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Flip Chip Underfills-Global Market Insights and Sales Trends 2025
Synopsis
Flip Chip Underfill is an insulating material used in mounting technologies involving direct electrical connections.
The global Flip Chip Underfills market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Flip Chip Underfills in various end use industries. The expanding demands from the Industrial Electronics, Defense & Aerospace Electronics, Consumer Electronics and Automotive Electronics, are propelling Flip Chip Underfills market. Capillary Underfill Material (CUF), one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the No Flow Underfill Material (NUF) segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Flip Chip Underfills, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Flip Chip Underfills market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Flip Chip Underfills market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Flip Chip Underfills sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Flip Chip Underfills covered in this report include Henkel, NAMICS, LORD Corporation, Panacol, Won Chemical, Hitachi Chemical, Shin-Etsu Chemical, AIM Solder and Zymet, etc.
The global Flip Chip Underfills market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Henkel
NAMICS
LORD Corporation
Panacol
Won Chemical
Hitachi Chemical
Shin-Etsu Chemical
AIM Solder
Zymet
Master Bond
Bondline
Global Flip Chip Underfills market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Flip Chip Underfills market, Segment by Type:
Capillary Underfill Material (CUF)
No Flow Underfill Material (NUF)
Molded Underfill Material (MUF)
Global Flip Chip Underfills market, by Application
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics
Automotive Electronics
Medical Electronics
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Flip Chip Underfills manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Flip Chip Underfills in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Flip Chip Underfill is an insulating material used in mounting technologies involving direct electrical connections.
The global Flip Chip Underfills market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Flip Chip Underfills in various end use industries. The expanding demands from the Industrial Electronics, Defense & Aerospace Electronics, Consumer Electronics and Automotive Electronics, are propelling Flip Chip Underfills market. Capillary Underfill Material (CUF), one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the No Flow Underfill Material (NUF) segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Flip Chip Underfills, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Flip Chip Underfills market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Flip Chip Underfills market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Flip Chip Underfills sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Flip Chip Underfills covered in this report include Henkel, NAMICS, LORD Corporation, Panacol, Won Chemical, Hitachi Chemical, Shin-Etsu Chemical, AIM Solder and Zymet, etc.
The global Flip Chip Underfills market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Henkel
NAMICS
LORD Corporation
Panacol
Won Chemical
Hitachi Chemical
Shin-Etsu Chemical
AIM Solder
Zymet
Master Bond
Bondline
Global Flip Chip Underfills market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Flip Chip Underfills market, Segment by Type:
Capillary Underfill Material (CUF)
No Flow Underfill Material (NUF)
Molded Underfill Material (MUF)
Global Flip Chip Underfills market, by Application
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics
Automotive Electronics
Medical Electronics
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Flip Chip Underfills manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Flip Chip Underfills in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Flip Chip Underfills Market Overview
1.1 Flip Chip Underfills Product Overview
1.2 Flip Chip Underfills Market Segment by Type
1.2.1 Capillary Underfill Material (CUF)
1.2.2 No Flow Underfill Material (NUF)
1.2.3 Molded Underfill Material (MUF)
1.3 Global Flip Chip Underfills Market Size by Type
1.3.1 Global Flip Chip Underfills Market Size Overview by Type (2018-2029)
1.3.2 Global Flip Chip Underfills Historic Market Size Review by Type (2018-2023)
1.3.3 Global Flip Chip Underfills Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Flip Chip Underfills Sales Breakdown by Type (2018-2023)
