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Flip Chip Technology-Global Market Insights and Sales Trends 2025
Synopsis
In the development of packaging of electronics, the main aim is to lower cost, increase the packaging density, and improve the performance by maintaining or improving the reliability of the circuits. The concept of the flip-chip process where the semiconductor chip is assembled face down onto the circuit board is ideal for size considerations because there is no extra area needed for contacting on the sides of the component. The performance in high-frequency applications is superior to other interconnection methods because the length of the connection path is minimized. Flip chip bumping is a vital step in the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a spacer to prevent electrical shorts and provides mechanical support.
The global Flip Chip Technology market size is expected to reach US$ 17730 million by 2029, growing at a CAGR of 5.7% from 2023 to 2029. The market is mainly driven by the significant applications of Flip Chip Technology in various end use industries. The expanding demands from the Consumer electronics, Telecommunication, Automotive and Industrial sector, are propelling Flip Chip Technology market. Packaging Technology, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Mosaic Technology segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Flip Chip Technology, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Flip Chip Technology market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Flip Chip Technology market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Flip Chip Technology sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Flip Chip Technology covered in this report include Samsung, Intel, Global Foundries, UMC, ASE, Amkor, STATS ChipPAC, Powertech and STMicroelectronics, etc.
The global Flip Chip Technology market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Samsung
Intel
Global Foundries
UMC
ASE
Amkor
STATS ChipPAC
Powertech
STMicroelectronics
Texas Instruments
Global Flip Chip Technology market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Flip Chip Technology market, Segment by Type:
Packaging Technology
Mosaic Technology
Other
Global Flip Chip Technology market, by Application
Consumer electronics
Telecommunication
Automotive
Industrial sector
Medical devices
Smart technologies
Military & aerospace
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Flip Chip Technology companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
In the development of packaging of electronics, the main aim is to lower cost, increase the packaging density, and improve the performance by maintaining or improving the reliability of the circuits. The concept of the flip-chip process where the semiconductor chip is assembled face down onto the circuit board is ideal for size considerations because there is no extra area needed for contacting on the sides of the component. The performance in high-frequency applications is superior to other interconnection methods because the length of the connection path is minimized. Flip chip bumping is a vital step in the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a spacer to prevent electrical shorts and provides mechanical support.
The global Flip Chip Technology market size is expected to reach US$ 17730 million by 2029, growing at a CAGR of 5.7% from 2023 to 2029. The market is mainly driven by the significant applications of Flip Chip Technology in various end use industries. The expanding demands from the Consumer electronics, Telecommunication, Automotive and Industrial sector, are propelling Flip Chip Technology market. Packaging Technology, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Mosaic Technology segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Flip Chip Technology, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Flip Chip Technology market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Flip Chip Technology market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Flip Chip Technology sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Flip Chip Technology covered in this report include Samsung, Intel, Global Foundries, UMC, ASE, Amkor, STATS ChipPAC, Powertech and STMicroelectronics, etc.
