile
5.6.2 JCAP Main Business
5.6.3 JCAP Fan-out Wafer Level Package Products, Services and Solutions
5.6.4 JCAP Fan-out Wafer Level Package Revenue (US$ Million) & (2018-2023)
5.6.5 JCAP Recent Developments
5.7 Nepes
5.7.1 Nepes Profile
5.7.2 Nepes Main Business
5.7.3 Nepes Fan-out Wafer Level Package Products, Services and Solutions
5.7.4 Nepes Fan-out Wafer Level Package Revenue (US$ Million) & (2018-2023)
5.7.5 Nepes Recent Developments
5.8 Spil
5.8.1 Spil Profile
5.8.2 Spil Main Business
5.8.3 Spil Fan-out Wafer Level Package Products, Services and Solutions
5.8.4 Spil Fan-out Wafer Level Package Revenue (US$ Million) & (2018-2023)
5.8.5 Spil Recent Developments
5.9 Stats ChipPAC
5.9.1 Stats ChipPAC Profile
5.9.2 Stats ChipPAC Main Business
5.9.3 Stats ChipPAC Fan-out Wafer Level Package Products, Services and Solutions
5.9.4 Stats ChipPAC Fan-out Wafer Level Package Revenue (US$ Million) & (2018-2023)
5.9.5 Stats ChipPAC Recent Developments
5.10 TSMC
5.10.1 TSMC Profile
5.10.2 TSMC Main Business
5.10.3 TSMC Fan-out Wafer Level Package Products, Services and Solutions
5.10.4 TSMC Fan-out Wafer Level Package Revenue (US$ Million) & (2018-2023)
5.10.5 TSMC Recent Developments
5.11 Freescale
5.11.1 Freescale Profile
5.11.2 Freescale Main Business
5.11.3 Freescale Fan-out Wafer Level Package Products, Services and Solutions
5.11.4 Freescale Fan-out Wafer Level Package Revenue (US$ Million) & (2018-2023)
5.11.5 Freescale Recent Developments
5.12 NANIUM
5.12.1 NANIUM Profile
5.12.2 NANIUM Main Business
5.12.3 NANIUM Fan-out Wafer Level Package Products, Services and Solutions
5.12.4 NANIUM Fan-out Wafer Level Package Revenue (US$ Million) & (2018-2023)
5.12.5 NANIUM Recent Developments
5.13 Taiwan Semiconductor Manufacturing
5.13.1 Taiwan Semiconductor Manufacturing Profile
5.13.2 Taiwan Semiconductor Manufacturing Main Business
5.13.3 Taiwan Semiconductor Manufacturing Fan-out Wafer Level Package Products, Services and Solutions
5.13.4 Taiwan Semiconductor Manufacturing Fan-out Wafer Level Package Revenue (US$ Million) & (2018-2023)
5.13.5 Taiwan Semiconductor Manufacturing Recent Developments
6 North America
6.1 North America Fan-out Wafer Level Package Market Size by Country (2018-2029)
6.2 United States
6.3 Canada
7 Europe
7.1 Europe Fan-out Wafer Level Package Market Size by Country (2018-2029)
7.2 Germany
7.3 France
7.4 U.K.
7.5 Italy
7.6 Russia
7.7 Nordic Countries
7.8 Rest of Europe
8 Asia-Pacific
8.1 Asia-Pacific Fan-out Wafer Level Package Market Size by Region (2018-2029)
8.2 China
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
8.6 India
8.7 Australia
8.8 Rest of Asia-Pacific
9 Latin America
9.1 Latin America Fan-out Wafer Level Package Market Size by Country (2018-2029)
9.2 Mexico
9.3 Brazil
9.4 Rest of Latin America
10 Middle East & Africa
10.1 Middle East & Africa Fan-out Wafer Level Package Market Size by Country (2018-2029)
10.2 Turkey
10.3 Saudi Arabia
10.4 UAE
10.5 Rest of Middle East & Africa
11 Fan-out Wafer Level Package Market Dynamics
11.1 Fan-out Wafer Level Package Industry Trends
11.2 Fan-out Wafer Level Package Market Drivers
11.3 Fan-out Wafer Level Package Market Challenges
11.4 Fan-out Wafer Level Package Market Restraints
12 Research Finding /Conclusion
13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer
13.4 Author List
Published By : QY Research
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