1.4.2 Europe Flip Chip Underfills Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Flip Chip Underfills Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Flip Chip Underfills Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Flip Chip Underfills Sales Breakdown by Type (2018-2023)
2 Global Flip Chip Underfills Market Competition by Company
2.1 Global Top Players by Flip Chip Underfills Sales (2018-2023)
2.2 Global Top Players by Flip Chip Underfills Revenue (2018-2023)
2.3 Global Top Players by Flip Chip Underfills Price (2018-2023)
2.4 Global Top Manufacturers Flip Chip Underfills Manufacturing Base Distribution, Sales Area, Product Type
2.5 Flip Chip Underfills Market Competitive Situation and Trends
2.5.1 Flip Chip Underfills Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Flip Chip Underfills Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Flip Chip Underfills as of 2022)
2.7 Date of Key Manufacturers Enter into Flip Chip Underfills Market
2.8 Key Manufacturers Flip Chip Underfills Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Flip Chip Underfills Status and Outlook by Region
3.1 Global Flip Chip Underfills Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Flip Chip Underfills Historic Market Size by Region
3.2.1 Global Flip Chip Underfills Sales in Volume by Region (2018-2023)
3.2.2 Global Flip Chip Underfills Sales in Value by Region (2018-2023)
3.2.3 Global Flip Chip Underfills Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Flip Chip Underfills Forecasted Market Size by Region
3.3.1 Global Flip Chip Underfills Sales in Volume by Region (2024-2029)
3.3.2 Global Flip Chip Underfills Sales in Value by Region (2024-2029)
3.3.3 Global Flip Chip Underfills Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Flip Chip Underfills by Application
4.1 Flip Chip Underfills Market Segment by Application
4.1.1 Industrial Electronics
4.1.2 Defense & Aerospace Electronics
4.1.3 Consumer Electronics
4.1.4 Automotive Electronics
4.1.5 Medical Electronics
4.1.6 Others
4.2 Global Flip Chip Underfills Market Size by Application
4.2.1 Global Flip Chip Underfills Market Size Overview by Application (2018-2029)
4.2.2 Global Flip Chip Underfills Historic Market Size Review by Application (2018-2023)
4.2.3 Global Flip Chip Underfills Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Flip Chip Underfills Sales Breakdown by Application (2018-2023)
4.3.2 Europe Flip Chip Underfills Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Flip Chip Underfills Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Flip Chip Underfills Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Flip Chip Underfills Sales Breakdown by Application (2018-2023)
5 North America Flip Chip Underfills by Country
5.1 North America Flip Chip Underfills Historic Market Size by Country
5.1.1 North America Flip Chip Underfills Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Flip Chip Underfills Sales in Volume by Country (2018-2023)
5.1.3 North America Flip Chip Underfills Sales in Value by Country (2018-2023)
5.2 North America Flip Chip Underfills Forecasted Market Size by Country
5.2.1 North America Flip Chip Underfills Sales in Volume by Country (2024-2029)
5.2.2 North America Flip Chip Underfills Sales in Value by Country (2024-2029)
6 Europe Flip Chip Underfills by Country
6.1 Europe Flip Chip Underfills Historic Market Size by Country
6.1.1 Europe Flip Chip Underfills Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Flip Chip Underfills Sales in Volume by Country (2018-2023)
6.1.3 Europe Flip Chip Underfills Sales in Value by Country (2018-2023)
6.2 Europe Flip Chip Underfills Forecasted Market Size by Country
6.2.1 Europe Flip Chip Underfills Sales in Volume by Country (2024-2029)
6.2.2 Europe Flip Chip Underfills Sales in Value by Country (2024-2029)
7 Asia-Pacific Flip Chip Underfills by Region
7.1 Asia-Pacific Flip Chip Underfills Historic Market Size by Region
7.1.1 Asia-Pacific Flip Chip Underfills Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Flip Chip Underfills Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Flip Chip Underfills Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Flip Chip Underfills Forecasted Market Size by Region
7.2.1 Asia-Pacific Flip Chip Underfills Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Flip Chip Underfills Sales in Value by Region (2024-2029)
8 Latin America Flip Chip Underfills by Country
8.1 Latin America Flip Chip Underfills Historic Market Size by Country
8.1.1 Latin America Flip Chip Underfills Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Flip Chip Underfills Sales in Volume by Country (2018-2023)