The global Flip Chip Technology market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Samsung
Intel
Global Foundries
UMC
ASE
Amkor
STATS ChipPAC
Powertech
STMicroelectronics
Texas Instruments
Global Flip Chip Technology market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Flip Chip Technology market, Segment by Type:
Packaging Technology
Mosaic Technology
Other
Global Flip Chip Technology market, by Application
Consumer electronics
Telecommunication
Automotive
Industrial sector
Medical devices
Smart technologies
Military & aerospace
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Flip Chip Technology companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Index1 Market Overview of Flip Chip Technology
1.1 Flip Chip Technology Market Overview
1.1.1 Flip Chip Technology Product Scope
1.1.2 Flip Chip Technology Market Status and Outlook
1.2 Global Flip Chip Technology Market Size Overview by Region 2018 VS 2022 VS 2029
1.3 Global Flip Chip Technology Market Size by Region (2018-2029)
1.4 Global Flip Chip Technology Historic Market Size by Region (2018-2023)
1.5 Global Flip Chip Technology Market Size Forecast by Region (2024-2029)
1.6 Key Regions, Flip Chip Technology Market Size (2018-2029)
1.6.1 North America Flip Chip Technology Market Size (2018-2029)
1.6.2 Europe Flip Chip Technology Market Size (2018-2029)
1.6.3 Asia-Pacific Flip Chip Technology Market Size (2018-2029)
1.6.4 Latin America Flip Chip Technology Market Size (2018-2029)
1.6.5 Middle East & Africa Flip Chip Technology Market Size (2018-2029)
2 Flip Chip Technology Market by Type
2.1 Introduction
2.1.1 Packaging Technology
2.1.2 Mosaic Technology
2.1.3 Other
2.2 Global Flip Chip Technology Market Size by Type: 2018 VS 2022 VS 2029
2.2.1 Global Flip Chip Technology Historic Market Size by Type (2018-2023)
2.2.2 Global Flip Chip Technology Forecasted Market Size by Type (2024-2029)
2.3 Key Regions Market Size by Type
2.3.1 North America Flip Chip Technology Revenue Breakdown by Type (2018-2029)
2.3.2 Europe Flip Chip Technology Revenue Breakdown by Type (2018-2029)
2.3.3 Asia-Pacific Flip Chip Technology Revenue Breakdown by Type (2018-2029)
2.3.4 Latin America Flip Chip Technology Revenue Breakdown by Type (2018-2029)
2.3.5 Middle East and Africa Flip Chip Technology Revenue Breakdown by Type (2018-2029)
3 Flip Chip Technology Market Overview by Application
3.1 Introduction
3.1.1 Consumer electronics
3.1.2 Telecommunication
3.1.3 Automotive
3.1.4 Industrial sector
3.1.5 Medical devices
3.1.6 Smart technologies
3.1.7 Military & aerospace
3.2 Global Flip Chip Technology Market Size by Application: 2018 VS 2022 VS 2029
3.2.1 Global Flip Chip Technology Historic Market Size by Application (2018-2023)
3.2.2 Global Flip Chip Technology Forecasted Market Size by Application (2024-2029)
3.3 Key Regions Market Size by Application
3.3.1 North America Flip Chip Technology Revenue Breakdown by Application (2018-2029)
3.3.2 Europe Flip Chip Technology Revenue Breakdown by Application (2018-2029)
3.3.3 Asia-Pacific Flip Chip Technology Revenue Breakdown by Application (2018-2029)
3.3.4 Latin America Flip Chip Technology Revenue Breakdown by Application (2018-2029)
3.3.5 Middle East and Africa Flip Chip Technology Revenue Breakdown by Application (2018-2029)
4 Flip Chip Technology Competition Analysis by Players
4.1 Global Flip Chip Technology Market Size by Players (2018-2023)
4.2 Global Top Players by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Flip Chip Technology as of 2022)
4.3 Date of Key Players Enter into Flip Chip Technology Market
4.4 Global Top Players Flip Chip Technology Headquarters and Area Served
4.5 Key Players Flip Chip Technology Product Solution and Service
4.6 Competitive Status
4.6.1 Flip Chip Technology Market Concentration Rate