8.1.3 Latin America Flip Chip Underfills Sales in Value by Country (2018-2023)
8.2 Latin America Flip Chip Underfills Forecasted Market Size by Country
8.2.1 Latin America Flip Chip Underfills Sales in Volume by Country (2024-2029)
8.2.2 Latin America Flip Chip Underfills Sales in Value by Country (2024-2029)
9 Middle East and Africa Flip Chip Underfills by Country
9.1 Middle East and Africa Flip Chip Underfills Historic Market Size by Country
9.1.1 Middle East and Africa Flip Chip Underfills Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Flip Chip Underfills Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Flip Chip Underfills Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Flip Chip Underfills Forecasted Market Size by Country
9.2.1 Middle East and Africa Flip Chip Underfills Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Flip Chip Underfills Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 Henkel
10.1.1 Henkel Company Information
10.1.2 Henkel Introduction and Business Overview
10.1.3 Henkel Flip Chip Underfills Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Henkel Flip Chip Underfills Products Offered
10.1.5 Henkel Recent Development
10.2 NAMICS
10.2.1 NAMICS Company Information
10.2.2 NAMICS Introduction and Business Overview
10.2.3 NAMICS Flip Chip Underfills Sales, Revenue and Gross Margin (2018-2023)
10.2.4 NAMICS Flip Chip Underfills Products Offered
10.2.5 NAMICS Recent Development
10.3 LORD Corporation
10.3.1 LORD Corporation Company Information
10.3.2 LORD Corporation Introduction and Business Overview
10.3.3 LORD Corporation Flip Chip Underfills Sales, Revenue and Gross Margin (2018-2023)
10.3.4 LORD Corporation Flip Chip Underfills Products Offered
10.3.5 LORD Corporation Recent Development
10.4 Panacol
10.4.1 Panacol Company Information
10.4.2 Panacol Introduction and Business Overview
10.4.3 Panacol Flip Chip Underfills Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Panacol Flip Chip Underfills Products Offered
10.4.5 Panacol Recent Development
10.5 Won Chemical
10.5.1 Won Chemical Company Information
10.5.2 Won Chemical Introduction and Business Overview
10.5.3 Won Chemical Flip Chip Underfills Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Won Chemical Flip Chip Underfills Products Offered
10.5.5 Won Chemical Recent Development
10.6 Hitachi Chemical
10.6.1 Hitachi Chemical Company Information
10.6.2 Hitachi Chemical Introduction and Business Overview
10.6.3 Hitachi Chemical Flip Chip Underfills Sales, Revenue and Gross Margin (2018-2023)
10.6.4 Hitachi Chemical Flip Chip Underfills Products Offered
10.6.5 Hitachi Chemical Recent Development
10.7 Shin-Etsu Chemical
10.7.1 Shin-Etsu Chemical Company Information
10.7.2 Shin-Etsu Chemical Introduction and Business Overview
10.7.3 Shin-Etsu Chemical Flip Chip Underfills Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Shin-Etsu Chemical Flip Chip Underfills Products Offered
10.7.5 Shin-Etsu Chemical Recent Development
10.8 AIM Solder
10.8.1 AIM Solder Company Information
10.8.2 AIM Solder Introduction and Business Overview
10.8.3 AIM Solder Flip Chip Underfills Sales, Revenue and Gross Margin (2018-2023)
10.8.4 AIM Solder Flip Chip Underfills Products Offered
10.8.5 AIM Solder Recent Development
10.9 Zymet
10.9.1 Zymet Company Information
10.9.2 Zymet Introduction and Business Overview
10.9.3 Zymet Flip Chip Underfills Sales, Revenue and Gross Margin (2018-2023)
10.9.4 Zymet Flip Chip Underfills Products Offered
10.9.5 Zymet Recent Development
10.10 Master Bond
10.10.1 Master Bond Company Information
10.10.2 Master Bond Introduction and Business Overview
10.10.3 Master Bond Flip Chip Underfills Sales, Revenue and Gross Margin (2018-2023)
10.10.4 Master Bond Flip Chip Underfills Products Offered
10.10.5 Master Bond Recent Development
10.11 Bondline
10.11.1 Bondline Company Information
10.11.2 Bondline Introduction and Business Overview
10.11.3 Bondline Flip Chip Underfills Sales, Revenue and Gross Margin (2018-2023)
10.11.4 Bondline Flip Chip Underfills Products Offered
10.11.5 Bondline Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Flip Chip Underfills Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Flip Chip Underfills Industrial Chain Analysis
11.4 Flip Chip Underfills Market Dynamics
11.4.1 Flip Chip Underfills Industry Trends
11.4.2 Flip Chip Underfills Market Drivers
11.4.3 Flip Chip Underfills Market Challenges
11.4.4 Flip Chip Underfills Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Flip Chip Underfills Distributors
12.3 Flip Chip Underfills Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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