4.6.2 Mergers & Acquisitions, Expansion Plans
5 Company (Top Players) Profiles
5.1 Samsung
5.1.1 Samsung Profile
5.1.2 Samsung Main Business
5.1.3 Samsung Flip Chip Technology Products, Services and Solutions
5.1.4 Samsung Flip Chip Technology Revenue (US$ Million) & (2018-2023)
5.1.5 Samsung Recent Developments
5.2 Intel
5.2.1 Intel Profile
5.2.2 Intel Main Business
5.2.3 Intel Flip Chip Technology Products, Services and Solutions
5.2.4 Intel Flip Chip Technology Revenue (US$ Million) & (2018-2023)
5.2.5 Intel Recent Developments
5.3 Global Foundries
5.3.1 Global Foundries Profile
5.3.2 Global Foundries Main Business
5.3.3 Global Foundries Flip Chip Technology Products, Services and Solutions
5.3.4 Global Foundries Flip Chip Technology Revenue (US$ Million) & (2018-2023)
5.3.5 UMC Recent Developments
5.4 UMC
5.4.1 UMC Profile
5.4.2 UMC Main Business
5.4.3 UMC Flip Chip Technology Products, Services and Solutions
5.4.4 UMC Flip Chip Technology Revenue (US$ Million) & (2018-2023)
5.4.5 UMC Recent Developments
5.5 ASE
5.5.1 ASE Profile
5.5.2 ASE Main Business
5.5.3 ASE Flip Chip Technology Products, Services and Solutions
5.5.4 ASE Flip Chip Technology Revenue (US$ Million) & (2018-2023)
5.5.5 ASE Recent Developments
5.6 Amkor
5.6.1 Amkor Profile
5.6.2 Amkor Main Business
5.6.3 Amkor Flip Chip Technology Products, Services and Solutions
5.6.4 Amkor Flip Chip Technology Revenue (US$ Million) & (2018-2023)
5.6.5 Amkor Recent Developments
5.7 STATS ChipPAC
5.7.1 STATS ChipPAC Profile
5.7.2 STATS ChipPAC Main Business
5.7.3 STATS ChipPAC Flip Chip Technology Products, Services and Solutions
5.7.4 STATS ChipPAC Flip Chip Technology Revenue (US$ Million) & (2018-2023)
5.7.5 STATS ChipPAC Recent Developments
5.8 Powertech
5.8.1 Powertech Profile
5.8.2 Powertech Main Business
5.8.3 Powertech Flip Chip Technology Products, Services and Solutions
5.8.4 Powertech Flip Chip Technology Revenue (US$ Million) & (2018-2023)
5.8.5 Powertech Recent Developments
5.9 STMicroelectronics
5.9.1 STMicroelectronics Profile
5.9.2 STMicroelectronics Main Business
5.9.3 STMicroelectronics Flip Chip Technology Products, Services and Solutions
5.9.4 STMicroelectronics Flip Chip Technology Revenue (US$ Million) & (2018-2023)
5.9.5 STMicroelectronics Recent Developments
5.10 Texas Instruments
5.10.1 Texas Instruments Profile
5.10.2 Texas Instruments Main Business
5.10.3 Texas Instruments Flip Chip Technology Products, Services and Solutions
5.10.4 Texas Instruments Flip Chip Technology Revenue (US$ Million) & (2018-2023)
5.10.5 Texas Instruments Recent Developments
6 North America
6.1 North America Flip Chip Technology Market Size by Country (2018-2029)
6.2 U.S.
6.3 Canada
7 Europe
7.1 Europe Flip Chip Technology Market Size by Country (2018-2029)
7.2 Germany
7.3 France
7.4 U.K.
7.5 Italy
7.6 Russia
7.7 Nordic Countries
7.8 Rest of Europe
8 Asia-Pacific
8.1 Asia-Pacific Flip Chip Technology Market Size by Region (2018-2029)
8.2 China
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
8.6 India
8.7 Australia
8.8 Rest of Asia-Pacific
9 Latin America
9.1 Latin America Flip Chip Technology Market Size by Country (2018-2029)
9.2 Mexico
9.3 Brazil
9.4 Rest of Latin America
10 Middle East & Africa
10.1 Middle East & Africa Flip Chip Technology Market Size by Country (2018-2029)
10.2 Turkey
10.3 Saudi Arabia
10.4 UAE
10.5 Rest of Middle East & Africa
11 Flip Chip Technology Market Dynamics
11.1 Flip Chip Technology Industry Trends
11.2 Flip Chip Technology Market Drivers
11.3 Flip Chip Technology Market Challenges
11.4 Flip Chip Technology Market Restraints
12 Research Finding /Conclusion
13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer
13.4 Author List
Published By : QY Research
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